Lost your password?
Not a member?
Resend confirmation instructions
Sort By Category
- New Technology
- New Products
- PCB Industry
- Signal Integrity
- Breaking News
- IPC Standards
- From The Show
PCB Carolina 2018 Draws a Crowd of Technologists
11/14/2018 | Andy Shaughnessy, Design007 Magazine
Julie Ellis: Communication and Fabrication Knowledge Critical for Designers
11/14/2018 | Andy Shaughnessy, Design007 Magazine
Max Seeley’s PCB Design Career is No Fish Story
11/14/2018 | Andy Shaughnessy, Design007 Magazine
Pulsonix Expands into North America with Version 10 Release
11/14/2018 | Tim Haag and Barry Matties, I-Connect007
Amway Sells Beauty Products—and Designs its Own PCBs
11/12/2018 | Andy Shaughnessy, Design007 Magazine
IPC Midwest Wrap Up
Does this new show have legs? Did it meet the expectations of the industry, the exhibtors and attendees? As part of the "Real Time with IPC Midwest" show coverage, EMSNow's Phil Stoten and I-Connect007's Steve Gold offer their views of this new show for the industry.
"Mr. Reliability" Werner Engelmaier, Discusses Critical Reliability Issues
Solder joint reliability is taking a backseat to problems with the printed circuit board as higher temperature lead-free processes push PCBs to their limits
UP Media Group Issues Call for Abstracts for PCB East 2008
UP Media Group Inc. has issued a call for abstracts for PCB East 2008, which will be held on May 11-16, 2008.
Mentor Graphics Accelerates FPGA / PCB Design Collaboration with New I/O Designer Product Targeted at PADS Users
Mentor Graphics Corporation, today announced the availability of the PADS I/O Designer(TM) product specifically targeted at its PADS(R) product user community.
Back to Basics - Interview: Terry Heilman, President and CEO of Sunstone Circuits
Hear Dan's interview with Terry Heilman, President and CEO of Sunstone Circuits one of the fastest growing PCB companies in the United States. Dan talks with Terry about the phenomenon that is Sunstone.
Board Designers Learn to "Design the Future"
Happy Holden, Mentor Graphics, will discuss the risks and rewards of high-density interconnections (HDI) and how to implement it within designs.
9 Trillion Solder Joints--The Occam Razor Will Cut Them Away
Occam's key advance is separating components and wiring so the placement and routing of each may be optimized independently of the many constraints imposed by the other.
Lead-free Solder and the Occam Factor
Lead-free solder percent of Global sales is 55.2% in Q2-'07, up only 1.5% from 53.7% in Q1-'07. That's reported in the new IPC Solder Quarterly Survey.
How Design Trends Have Influenced Manufacturing Economics In Handheld Diagnostic Devices
One of the largest markets for electronic medical devices is blood glucose meters. Millions of these meters are manufactured and sold every year.
Designing Robust Circuit-Board Products for Military and Aerospace Applications By Zulki Khan
Military and aerospace designs are demanding more product functionality than previous generations; consequently there is ever-more pressure on making printed-circuit-board (PCB) assemblies robust enough to comply with growing functionality.
The Gold Record: Clyde Coombs Discusses Upcoming Book Release
Industry legend Clyde Coombs, editor of The Printed Circuit Handbook, discusses this week's release of the book's sixth edition.
IPC Releases PCB Industry Results for July 2007
Rigid PCB shipments are down 7.1 percent and bookings are down 1.8 percent in July 2007 from July 2006. Year to date, rigid PCB shipments are down 10.4 percent and bookings are down 14.6 percent
Chip Packaging 2.0 - User Definable Chip Pinout Packaging For Optimized PC Board Design
Since no communications channel exists between the Chip Packaging 1.0 silicon design team and the board designer, boards are chronically constrained from being fully optimized.
Mentor Graphics Chairman and CEO to Present Keynotes at EDA Tech Forum Events in Asia
Mentor Graphics Corporation today announced that Walden C. Rhines, Chairman and CEO, will keynote at a number of EDA Tech Forum Events throughout Asia.
A New Process for Fabricating Low Cost Advanced Interconnects
Dynaco has recently developed a revolutionary new process that potentially goes much further than ink jet technologies to cost reduce traditional PCB processes for flex, rigid or rigid-flex constructions.
Endicott Interconnect Technologies, Inc. Wins Raytheon Multi-Year Production Contract
The CIP is the "brains" of the avionics system and provides a fully integrated, flexible and expandable architecture for performing communications, navigation, identification, electronic warfare, radar, and sensor fusion functions.
The Best Defense is a Good Offense
White Paper from Avnet Electronics Marketing Details How to Manage Obsolescence
Occam Process Webinar Scheduled for September 11th
"We will be unveiling some of those alternatives during this webinar, which may both enhance and accelerate delivery of the promise the Occam Process holds."
Sanmina-SCI Manufactures World's First Prototype PCB with 100 Percent Embedded ESD Protection
Sanmina-SCI and Shocking Technologies have announced the production of what is claimed to be the world's first PCB with embedded ESD protection covering 100 percent of the components on the board.
Department of Defense Awards Endicott Interconnect Technologies $19M Contract Modification
The MCM's result from the precision placement of semiconductor die, logic and prepackaged memory along with passive components on an organic substrate (produced at EI).
Tessera Introduces Next-Generation Interconnect Platform
The novel interconnection is achieved through low-profile, pin-shaped contacts which replace conventional technologies used today, such as solder balls on semiconductor packages and plated vias in package substrates and PCBs.
Planning Technology for the Future: From the Eyes of Intel
IPC and Intel Corp. have announced a technology interchange, "Where Are We Going? Where Do We Need to Be?" The one-day forum will be held May 23, 2007.
IPC Issues 2006-2007 International Technology Roadmap for Electronic Interconnections
"Unlike other roadmaps, the IPC International Technology Roadmap is the only one that exclusively focuses on the printed circuit board and electronics assembly industries."
Pitfalls to Avoid When Designing with Flex
When you consider the design objectives of modern medical electronics, there is tremendous synergy with the capabilities and advantages of flex circuits.
CCA Golf Tournament Highlights: Exclusive Video
Did you think golf was a serious game? Our industry proves how much fun it can be in front of our PCB007 cameras. Make sure you watch some embarassing outakes at the end of one of our industry's funniest videos.
Can Microelectronics Save PCB Fabrication in the Western World?
Tarzwell asserts that other fabricators need to follow suit or they will be left behind in a shift from standard PCB production to sub-two-mil lines and spaces.
Interview: Dr. Frank Bai Discusses PCB Trends in China
The Taiwan Printed Circuit Association Technical Director talks about some of the trends he's been observing in the Chinese PCB market.
Randy Holt Inducted into the PCB Top Gun Hall of Fame at PCB West 2007
There were five entries into the PCB Top Gun Hall of Fame contest. Holt was announced as the winner after an intense two-day competition that began Sunday, March 24.
Mentor Graphics Announces Winners of its 19th Annual PCB Technology Leadership Awards
The longest running competition of its kind for PCB designers in the EDA industry, this year the program attracted a record number of submissions from countries around the world, including Germany, Switzerland, China, Norway, Singapore, Austria, Canada, Korea, India, Israel, Portugal and the United Kingdom.
Interview: Dr. Nakahara Discusses China PCB Capacity and Technology
"Naka" offers his perspective on the capacity buildup in China: Is this a ticking time bomb or simply a misunderstanding of the market?
High-resolution Circuit Layouts on Complex Three-dimensional Carrier Structures
With LPKF's Laser Direct Structuring process (LDS) it is possible to produce high-resolution circuit layouts on complex three-dimensional carrier structures, thus integrating casings and PCBs within one unit that previously were separate.
A Discussion of the Chinese Specialty Laminates Market from the CPCA Show
Representatives from Arlon and DuPont sit down at the CPCA show in Shanghai this week and talk to PCB007's Steve Gold about the demand for high-tech materials in China.(Video Interview)
CPCA Show 2007 Takes Off
The sixteenth annual CPCA Show is being held for the first time at the Pudong New International Expo Center, this week, from March 21-23, 2007. It will be held in conjunction with three other Electronics Shows: Electronica & Productronica China, Semicon China and Laser World of Photonics China.
Interview: CPCA President Wang Long Ji
The CPCA president talks about Chinese PCB industry capacity, the need for technology and their efforts to help transform the industry into a global powerhouse.
Embedded Passive Materials: Ohmega Ply and Farad Flex
The combining of these two different products has had a synergistic effect. John Andresakis and Bruce Mahler discuss some of the properties discovered as a result of unique product partnership.
IPC Honors Best Papers at IPC Expo, APEX
"Use of EDXRF for RoHS Compliance Screening in PCBA Manufacturing" by Jasbir Bath, Pan Wei Chih, Saludsod Hamlet Jr., Roger Jay and Tzu-Chein Chou, all of Solectron Corporation, received the Best U.S. Paper Award.
iNemi Introduces its Latest Technology Roadmap Effort
iNemi CEO Jim McElroy talks about some of the highligts of this lastest Roadmapping effort during an interview at IPC Apex Show in Los Angeles.
Interview: Industry Icon Happy Holden
Happy Holden discusses his long career in the printed circuit board industry, shares some memories and talks about some of the issues facing the industry, today.
Sunstone Circuits' Internet-based Sales and Marketing Strategies are Paying Off, Big Time
Sunstone CEO, Terry Heilman, talks about his company's Internet-based marketing and sales strategies and how this has completely transformed the way the company does business.
Bending, Forming and Flexing Printed Circuits
This article addresses the bending, forming and flexing circuits built with non-glass woven circuit materials.
Mike Freda, Sun Microsystems: Future Product Reliability Strategies
Bob Neves, President of Microtek Labs interviews Sun's packaging specialist about what Sun is doing to ensure reliability for their next generation products.
European PCB Leaders Meet in Salzburg for EIPC Winter Conference
A review of the European Institute of Printed Circuits' Winter Conference in Salzburg, Austria.
Interview With Voya Markovich, CTO Endicott Interconnect Technologies
EI's Chief Technology Officer talks about his company's efforts to develop the next generation of PCB and electronics packaging technologies in this exclusive interview.
Stablcor Moves Into the Market: Doug Tullio Talks About the Company's Progress
Although the product fits well with today's applications, the next phase of electronic products will require permanent solutions for CTE.
Exclusive Interview With DDI's Raj Kumar, VP Product Development
Kumar describes the company's approach to new product development and takes a look into the future of the printed circuit board.
Brad Bourne, CEO FTG, Discusses His Company's Focused Business Strategy
This North American PCB fabricator has successfully carved out a niche in the Aerospace market and continues to refine its product offering.
Exclusive Interview With Coretec CEO Paul Langston
Langston talks about his company's push into the rigid-flex market and its Toronto expansion.
Custer's Market Outlook Presented at IPC Expo, Apex
Market forecaster, Walt Custer, presented his latest prognostications at IPC Expo, Apex.
PCB West 2007 Announces the "FREE Tuesday" Event Lineup
UP Media Group Inc. is pleased to announce this year's "FREE Tuesday" program of events at PCB Design Conference West 2007.
New IPC Board Members Nominated
The Nominating and Governance Committee of the IPC Board of Directors will present five candidates for election at the IPC Annual Meeting.
IPC and iNEMI Sponsor Reliability Summit in Conjunction with IPC Printed Circuits Expo, APEX and the Designers Summit
Discussions to focus on reliability testing protocols
I-Connect007, EMS007, PCB007 Announce An Exclusive "Real-Time with IPC" Interview: Astronaut Buzz Aldrin
"As you can imagine, we are quite excited about this opportunity. It's not everyday you get a chance to speak with an American legend," said I-Connect007 Publisher Steve Gold. "We are honored that he accepted our invitation."
Mentor Graphics' Topology Router Technology Wins Product of the Year Award
"Mentor's topology router technology significantly decreases design cycle time, increases designer productivity and quality of the board, and optimizes performance."
Sanmina to Close Karlsruhe PCB Operations
In a letter to customers, the company stated they are closing the facility "due to adverse trading conditions on the European market."
IPC and CPCA Announce IPC-4101 Lead Free and High Performance Base Materials (CCL) Conference
Tuesday March 20, 2007 Shanghai Everbright Convention and Exhibition International Hotel Shanghai, China
DesignCon 2007 Conference and Exhibition Hosts Thousands of Design Engineers, Award-winning Products and Industry Leaders in Santa Clara
The exhibition featured product announcements, Hot Technologies and pavilions that focused on PCB technology, design verification, and semiconductor and IP technology.
Bleeding Edge: A New Thermal Printed Circuit Technology: Thermal Plane
On some designs, the drill loss is a significant amount of copper or aluminum volume. As the drill-out area increases, the number of possible shorts from stringers increases.
IPC's Jean Hebeisen Discusses Professional Development Courses, Designers Summit
A look at what courses IPC is offering in L.A. and what the Designers
Sanmina-SCI to Demonstrate a High-Speed Backplane Capable of 12.5 Gbps Data Transmission Rates at DesignCon 2007
"For DesignCon 2007, we plan on introducing some novel methods for improving signal integrity performance of high-speed serial data links operating at data rates in excess of 6.125 Gbps."
Development of Multilayer Flex Substrates Using Liquid Crystal Polymer Film
A look at manufacturing highly dense, reliable flex substrates with LCP material. Read on for a summary and link to complete PDF article...
System-In-Package Tools Lacking, Users Say
"SiP represents the convergence of IC, package, and PCB design, and all these things need to be integrated together,"
IPC Releases New Book-to-Bill Ratios and IMS/PCB Business Report for December 2006
The North American rigid PCB industry book-to-bill ratio for December 2006 held steady at 0.92. The North American flexible circuit book-to-bill ratio edged up to 0.90.
Mentor Graphics' Henry Potts to Deliver PCB West 2007 Keynote Address
Industry trends, technology to be covered in Potts' address, Cross Currents: Where PCB Design Meets ICs and Hardware.
A Reader Survey Reveals 2007 Will Be the Year Microvias and Embedded Passives Make Their Mark
What bare board technologies are expected to gain ground during the next 12 to 18 months?
Prominent Electronics Manufacturers Commit Support of IPC Midwest Conference & Exhibition
Leading companies that have confirmed their participation in the event include Assembleon America; DDi; Fuji America Corporation; Juki Automation Systems; Panasonic Factory Solutions Company of America; Speedline Technologies, Inc. and SPEA America.
CES 2007 Day 2: Dan's Diary
Greetings all. Day Two at CES was an absolute zoo. I spent the day at the <?xml:namespace prefix = st1 ns = "urn:schemas-microsoft-com:office:smarttags" />Las VegasConvention center. I had morning appointments at Asus and nVIDIA and my intention was to then walk the floor and try to talk with various people at Microsoft, Intel and AMD/ATI.<?xml:namespace prefix = o ns = "urn:schemas-microsoft-com:office:office" />
PCB007 Launches 'Voice of the Industry' Forum
PCB007 creates a user forum where the industry can get its questions answered quickly.
Embedded Resistance and Capacitance in One PCB Material: A PCB007 Exclusive Audio Interview with Patent Holders John Andresakis and Bruce Mahler
Oak Mitsui and Ohmega Technologies have just been granted a brand new patent that could give embedded materials users exactly what they've been wishing for--a lower cost embedded resistance/capacitance solution.
Microsoft's Gates Opens CES 2007
Bill Gates gives a Sunday night speech that touts Microsoft's new Vista software--and what that means to hardware providers.
Advanced Packaging Technologies and Future Trends
Understanding the basics of IC packaging - how they are constructed, what drives cost and what limits performance - is critical to the successful product design.
Mentor Confirms ESL Buy with SpiraTech
Boosting its electronic system level (ESL) portfolio, Mentor Graphics Corp. has confirmed reports that it has purchased SpiraTech Ltd., but has declined to release any further details.
Changes of Emphasis Revealed at Printed Electronics USA 2006
A December conference in Phoenix shows that printed electronics is coming. The question is: how soon will it arrive?
Matsushita Sets Up Multilayer PCB Material Company in Suzhou
This plant will be the 18th manufacturing subsidiary of MEW (and the second laminate manufacturing base following the one in Guangzhou) in China.
Challenges of Heat Removal from Flex Circuit Technology
This article explores the traditional methods and design options available to manage the thermal load on whatever flexible circuit materials are selected. It also explores the thermal problem of flex circuits with point heat sources.
CADParts & Consulting Appoints Raymond Smith CID as VP Technical Design
CADParts & Consulting LLC has announced the appointment of Raymond F. Smith, CID as its new VP of Technical Design.
Industry Printed Circuit Board Manufacturing Expert Joins Mentor Graphics as Senior Technologist
Happy Holden, formerly of Westwood Associates, has joined Mentor Graphics Systems Design Division, located in Longmont, CO as senior technologist.
Technology, High Speed and Living Without Lead
The comprehensive program ensures designers get the tools and information they need to stay competitive, innovative and in demand.
IPC Releases New Book-to-Bill Ratios and IMS/PCB Business Report for October 2006
The North American rigid PCB industry book-to-bill ratio for October 2006 decreased to 0.99.
Ottawa's Fidus Reaps Best-ever Third-quarter Revenues
Fidus Systems reports a 33 percent increase in third-quarter revenues, over the same period last year.
Need-to-Know Imperative Permeates Technical Conference Sessions at IPC Expo, Apex
Tin whiskers, materials and regulatory issues, assembly reliability and embedded passives are just a handful of the critical topics that will take main stage
Back to the Future: Endicott Interconnect Technologies Uses Vertical Integration, High-Tech Capabilities to Return to Profitability
An exclusive PCB007 video interview with Endicott Interconnect Technologies President and CEO Jay McNamara reveals how the company reversed its fortunes and returned to profitability by capitalizing on its vertical integration, investing in high-technology infrastructure and attacking new end markets.
Flexible Circuit Technology, 3rd Edition: Over 3000 Downloads in 60 Days!
Flexible Circuit Technology has set a new standard for niche book distribution, making this exciting technology available to all in the industry.
World Electronic Circuits Council Issues Seminal Report on Global PCB Production
"This effort took nearly two years to bring to fruition, but we overcame the hurdles and are now able to move forward with a new and extremely valuable source of global PCB statistics for our members."
Defect Clinic Solves Mysteries at IPC Printed Circuits Expo, APEX and the Designers Summit 2007
Sherlock Holmes may have been a savvy English gent, but his compatriot Bob Willis, Electronic Presentation Services, clinic coordinator, has the edge when it comes to the electronics industry.
Conductive Ink Technologies for Digital Printing of Flexible Circuitry
Digital printing of conductive materials allows a flexible method of production of flex and rigid PCBs without the necessity to provide expensive tooling beforehand.
Mentor Graphics Strengthens ESL Offering with Acquisition
Mentor Graphics Corporation today announced that it has completed an acquisition of Summit Design, a leader in ESL (Electronic System Level) design solutions.
A Tale of Three Innovative Interconnection Companies and Their Impact on Printed Circuits
There is no Moore's Law for Interconnection, multiplying density every year.
Smaller, Faster, Better, Cheaper: Trends in Electronics Manufacturing
This event brings together OEMs, EMS providers, PCB manufacturers and suppliers for a one-of -a kind gathering of decision makers.
Kingston to Continue Evaluating PCBs with Embedded Resistors
While some industry experts believe that PCBs with embedded resistors may save about one third of DRAM-module assembly time, Kingston considers the technology still more risky compared to the traditional way of mounting resistors on a PCB on an SMT line.
UK Electronic Design Company's Name In Lights
The unit comprised of, a back plane PCB, control board PCB, driver board PCB and LED boards which were placed within the road studs.
IPC Releases New Book-to-Bill Ratios and IMS/PCB Business Report for August 2006
Rigid PCB shipments are up 8.0 percent and bookings are up 7.7 percent in August 2006 from August 2005.
Valor Announces vShare-a New DFM Collaboration Solution for Electronics Designers and Manufacturers
vShare provides a centralized, scalable platform with secure access to important design information and DFM issues that form part of the product development process.
SiliconPipe Announces New Interconnector Design Tool
"Interconnector tool is unique among design tools. It offers system and silicon architects the ability to analyze chip-to-chip interconnections early in the design phase rather than making multiple passes using signal integrity tools with final chips and initial PCBs."
Flexible Circuit Technology: Completely Updated Third Edition Released; Download Available Now at No Cost
"It's been eight years since the second edition was published", said Fjelstad, "and much has changed since the last edition, and the rate of change has been impressive, making this edition well past due."
IPC Releases New Book-to-Bill Ratios and IMS/PCB Business Report for July 2006
The North American rigid PCB industry book-to-bill ratio for July 2006 remained positive at 1.02
Ansoft Corporation Earnings Nearly Double; Revenue Increases 17%
"For the next fiscal quarter, we anticipate continued revenue growth of around 10-15%."
Integrated Performance Systems Announces Expanded and Improved PCB Design and Manufacturing Capabilities
"This improved and enhanced service offering is further evidence of our commitment to providing our customers with a unique suite of supply chain services and solutions."
PCB Design Survey Finds Conflict Between Thermal, SI/EMC
Fifty-nine percent of respondents agreed that thermal, signal integrity and EMC requirements are usually in conflict in PCB design
DesignAdvance Names Edward Pupa as CEO
DesignAdvance(TM) Systems, Inc., a leading developer of innovative design automation software for users of EDA and MCAD tools, announced today the appointment of Edward Pupa as its new chief executive officer
Managing PCB Signal Quality
Driven by advances in lithography, IC switching speeds continue their progressively-faster march.
Leaving Behind Old Trends in Board Design to Beat Interference
The old concept to use alarge' capacitors for low frequencies and asmall' capacitors for high frequencies is therefore not necessarily correct and successful.
Interview With Frank Frank, Accelerated Designs Inc
Frank talks about Ultra Librarian, a universal component management tool supporting over a half million components.
DesignAdvance Enters China PCB Design Market
DesignAdvance appointed Shenzhen EDA Technologies Co. Ltd as a distribution partner in its aim to enter China's PCB design industry
IPCWorks 2006 Highlights Lead Free Implementation, Reliability and Eco-Compliance
This year, the event, featuring technical conference sessions, professional development workshops, the designer's certification program, standards development meetings, and free roundtables and forums will take place September 7 - 14
Stepping Up to Challenges in FR4 Microcircuit Imaging Technologies
We found a physical optical limit using our standard, noncollimated, 356nm light-imaging source, the 7mil photo tool and 1.5mil dry film. At about 1.7 mils (42.5 microns) of space, the straight lines start to form wavy lines
Glenn Wells New Chairman of IPC Designers Council Executive Board
He is one of Printed Circuit Design and Manufacture Magazine's Top Gun winners, an IPC Certified Master Instructor, and an internationally known lecturer and instructor on printed circuit design topics
Comtech Group CDMA Business with Huawei Grew by 50% Year-on-Year
Comtech is responsible for providing various customized module design solutions for both CDMA 1X/EV-DO infrastructure equipment and mobile handsets to Huawei
EDA Consortium Reports 10% Revenue Growth in First Quarter 2006
Printed Circuit Board and Multi-Chip Module revenue decreased 4% in Q1 2006 to $84 million
Minco Helps Engineers Meet Industry Need for Smaller, Thinner & Lighter Components With New Instructional Flex Circuit Design Kit
Minco is responding to OEM design engineers' need to understand how the dynamic nature of flex circuit technology allows for a multitude of design options.
Mentor Graphics Announces User2User 2006 Best Paper Award Winners
User2User 2006 was held May 2 through May 5, 2006, in San Jose, California, and was attended by approximately 500 Mentor customers from 12 countries.
Nanotech Finds a Home in Memory
Honolulu -- With memory bits set to take up the vast majority of tomorrow's system-on-chip solutions, new forms of memory technology will be needed to keep power consumption under control, according to Yoshio Nishi, director of the Center for Integrated Systems at Stanford University.
Nano World: Advanced Circuits
An international team of university and industry scientists has discovered a way to improve nanoparticles used to make advanced circuits. These findings could help improve the reliable large-scale manufacture of high quality chips, experts told UPI's Nano World.
Dan Beaulieu Interviews Bill Loving of ScanCAD International
ScanCAD's unique strategy of utilizing commercially available, high resolution, flat bed scanners versus custom made, expensive, high maintenance imaging systems has consistently set new price-performance thresholds in the electronics industry
White Paper: FAB Notes Recommendations for RoHS-Compliant Lead-Free-Capable PCBs
Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality
Free Webinar: Taking PCB Documentation out of the Stone Age with BluePrint-PCB
Still Doing PCB Documentation Like you Live in the Stone Age? Learn How to Revolutionize It... Using BluePrint for Printed Circuit Boards!!!
Mentor Graphics Platform Express is the First Platform-Based Design Solution to Support The SPIRIT Consortium's New Specification
Mentor Graphics Corporation today announced support for The SPIRIT Consortium's new 1.2 XML specification in the newest release of the Platform Express(TM) product.
IPC Releases New Book-to-Bill Ratios and IMS/PCB Business Report for March 2006
The North American rigid PCB industry book-to-bill ratio for March 2006 remained strong at 1.14, but the North American flexible circuit book-to-bill ratio dipped to 0.94
PCB West Exhibition Kicks Off This Week
The 15th anniversary PCB Design Conference West, scheduled for March 26-31 at the Santa Clara (CA) Convention Center, will feature more than 45 exhibitors of printed circuit board design products and fabrication services
Zuken and PCB Libraries Inc., Launch CADSTAR IPC Land Pattern Wizard
Zuken has launched the CADSTAR compatible land pattern generator; IPC-7351A LP Wizard for CADSTAR
Electronic Interconnection Files No. 7 - Whither the Future of the Electronic Interconnections?
Given this strong sentiment in favor of optoelectronics by some industry pundits, the question is begged: What is the future of electronic interconnections?
Electronic Interconnection Files - Number 6 -- Breaking the Memory Bottleneck
Moreover, it appears that data rates up to 12.8 Gbps/pin are possible for first-generation double-data-rate (DDR) SDRAMs
PCB007 Exclusive Interview with IPC President Denny McGuirk
What is the IPC doing today, where's it headed and what will the US industry look like in five years? These and other questions were addressed in this exclusive interview
Sanmina President and COO, Randy Furr Resigns
"I would like to personally thank the Sanmina-SCI employees and industry friends for their years of support in helping the Company grow from approximately $60 million annually to a $12 billion leader
The Board Authority Live Examines the Impact of Green Technologies
This is the first international conference series, addressing the greening of the PCB industry
Step 1: Design for Manufacture
The advantage of parallel design architecture is that it lets multiple designers work on the same design simultaneously without needing to partition the design.
Light Reading: Thoughts on Attending Conferences
Columnist Ron Schaeffer offers his thoughts on one of his favorite occupational roles: conference attendee.
Video: An Interview with John Isaac of Mentor Graphics
Video Interview: At DesignCon 2008, Andy Shaughnessy sat down with John Isaac, the director of systems market development for Mentor Graphics. John discusses the company's plans for its PCB design software tools in 2008.
Press Release Tips
Copyright © 2018 I-Connect007. All rights reserved.