Article Highlights
Mentor and Z-zero Collaborate on New Stackup Tool
09/17/2020 | Andy Shaughnessy, Design007 Magazine
I-007eBook Review: Thermal Management From a Fabricator’s Perspective
09/15/2020 | Dan Beaulieu, D.B. Management Group
American Standard Circuits’ New Book Covers Thermal Management From a Fabricator’s Perspective
09/10/2020 | Dan Beaulieu, D.B. Management Group
This Month in Design007 Magazine: Thermal Fundamentals With Mike Jouppi
09/09/2020 | I-Connect007 Editorial Team
The Role of EDA Tools in Creating Fab Notes
09/08/2020 | Pat McGoff, Mentor

Latest Articles

Insulectro Hosts Silicon Valley Designers Council Meeting

On October 15, about 25 people gathered for the IPC Designers Council Silicon Valley Chapter meeting at Insulectro's Mountain View facility. Carl Schattke, senior PCB design engineer at Tesla, was the main speaker. His presentation covered a variety of facets of PCB design, from shadowing to the location of component based on weight and surface finishes.

The Shaughnessy Report: Squeezing Seconds Out of the Design Cycle

When you’re designing a board, time is always your enemy. That’s what we learned when we surveyed our readers recently. PCB designers said that time pressure was one of their least favorite parts of the job, and in some cases, they were ready to retire just to avoid design cycle challenges. I imagine that many of you near retirement, and that’s quite a few of you, feel the same way.

The Challenges of Being Competitive in Automotive Electronics Manufacturing

Simple electronics were gradually introduced into automobiles from the earliest times. At first, these were just simple electro-mechanical devices to make cars work without manual effort, such as to start the engine and keep windshields clear. But in this past decade, we have seen the effects of the gradual growth of issues with electronics systems, with recalls caused by safety issues that cost automotive manufacturers millions of dollars. Electronics within an automotive environment today requires a new approach to ensure a higher level of quality perfection.

Top Gear: PADS Professional Road Test

In this column, Barry Olney test drives the newest version of the Mentor Graphics PADS Professional EDA tool. "Based on Xpedition technology, PADS Professional is a major improvement over the previous PADS suite of tools. utilizes xDX Designer as the front-end design entry tool. The latest routing technology is fast, smooth to drive, and hugs the corners well, with all the horsepower you need for the most demanding design."

The Shaughnessy Report: Car Talk

The automotive electronics segment has exploded. Early cars didn’t have much in the way of electronics. Even in 1950, electronics made up only 1% of a car’s cost. But that figure is expected to hit 35% in 2020, and 50% in 2030. The global automotive electronics market is forecast to hit $314.4 billion by 2020, and that means a whole lot of PCBs.

Leo Lambert on EPTAC's Customized Training Plans

Andy Shaughnessy interviewed Leo Lambert, vice president and technical director of EPTAC, at SMTA International. Leo Lambert, vice president and technical director of EPTAC, explains how the New Hampshire-based company continues to provide customized training and IPC certification offerings, including its IPC Certified Interconnect Designer (CID) and CID+ classes.

The Gerber Guide, Chapter 2

Never mirror or flip layers! All layers must be viewed from the top of the PCB, which means that the text must be readable on the top layer and mirrored on the bottom layer. Alas, sometimes, in a mistaken attempt to be helpful, designers flip layers because they must anyway be mirrored on the photoplotter. This could be helpful in a world where the designer's files are used directly in fabrication, but these data layers are actually input for the CAM system.

Physics of Failure Durability Simulations for Automotive Electronics

Automotive electronics systems are becoming increasing complex and essential for the proper, safe operation of cars and trucks. Vehicle controls for basic operation and safety functions are increasingly being implemented by electronic modules. The ability of these electronic systems to function reliably is becoming a greater aspect of vehicle safety as was dramatically demonstrated by the 2009–2011 recall of over 9 million Toyota vehicles for unintended acceleration issues.

Jack Pattie Discusses New Ventec Facility

Jack Pattie, CEO of Ventec USA, discusses the company's newest laminate facility, which recently opened in Northern California. He explains how this location, the company's fourth, will help Ventec better serve customers in that region.

Automotive Systems Design: a Support Engineer’s Perspective

In a nutshell, the promise of the system design approach is to allow for hitting the “sweet spot” in terms of functionality, quality and reliability, in the shortest possible design time and with the lowest possible resource investments. In an industry that has a very long time to market (on average around 1,000 days), steadily increasing quality demands and an ever intensifying pressure to lower costs, all these promises become most attractive and compelling.


The Reindustrialisation of Europe

With an inquisitive mind and a head for challenges, besides the ability to think outside the box and the courage to dare to be different and strive to be first, Spirit Circuits MD Steve Driver can be relied upon to grab the attention of an audience of PCB professionals. As keynote speaker at the Institute of Circuit Technology Hayling Island Seminar, he lived up to his reputation with a motivational presentation, the two themes of which exemplified his latest entrepreneurial venture.

Mentor Graphics Helps Bridge Gap Between PCB and RF

Recently, Publisher Barry Matties met with Per Viklund, the director of IC packaging and RF product lines at Mentor Graphics, and Alex Caravajal, business development manager with Mentor. They discussed the challenges facing PCB designers working with RF and microwave technology, and Mentor’s efforts to help reduce the RF design cycle time.

Failure May Not Be an Option, but Sometimes It's a Reality

I’ve had mechanical engineers question why we are bothering with circuit boards instead of designing the circuitry into the plastic housing of the device. I’ve had manufacturing engineers demand that I shelve the electrical considerations in order to meet manufacturing requirements, and electrical engineers who could care less if the product could actually be built. I’ve had engineers hover over my shoulder watching each and every stroke of the mouse that I make, and others who are never available for important questions which ultimately brought the whole project to a grinding halt.

Car Talk

The automotive electronics segment has exploded. Early cars didn’t have much in the way of electronics. Even in 1950, electronics made up only 1% of a car’s cost. But that figure is expected to hit 35% in 2020, and 50% in 2030--and that means a whole lot of PCBs. This issue of The PCB Design Magazine features the impact of increasing electronics content in cars on the PCB design and manufacturing industry.

Failure Mode: Hole Wall Pullaway

This column is based on my experience in test reliability of interconnect stress test (IST) coupons. I am addressing HWPA that features moderate to severe outgassing. There may be HWPA due to thermal stressing of the board without any significant outgassing, but this type of HWPA is subtle, and it presents as a dark line between the plating and the dielectric of the hole wall. This type of HWPA is rarely detected.

Material Witness: Using Scaled Flow Data

Resin systems whose density is not very near 1.35 do not quite fit into the official IPC test method because all the stack weight data used assumes epoxy resin of a standard 1.35 density. Any resin whose density varies from that value requires a new set of calculated weights for various stack-ups in order to provide precise data. This is especially true of filled systems whose resin density now includes a ceramic component as well as the organic resins themselves and may have densities higher than standard.

Beyond Design: Stackup Planning, Part 3

Following on from the first Stackup Planning columns, this month’s Part 3 will look at higher layer-count stackups. The four- and six-layer configurations are not the best choice for high-speed design. In particular, each signal layer should be adjacent to, and closely coupled to, an uninterrupted reference plane, which creates a clear return path and eliminates broadside crosstalk. As the layer count increases, these rules become easier to implement but decisions regarding return current paths become more challenging.

Kelly Dack and Mark Thompson Unite in the War on Failure

There’s been a lot of talk about fighting the war on failure in the PCB industry. But what strategies should our generals follow to prosecute this war? What exactly constitutes a failure in the first place? Is this war even winnable? I recently spoke with longtime designer Kelly Dack and CAM support veteran Mark Thompson of Prototron Circuits about the best battle plans for beating failure, and why designers and manufacturers must team up against this common enemy.

Training the Next-Generation Engineer: When Does it Begin and End?

American engineering companies are seeing a severe shortage of the homegrown engineers required to compete globally. Just go into any company today and you’ll notice that increasingly, the engineers are foreign-born. Our local universities are seeing fewer and fewer American engineering students each year. Universities are also seeing a growth in female students. Over 50% of college student are now female, and women traditionally are not attracted to science and engineering majors. What is causing this imbalance?

Karel Tavernier: The Gerber Guide

It is possible to fabricate PCBs from the fabrication data sets currently being used—it's being done innumerable times every day. But is it being done in an efficient, reliable, automated and standardized manner? At this moment in time, the honest answer is no, because there is plenty of room for improvement in the way in which PCB fabrication data is currently transferred from design to fabrication.


Nick Barbin: From Designer to EMS Company Owner

Many PCB designers would rather do just about anything than pore over a P&L spreadsheet. But Nick Barbin isn’t a typical designer. He co-founded the design bureau Optimum Design Associates over two decades ago, and the company later expanded into contract manufacturing and Lean processes. In this interview, Nick discussed how he wound up leading an EMS company on the Inc. 5000 list.

Supply Chain Challenges and Opportunities

Let’s start by defining exactly what a supply chain is. It’s not a nautical term for an anchor chain, or a dynamic part of a chainsaw that never runs out of chain. No, it’s a key term used in the organization of resources which may form a system between entities. Now this sounds a little closer to something that may be utilized in producing an electronic end-item, in our case, a printed circuit board.

Fighting the War on Failure

No one in this industry sets out to fail, except failure analysis test engineers. But failure is a part of life for designers and manufacturers of electronics. Our reader surveys show that failure affects nearly everyone in the PCB industry: designers, fabricators, assembly providers, OEMs, and suppliers.

Gary Ferrari Shares His Thoughts on PCB Design and More

Recently, I spoke with Gary Ferrari, director of technical support at Firan Technology Group, about numerous topics related to PCB design. Our conversation ranged from CID training to the need for reaching high school students as a way of introducing more young people to career opportunities in our industry. We also covered strategies for helping customers design and build better product, and keeping designers provided with the most critical part of their supply chain—information.

Ten Considerations for Outsourcing PCB Designs

Outsourcing your design work is a big deal. How do you know that the end-result will be as you envisaged? Will you have full control of your design? Will it be done to the quality you expect and within the time frame required? Outsourcing can pose some fairly scary questions, so what are the key things to consider and what are the pitfalls to avoid? Steve Dobson of Quadra Solutions explains.

Material Witness: The Use of Fillers in Composites

The use of finely divided ceramic fillers in composites intended for use in printed wiring boards has a long history, but most people still associate the idea with reducing the cost of the product by loading it with an inexpensive inert filler. Nothing could be further from the truth...

Design and Manufacture of High-Voltage Electronics

This SMART Group webinar, presented by Ian Lake, director of engineering at Applied Kilovolts Ltd, and moderated by Bob Willis, explored the current technical barriers faced in high-voltage electronics design and manufacturing processes. Although he made it clear that within the timeframe of a webinar session he could only scratch the surface of the topic, Lake gave a valuable insight into basic concepts and drivers and set a perspective on current state of the art and future trends.

Strategies for Improving PCB Procurement

The PCB procurement process has certainly changed over the years. Some people are happy buying a board from a website, but for others the demands are different. Russ Adams should know; he’s the sales manager for Prototron Circuits, a PCB fabricator that has been in business for nearly 30 years, with facilities in Redmond, Washington, and Tucson, Arizona. I recently met up with Adams to discuss customers’ evolving requirements, along with his ideas for lowering the total procurement cost.

IPC-A-610: What's New With Rev F?

Why are new revisions created anyway? Can’t IPC just issue updates to the existing revision? Who defines what the changes are going to be and who approves of those changes? Why can’t they make changes for all the new technologies available? And the best question of all: Why does my product have some conditions that are not covered in the documents and specifications? Leo Lambert explains.

Fast Interconnect: Engineering Services for the Masses

Gary Griffin and Ana Rosique are co-founders of Fast Interconnect, an Arizona-based product engineering company designed to serve an underserved market: the small product developers, inventors, and anyone with an idea for a “cool gadget.” I caught up with Griffin recently to discuss the new company, its innovative business model, and the challenges facing smaller OEMs and product developers.


Changing the Face of Displays…One Button at a Time

Michael Detarando, president and CEO of Incom, and Emilijo Mihatov, business development manager at Fairlight discuss with I-Connect007's Barry Matties how Fairlight is incorporating Incom's technology into their famous products for the recording and broadcast industries, along with other applications such as elevator control panels.

Max Maxfield Looks at the Future of Electronics

Clive “Max” Maxfield has worked for decades in this industry, and in a variety of capacities: Engineer, author, editor, columnist, blogger, and keynote speaker, just to name a few. I caught up with my former columnist recently and asked him what he’d been doing to stay out of trouble, and what sort of technology and futuristic electronic gadgets were piquing his interest right now.

Avoid Overbuilding your RF Printed Circuit Board

Today, many companies are overbuilding and “overmaterializing” their RF printed circuit boards. In this interview, James Hofer of Accurate Circuit Engineering (ACE) shares some strategies to avoid doing both, which will help lower the total cost of your PCB and improve the overall product quality. Hofer also discusses some of the challenges in the laminate supply chain.

Rigid-Flex PCB Right the First Time--Without Paper Dolls

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.

The Past, Present, and Future of IPC-A-610

To understand the ultimate power of IPC-A-610, you need to first understand what is at the core of this standard. IPC-A-610 is a collection of visual quality acceptability requirements for electronic assemblies. It is utilized as a post-assembly acceptance standard to ensure that electronic assemblies meet acceptance requirements.

EIPC Summer Conference: Day 2

Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.

TTM: Consult Fabricators Early for PCB Designs

Recently, I attended the Designers Council “Lunch and Learn” at Broadcom’s office in Orange County, California. One of the speakers at this event was Julie Ellis, a field applications engineer with TTM Technologies. She sat down with me to discuss her presentation and some of the ways fabricators can assist PCB designers.

EIPC Summer Conference, Berlin: Day 1

Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.

Kelly Dack Discusses His Recent Move

Dan Beaulieu has known the Prototron staff for years, and worked with them for a number of years as well. So, when he heard that they had hired Kelly Dack, a longtime PCB designer and guest editor for PCBDesign007, Dan wasted no time meeting with Kelly to talk about his new position, the future of PCB design, and the nascent interest millennials are showing in the PCB industry.

Cannonball Stack for Conductor Roughness Modeling

In the GB/s regime, accurate modeling of conductor losses is a precursor to successful high-speed serial link designs. Failure to model roughness effects can ruin your day. The cannonball stack is an example of a cubic close-packing of equal spheres, and is the basis of modeling the surface roughness of a conductor in this article. So, what do cannonballs have to do with modeling copper roughness anyway? Bert Simonovich explains.


A Review of the Opportunities and Processes for Printed Electronics (Part 1)

As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection are opening up new opportunities for "innovative" interconnects. In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.

Electronic Design Training Crucial to Industry Growth

In the UK, the electronics industry contributes over £80 billion (approximately US$120 million) to the economy, representing 5.4% of UK GDP, employing over 850,000 people. There is, however, in many countries, a growing concern around labour shortages within the electronics industry, with worries over appropriate workforce skill levels growing.

The Composite Properties of Rigid vs. Multilayer PCBs

Most materials systems used in PWBs (aka PCBs) are composites of resins, fabric substrates and metal cladding. Each of these components has its own unique electrical and mechanical properties that contribute to the final characteristics of the finished laminates, prepregs and fabricated multilayer boards (MLBs). In most cases variables such as glass style and resin content have offsetting impacts on physical vs. electrical properties. Chet Guiles explains.

Broadcom PCB Design: Miniaturization on the Cutting Edge

Editor Andy Shaughnessy recently attended the Orange County Designer's Council “Lunch and Learn” meeting, held at the Broadcom offices on the campus of the University of California, Irvine. Afterward, he sat down with Scott Davis, CID, the senior manager of PC board design at Broadcom, to discuss the company’s savvy PCB design department and their approach to PCB design.

American Standard Circuits’ Unique Offerings Contribute to Long-term Success

At the recent IMS RF and microwave show in Phoenix, Arizona, Anaya Vardya, CEO of American Standard Circuits, sat down with I-Connect007's Barry Matties to discuss the current market trends, the company's recent equipment investments, and where American Standard Circuits' growth will likely come from.

Polar Talks Impedance Control and Insertion Loss Testing

During IPC APEX EXPO, Guest Editor Dan Feinberg sat down with Polar Instruments product specialists Michael Bode and Geoffrey Hazlett to talk about the company and its products and solutions. They also discussed some of the signal integrity technologies being enabled by the company, including controlled impedance and insertion loss testing.

How to Successfully Purchase PCBs

How do you go about purchasing reliable and durable PCBs at the lowest possible cost? A key success factor is to provide the prospective suppliers with accurate and clear specifications, and to keep a close eye on the quality of the boards once they are in production.

New Embedded Component Standard Finalized

Solberg Technical Consulting's Vern Solberg talks to I-Connect007 about the recently launched standard, the IPC-7092, which focuses on embedded component technology. According to Solberg, this new standard took the earlier standards involved with passive devices, and combined it with standards on newer technologies using active devices, to help form components that can be manufactured and placed on layers within the PCB.

HDPUG Demonstrates Benefits of Cooperative R&D

The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

Polar Talks Impedance and Insertion Loss Testing

Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about controlled impedance and insertion loss testing.


iNEMI Managing Director: New, Disruptive Technology on the Horizon

Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.

The Future of Nickel in Nickel/Palladium/Gold Final Finishes

Final finishes can be subdivided into metallic and organic finishes. For the purpose of this article, the focus will be on the metallic finishes using the combinations of nickel (Ni) and/or palladium (Pd) and/or gold (Au). Variations on this theme are used extensively in the electronics market of today. The Ni/Pd/Au mutations are the inevitable result of technical requirement changes coupled with true and perceived acceptance within the industry.

IPC Plating Sub-committee 4-14: Surface Finish Specifications

IPC specifications are reference documents to be called out by designers and OEMs. Designers may take exception with one or more items in the specification to ensure that the product meets the requirements of its intended use. The acronym AAUBUS (as agreed upon between user and supplier) is part of any specification. Specifications are consensus documents. They are agreed upon by a panel of interested industry participants composed of suppliers, manufacturers, assembly houses (CMs) and end-users. The IPC Plating Sub-committee 4-14 is no exception.

BGA or CGA: When Is It Right for You?

In this interview with TopLine President and Founder Martin Hart, I-Connect007 Publisher Barry Matties focuses on column grid array (CGA) and how CGA can solve delamination problems. CGAs, also known as CCGA, are not necessarily new but are making a strong comeback in the high reliability market.

Material Witness: How About that Technical Roadmap!

You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.

IPC Validation Services 2014

Guest Editor Judy Warner talks with IPC's Director of Validation Services, Randy Cherry. Randy has been busy since launching IPC's Validation Services a year ago, with 16 QML audits completed and rapidly growing interest shown at this year's show. Randy also discusses future plans for auditing to IPC intellectual property standards 1071A and 1072, as well as to PCB standard 6012.

EchoStar’s Les Beller Shares the PCB Design-to-Fab Process

Recently, I-Connect007 Publisher Barry Matties had the opportunity to interview Les Beller of EchoStar Technologies. Beller’s career began in the early 1980s as a circuit board designer, eventually leading him to EchoStar, where he has managed the PWB design group and spent time as a PCB quality engineer. He is now a manufacturing process engineer specializing in DFx. In this interview, Beller focuses on the many challenges circuit board designers face, strategies for bridging the gap between circuit design and fabrication, and the future of circuit designers.

A Conversation (and Day) with Joe Fjelstad, Part 5

Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.

Effective Decoupling Radius

Power distribution networks (PDN) are becoming an important topic. Many engineers are finding that properly designing the power supplies and providing adequate decoupling for devices is a challenge, especially since devices are switching faster and dimensions are shrinking. Engineers often focus on discrete decoupling capacitors placed local to switching devices in hopes of providing the required capacitance for these high current demands. Kirk Fabbri explains.

Shax Engineering: The Biggest Little Board Shop in the Bay Area

In a recent visit to Shax Engineering, Barry Matties had the opportunity to interview Isam Shakour, founder and president of Shax Engineering. This little San Jose, California company is a complete turnkey operation, providing PCB layout, fabrication, and assembly services. We discussed the company’s growth since its 1998 founding, and Shakour’s plans for Shax going into the future.


A Conversation (and Day) with Joe Fjelstad, Part 1

I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.

Zentech: Expanding EMS Solutions and Supporting Innovation

Zentech CEO and President Matt Turpin sat down with I-Connect007 Publisher Barry Matties recently for a wide-ranging discussion of the state of both domestic and global manufacturing, and Zentech’s recent acquisition that will significantly expand the company’s capabilities. They also focused on supply chain issues, automation, regulations, and the importance of STEM education in the U.S.

Growing Their Portfolio: Camtek’s One-Stop-Shop in Functional Inkjet Technology

I-Connect007 Publisher Barry Matties caught up with Dr. Boaz Nitzan, VP of Functional Inkjet Technologies at Camtek recently, and the two discussed the company’s expanding portfolio into inkjet printing system for PCB solder mask & legend. The new system is designed to replace conventional coating, drying, exposure and development processes currently used in PCB manufacturing.

An Optical Update with TTM

Barry Matties recently met with Marika Immonen, manager of R&D optical interconnects at TTM Technologies. They last spoke one year ago. This time, they discussed the optical project that she’s been leading, as well as the future of optical technology in the PCB industry.

Understanding DFM and its Role in PCB Layout

DFM is short for “design for manufacturability.” It is the process of arranging a PCB layout topology to mitigate problems that could be encountered during the PCB fabrication and assembly processes required to manufacture an electronic system. Addressing fabrication issues is what’s known as design for fabrication (DFF), and addressing assembly issues during design is known as design for assembly (DFA).

Make the Right Decisions at the Right Time in the PCB Design Process

The right decisions are not always the easiest decisions, but making them well and as early as possible often avoids errors and addition costs. This is certainly the case in PCB design and a key decision influencing the design process and the eventual outcome is the selection of material and of the materials vendor. This is even more important when the PCB requires significant performance parameters to be met, such as high speeds.

Material Witness: Low-Flow Prepregs – Taming the Process

In this installment of Material Witness, Chet Guiles continues his discussion around Low-Flow Prepregs giving good advice about how to actually use these materials.

Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”

I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry, and Vaughan detailed Zentech’s involvement with National Manufacturing Day, a nationwide effort focused on STEM (Science, Technology, Engineering and Math) that simultaneously brought high school students together with 1,600 manufacturing companies from around the U.S.

Bernie Kessler: Pioneering Spirit Then and Now

I-Connect007’s Patty Goldman sat down with longtime friend and IPC Hall of Famer Bernie Kessler at IPC APEX EXPO 2015 in San Diego. Among other things, the two discussed the early days of IPC, and the beginnings of APEX EXPO.

UTC Aerospace Systems’ Lead PCB Designer Presents at Designer Day

I-Connect007 Guest Editor Kelly Dack sat down with Stephen V. Chavez, lead electrical designer for UTC Aerospace Systems, at IPC APEX EXPO Designer Day, to discuss Chavez’s presentation at the event. Chavez, who provides leadership to a global team of PCB designers, spoke on the importance of workplace communication with international teams.


Hunter Technology’s Two Newest CID Recipients Discuss Certification

I-Connect007 Guest Editor Kelly Dack spent time at Hunter Technology’s Silicon Valley plant, where he had the opportunity to sit down with two recent CID certification recipients, Jeff Davidson and Zev Gross, who recently completed Dack’s CID training program. The two also discuss the benefits of achieving certification and their plans to take the advanced course.

How to Streamline PCB Thermal Design

Thermal issues with a PCB design are mostly determined during the component selection and layout phases. After this point, only remedial actions are possible if components are found to run too hot. John Parry discusses how addressing thermal issues early in PCB design, starting at the system or enclosure level, can help streamline the entire process.

EMA Design Automation Connecting the Data with Arena PLM Software

During IPC APEX EXPO 2015, Guest Editor Kelly Dack sat down with Chris Banton, marketing manager for EMA Design Automation to discuss EMA’s recent partnership with PLM software provider Arena Solutions. Banton explains how the alliance benefits companies that use both platforms, and why more and more CAD tool users are also taking advantage of PLM.

Isola Launches Low-loss Laminate for 100 GB Ethernet Apps

I-Connect007 Technical Editor Pete Starkey and Isola’s Fred Hickman, senior director of high-speed digital products, spent time at IPC APEX EXPO 2015 talking about Isola’s recent launch of a low-loss, low-skew laminate prepreg. Hickman explains that the new material, Chronon, will be one of the enablers of 100GB Ethernet applications.

Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market

I-Connect007 Publisher Barry Matties and recently-appointed Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.

Hunter Technology on Design Operations and Business Strategies

Immediately following IPC APEX EXPO 2015, Guest Editor Kelly Dack paid a visit to Hunter Technology’s facility in Milpitas, California, where he interviewed Ian Grover, vice president of design engineering, and Chris Alessio, vice president of sales and programs. Discussed are Hunter’s design operations as well as the company’s overall business strategy.

Trending at Freedom CAD: New Crop of Next‐Gen Designers

Scott McCurdy, director of sales and marketing at Freedom CAD Services, expresses his vision for what North America is bringing to the table in the world of circuit design. I‐Connect007 Publisher Barry Matties and McCurdy also discuss China, trends in product design, tools, and more.

Material Witness: Low-Flow Prepregs–Defining the Process

Let’s try to define “low flow” in terms that will make sense to both suppliers and users of the products. A low-flow prepreg is a prepreg that flows sufficiently to wet out and adhere to bonding surfaces and to fill inner layer copper details, but does not flow so much as to fill in cut-out areas in a heat sink or run unevenly out of the interface between rigid and flexible elements of a rigid-flex PWB.

Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015

At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.

Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts

At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.​


Mentor Paper: 10 Tips for Streamlining PCB Thermal Design

Timing issues are affected by temperature differences between components. Thermal issues with the PCB design are largely locked in during component selection and layout. This handy “how to” guide provides an overview of the key considerations in PCB thermal design and how to optimize the thermal layout.

Panasonic Meeting Market Needs with Higher-Performance Megtron 7

I-Connect Technical Editor Pete Starkey sat down with Panasonic’s Tony Senese and Tomoyuki Abe at IPC APEX EXPO 2015 in San Diego--and high-speed digital materials, particularly those with very low-loss characteristics, was the focus of their discussion. Also noted were the positive responses from chemical process suppliers, and the realistic length of a product development cycle.

Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans

I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.

Effective Characteristic Impedance

Reflections can occur anytime there is an impedance mismatch on the line. Sources of mismatches are plentiful and include trace width changes, vias, stubs, reference plane changes, and even the so-called fiber weave effect. In this case, a trace can encounter a different dielectric constant depending on whether it is routed over glass or the epoxy resin in the dielectric material. In this investigation by Kirk Fabbri, it is the capacitive contribution of the different components that are of interest, and how they affect the characteristic impedance the driver sees.

Altium Talks 3D Flex Packaging Design

Altium Product Manager Ben Jordan and Editor Kelly Dack sat down at IPC APEX EXPO to discuss Altium’s new tools for designing flex and rigid-flex circuits. The new software allows users to model the design in 3D, eliminating the need for rigid-flex designers to create “paper dolls” for each design.

Cirexx Introduces Eclisp, An Alternative to Co-fired Ceramics

Al Wasserzug, SR Business Development Exec at Cirexx, talks about their new product, Eclisp. Developed in conjunction with Lockheed Martin, Eclisp is an alternative to co-fired ceramics and used to evacuate heat very efficiently with a low CTE. Wasserzug gave a paper on the new technology at IPC APEX EXPO.

Clyde Coombs Publishing 7th Edition of Printed Circuits Handbook

Clyde Coombs is ready to publish the latest edition of his "Bible of the Industry," the Printed Circuits Handbook. Andy Shaughnessy and Coombs discuss the upcoming 7th edition of this book, which now includes PCB design and supply chain content. Shaughnessy also plugs his own contribution to the book in the section dealing with EDA software tools.

EPTAC Expansion Includes CID Curriculum

Leo Lambert, vice president and technical director of EPTAC, discusses EPTAC's latest expansion, which includes IPC's certified interconnect designer (CID) curriculum.

Cadence’s Brad Griffin Digs Deep Into DDR

During DesignCon 2015, our roving reporter, Kelly Dack, stopped by to visit with Brad Griffen in the Cadence booth. What follows is their very interesting conversation that revolves around the evolution of DDR.

Sunstone Unveils Updates for PCB123

Guest Editor Kelly Dack sat down with Nolan Johnson, EDA product marketing manager for Sunstone Circuits, to discuss some big changes to the PCB123 design tool. One new feature: PCB123 will now allow user to download a Gerber file. But Johnson explains why Sunstone isn’t too worried about PCB designers taking their Gerbers to rival fabricators.


Polar Takes on China's Test Equipment Counterfeiters

Recently, while in China, Barry Matties spoke with Jonson Jiang, country manager of Polar Instruments. They discussed the company's latest impedance test equipment offerings and the challenges Polar faces in China, including companies that create counterfeits of their testing equipment. Can legitimate companies rely on China's government to fight counterfeiting?

CES 2015: Preview and Predictions

Looking back over the last five years of CES and analyzing predictions and items featured by the large exhibitors, you'd likely assume the 2015 show would feature more advanced 3D TVs, as they were predicted to take over the market...wrong!

Component Selection for Easier Design and Manufacture of Electronics

In the world of high tech, simplicity is arguably one of the foundational objectives of most of the technologies that surround us today. Certainly this is true in terms of how product designers are trying to create interfaces that allow even the most non-technical users to get what they need from electronic products with a minimum of hassle.

Thermal Characterization of LEDs: Enabling the Upcoming Lighting Revolution

This article describes a method that combines hardware measurement (a thermal transient tester), and computational fluid dynamics (CFD) software to provide high measurement throughput, which enables systems integrators to verify a vendor’s thermal resistance data during design and to test incoming commercial off-the-shelf parts before they are introduced into production.

What is DFM, Really?

Mark Thompson relates, "The term "design for manufacturability" has been used for many years now, but does everyone really understand this concept? For instance, do you design for 10%? Do you design for a specific manufacturer's capabilities, therefore making you less likely to seek alternative fabricators? How are your drawings worded?"

The Shaughnessy Report: Back to Vegas

After three years, it'll be nice to get back to Vegas. It's a microcosm of America, a symbol of all that is positive and negative in the land of red, white, and blue. This town is a true dichotomy: gamblers can win big, or lose big. There are a lot of really happy people on the way up, and a lot of not-so-happy people on the way down.

Design for Profitability: Avoiding Fabrication Issues and Minimizing Costly Revisions

At last, PCB designers are finally realizing the power they wield: They have the power to design profit into the board, or, conversely, increase costs and remove profit from the PCB. Mark Thompson reviews the challenges fabricators routinely face and presents typical DFP solutions affecting the bottom line.

Zen & the Collaborative Art of Designing, Manufacturing, & Implementing Low-loss, High-speed Flex Interconnects, Part 1

To maximize performance improvements and ensure the success of advanced flex materials, new design and fabrication trade-offs must be understood by material suppliers, OEMs, and fabricators. This article represents collaboration between an OEM, a fabricator, and a material supplier with the goal of broadening flex circuits in higher-speed applications.

Letter: Let's Reestablish the U.S. PCB Design Community

Dan Smith may have been sniffing paint fumes, but that didn't stop him from writing a letter to the editor after reading a recent "Shaughnessy Report". He asks, "What will it take to reestablish the U.S. PCB design community as a significant new product contributor? More education? Smarter tools? Intelligent factories?"

Lee Ritchey: Designing a PCB Stackup, Part 1

The challenge in designing a PCB stackup is to satisfy its many demands. Information in this article is drawn from Lee Ritchey's experience gained by designing more than 2,000 PCB stackups for products as simple as video games and as complex as the highest-performance backplanes used in supercomputers and routers


Crosshatched Planes in Impedance-Controlled Flex-Rigid PCBs

While RF purists may feel discomfort at the thought of using crosshatch as a high-frequency return, using crosshatched planes on flex and flex-rigid PCBs is a realistic method of keeping impedance-controlled traces at a manufacturable dimension and retaining the desired flexibility of the assembly.

Comparing Time Domain and Frequency Domain Techniques for Investigation on Charge Delivery and Power-Bus Noise for High-Speed Printed Circuit Boards

Signal integrity engineers and EMC engineers look at the decoupling capacitor in different ways. This award-winning paper presented at DesignCon 2007 looks at decoupling from a time-domain and frequency-domain viewpoint.

Step 1: Design for Manufacture

The advantage of parallel design architecture is that it lets multiple designers work on the same design simultaneously without needing to partition the design.
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