IoT: Let’s Put the “A” Back into EDA
If I say IoT, most people today will immediately conjure up some notion in their mind. This is especially true in the engineering community, where many of us are hanging the future of our careers on the Utopian vision of a clean, beautiful environment with hidden networks and sensors everywhere.
RTW IPC APEX EXPO: Valor Tool Benefits from Merging Mentor, Siemens Technologies
Oren Manor, director of business development, discusses the convergence of the electrical and mechanical discplines made possible through Mentor's merger with Siemens. Manor also explains how Mentor's Valor platform now utilizes Siemens' "digital twin" concept.
Frontline's InStack Viewer Helps Designers and Fabricators
Ben Quarles, software solultions business manager at Frontline, and Editor Andy Shaughnessy discuss the new InStack Viewer, which allows PCB designers and fabricators to investigate impedances, material properties, and other attributes of the correct stackup.
Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.
Out-of-the-Box Innovation Strikes a Chord at NAMM 2018
The National Association of Music Merchants (NAMM) holds two shows each year; the first is in Anaheim in January, and the second in Nashville in July. The January show is huge, attracting 100,000 visitors during its four-day run. My friend and editor (and bass player) Dan Feinberg has discussed how difficult it was for him to cover the CES show in a few days, and I must echo that sentiment about NAMM. It is one gigantic show.
Who Really Owns the PCB Layout? Part 2
In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.
APCT’s Cartel Acquisition Adds Capacity, Technology and Certifications
APCT recently acquired Cartel Electronics and its affiliate, flex and rigid-flex maker Cirtech. During DesignCon 2018, I spoke with APCT President and CEO Steve Robinson about what this acquisition means for the San Jose-based fabricator.
A Conversation with Dorine Gurney, New President of Polar Instruments
Dorine Gurney has recently been named president of Polar Instruments. With a 30-year resume that includes management positions at Mentor Graphics, Lattice Semiconductor and Tektronix, she takes the reins as Ken Taylor heads into retirement. I recently caught up with Dorine at DesignCon 2018 in Santa Clara, California.
Fully Automated Schematic Verification
Schematic verification is a part of the hardware engineer’s responsibility just as PCB layout verification is an accepted part of the PCB designer’s responsibility. However, with today’s circuit designs becoming more and more complex, time-consuming manual schematic verification is no longer an option. Manual verification of a complex circuit introduces significant risk by not identifying schematic design errors that are, in turn, passed to the downstream processes and ultimately to the fabricated board.
Pulsonix Ready for 2018
Pulsonix has been developing PCB design software for almost 20 years, establishing a reputation for its full-featured, low-cost design tools. Now, the UK-based company wants to break into the US market, and Pulsonix recently showcased its latest tools at PCB West. During the show, I spoke with Business Development Manager Ty Stephens about the company’s latest tools and plans to become a major player in the US market.
What’s New in EDA: The Experts Discussion
We wanted to find out what’s new in the world of EDA. Joining us on our experts conference call were Polar Instruments Managing Director Martyn Gaudion, DownStream Technologies founder Rick Almeida, and Director of Product Management Mark Hepburn and Product Management Group Director of Allegro Enterprise Products Hemant Shah, both with Cadence Design Systems. The group discussed the challenges and opportunities they see in our industry, as well as the need to bring new blood into the PCB design community.
Nano Dimension’s 3D Printing: Prototypes at the Push of a Button?
SICK AG is a global manufacturer of sensors and sensor solutions for industrial applications, with headquarters located in Waldkirch, Germany. After a demo of Nano Dimension’s new 3D printing machine at productronica, Barry Matties met with SICK’s Danny Wernet to discuss its pros and cons and get his overall impression of the technology. Are 3D prototypes really as simple as feeding in a Gerber file and pushing a button?
PCB Cooling Strategies, Part 2
In many PCB designs, component placement plays a decisive role in PCB cooling. But for some boards with areas of high heat and high current, the designer may have to utilize heat sinks, fans, and/or water cooling technology. There are a variety of cooling and heat dissipation options available now, but thermal management research still has a long way to go.
Thermal Management Update with Doug Brooks
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.
PCB Cooling Strategies, Part 1
With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.
Dr. Johannes Adam Gets Hot on Thermal Management
Thermal management expert Johannes Adam, PhD, was kind enough to take the train from his home in Leimen, Germany to meet with me during productronica in Munich. He is the creator of TRM (Thermal Risk Management) software and contributor, with Douglas G. Brooks, of "PCB Trace and Via Currents and Temperatures: The Complete Analysis, 2nd Edition." He’s also working on his own book on thermal management. Johannes sat down for an interview, and I asked him to share his views on the current state of thermal management for PCBs, and what the industry can do to put the spotlight on what’s hot in PCBs.
Mike Jouppi Discusses his Drive for Better Thermal Data
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.
IEEE’s Romanian SIITME Show a Success
The 23rd annual IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) was held in Constanta, Romania, in October 2017. It attracted more than 190 participants from Romania, and 13 other counties. While there might be some who question the suitability of Romania as a venue for such a conference, the country has a long technological history and has produced some top innovators and pioneers in aviation including Aurel Vlaicu, Traian Vuia, Henri Coanda, who prototyped an early jet aircraft in 1910.
That’s Hot: Ventec’s Goodwin on Thermal Management
IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. Patty Goldman sat in on some subcommittee meetings, including one on laminates, where she met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.
HDI PCBs: Make the Right Choice from Design to Volume
Modern electronic products are expected to offer evermore advanced functions, while the products themselves are becoming increasingly smaller. There are two key factors for the successful production of HDI PCBs: first, making the right choices at the design stage, and then carefully choosing the factory that can support the specific technical demands of the project. NCAB Group COO Chris Nutall explains.
Three Perspectives for HDI Design and Manufacturing Success
Mike Creeden has been in the PCB design industry for more than 40 years now. In June 2003, he founded San Diego PCB Inc., a design bureau serving a variety of industries, including industrial, automotive electronics, medical diagnostics, internet of things (IoT), defense, aerospace, and communications markets. So, we asked Creeden to share his insights about HDI, and how designers and manufacturers can address those issues.
Who Really Owns the PCB Layout?
In order to understand the current climate, we have to look at the division of labor that took place in electronic design about 40 years ago. The labor was divided into two processes, with the first being the design itself. This process was (and still is) owned by the electrical engineers. Though circuit design has changed, the methods for representing the circuit have not. Paul Taubman of Nine Dot Connects explains.
Cannonballs, eBooks, and Signal Integrity
I-Connect007 editors Andy Shaughnessy and Pete Starkey recently met with Polar Instruments Managing Director Martyn Gaudion at productronica. They discussed the success of "The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs," the ongoing challenge of facilitating communication between designers and fabricators, and the influence of chemical bond-enhancement processes on insertion loss.
Bay Area Circuits Updates InstantDFM Tool
Bay Area Circuits is on a quest to help PCB designers and design engineers. For the past few years, the company has been holding facility tours and open house events to help designers understand more about the fabrication process. Now, Bay Area Circuits has upgraded its free design tool, InstantDFM.com, which allows customers and non-customers alike to check manufacturability and request pricing of their jobs. At PCB West, Andy Shaughnessy spoke with President Stephen Garcia and COO Brian Paper about the new tool update, and some of the other services they offer for PCB designers.
Nancy Jaster Brings Manufacturing, Design Background to Designers Council
Nancy Jaster was recently named the head of the IPC Designers Council. At the recent AltiumLive 2017 event, I spoke with Nancy about her unique background in both design and manufacturing, and how she hopes to use that experience and mindset to revitalize the Designers Council going forward, particularly with the International and student chapters. We also discussed her plans to bring more young people, particularly women, into the industry.
Zuken Teams With Nano Dimension for 3D Printing Design Flow
At PCB West, Zuken shared a booth with Nano Dimension. Zuken has been working with Nano Dimension for some time, and adding support for 3D printing and nanotechnology to its design tool platforms. I sat down with Zuken’s Humair Mandavia and Nano Dimension’s Simon Fried to learn more about this alliance, and to find out more about this odd-looking box being demonstrated in Zuken’s booth.
Video from productronica 2017: Karel Tavernier on Ucamco's New Communic8tor
European Editor Pete Starkey and Ucamco Managing Director Karel Tavernier discuss Ucamco’s cloud-based Communic8tor platform which facilitates two-way communication between the CAM engineer and the PCB designer, or any other party involved in the manufacturing process. This gives real-time access to image data and annotations, enabling queries to be resolved, changes to be approved, and a full communications history to be maintained.
Signal Integrity: The Experts Weigh In
When we began planning the October issue on signal integrity, we arranged a conference call with a variety of industry experts. Mike Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries joined editors Andy Shaughnessy, Patty Goldman, Happy Holden and Publisher Barry Matties on the call for a spirited discussion about the challenges related to signal integrity and some of the tricks of the trade for helping ensure SI.
Happy Holden and Charles Pfeil Discuss the Past and Future of PCB Design, Part 2
In Part 2 of this feature interview, I continue my conversation with industry icons Happy Holden and Charles Pfeil at the recent AltiumLive 2017 event in San Diego. In this half of the interview, we discuss the potential for artificial intelligence in EDA software tools, the graying of the designer pool, and what can be done to draw more young people to PCB design.
The PCB Norsemen: Industry 4.0, AI and CircuitData
As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.
AltiumLive Summit—Munich, Germany, Part 2
Pete Starkey continues with his review of the AltiumLive PCB Design Summit held recently in Munich, Germany. The second day commenced with a new product launch. “Working together is hard” it read on the screen. Statistics indicated that 33% of new products were late getting to market, of which 28% were late due to insufficient collaboration, and up to 50% of potential revenue could be lost through being late to market. Then the screen read “NEXUS makes it easy!”
Nine Dot Connects: Good Design Instruction is a True Value-Add
Nine Dot Connects has certainly blazed an interesting trail. The company started out as an Altium reseller, but in less than a decade, Nine Dot Connects has also become a design service bureau and a provider of PCB design instruction, training, and consulting services. I recently interviewed Paul Taubman, technical services director for Nine Dot Connects. We discussed the company’s expansion from VAR to service bureau and content provider, and the changing landscape of PCB design instruction.
AltiumLive Summit—Munich, Germany, Part 1
Altium held a very successful AltiumLive PCB Design Summit in San Diego, California at the beginning of October for the benefit of their North American design community, and followed it three weeks later with a counterpart European event in Munich. And what an eye-opener it proved to be—literally hundreds of delegates, a superbly organised and managed programme, billed as a completely immersive two-day interactive design experience on a theme of learning, connecting and getting inspired.
Happy Holden and Charles Pfeil Discuss the Past and Future of PCB Design, Part 1
When it comes to the PCB design community and the challenges facing it, as well as where design has been and where it’s heading, there aren’t many people as qualified to speak on the topic as long-time industry veterans Happy Holden and Charles Pfeil. Joined by I-Connect007’s Barry Matties at the recent AltiumLive 2017 event in San Diego, the three sat down for a discussion about the current state of PCB design, what the future holds, and what it means to be a designer.
Insulectro Teams with Isola to Address Signal Integrity Needs
Insulectro and Isola recently shared a combined booth during PCB West 2017. Insulectro has distributed Isola materials for years, and the companies wanted to focus on Isola’s line-up of high-speed, low-loss material sets. Insulectro’s Chris Hunrath, VP of Technology, and Norm Berry, Director of Laminates and OEM Marketing, sat down with me to discuss the challenges facing signal integrity engineers today, and some of the Isola low-loss, low-Dk materials that can help with their signal integrity requirements. You might find Chris and Norm speaking to a group of PCB designers near you.
AltiumLive 2017 Munich: Sold Out!
I recently sat down with Ted Pawela, Lawrence Romine, and Judy Warner of Altium to wrap up their sold-out AltiumLive 2017 PCB Design Summit in Munich, Germany. This conference, following on the heels of an AltiumLive event in San Diego, was packed full of PCB designers who attended a series of great keynotes and an excellent technical program. We discussed some of the highlights of the show, including designers’ reactions to a new version of Altium Designer 18 and the brand-new Altium Nexus tool.
Carl Schattke: I Started Designing Boards When I Was 12
Growing up with a father who owned a PCB design bureau, Carl Schattke, CID+, may have been predestined to design circuit boards for a living. In fact, he’s been designing boards for nearly his entire life. Carl gave a keynote speech at the recent AltiumLive event in San Diego, where I caught up with him to discuss a lifetime spent in PCB design, as well as the graying of the PCB design community and what might be done to inspire a youth movement in PCB design.
Sunstone Integrates SnapEDA Libraries into PCB123
Sunstone Circuits and SnapEDA recently announced that SnapEDA’s parts library would be integrated into Sunstone’s PCB123 design tool. During PCB West, I interviewed EDA Product Manager Nolan Johnson of Sunstone Circuits and SnapEDA President Natasha Baker. We discussed their new partnership, the changing parts library landscape, and where the companies see this alliance heading in the future.
Polar Instruments’ Martyn Gaudion Discusses Tools and Books
Polar Instruments has pretty been busy lately. In the last year, Managing Director Martyn Gaudion has written two books for I-Connect007, and the company has been working to upgrade its tools, especially library functionality. I met with Martyn at PCB West. We discussed Polar’s newest tool updates, Martyn’s new side job as an author of technical books, and the continuing growth of the EDA segment, including among young people.
Dan Beeker’s AltiumLive Keynote: It's All about the Space
Dan Beeker of NXP Semiconductors was a keynote speaker at the recent AltiumLive 2017 event in San Diego. His presentation focused primarily on the design of three-dimensional structures and how it’s all about space. I caught up with Dan, and we discussed his presentation, his background and career, and what kind of advice he would give to young PCB designers.
AltiumLive 2017 Attracts Hundreds of Designers
Altium conducted its first-ever users conference, AltiumLive 2017: Annual PCB Design Summit, at the Hilton Resort and Spa on beautiful Mission Bay in San Diego. This conference included a lineup of notable speakers, including four keynote speeches over the two-day event. This conference drew hundreds of PCB designers, many of whom attended breakout sessions designed in accordance with the show’s motto, “Learn – Connect – Get Inspired.”
Altium Designer 18 Introduced at AltiumLive 2017
At the recent AltiumLive 2017 event in San Diego, I sat down for an interview with Dan Fernsebner, Altium’s global head of technical marketing. Dan discussed the upcoming release of Altium Designer 18, as well as the company’s corporate responsibility for giving back to the industry and bringing more young people into EDA. The event featured speakers such as Happy Holden, Dan Beeker, Charles Pfeil, and Tara Dunn, as well as a robot team competition.
Full Coverage of AltiumLive 2017
Altium recently conducted its first-ever users conference, AltiumLive 2017: Annual PCB Design Summit, at the Hilton Resort and Spa in San Diego. Speakers included Dan Beeker of NXP Semiconductors, Max Seeley of 3M Corporate R&D, Tara Dunn of OMNI PCB, Susy Webb of Fairfield Nodal, Charles Pfeil of Altium, and our own Happy Holden. This conference drew hundreds of PCB designers, and included a robot design challenge and battle. If you couldn’t make it, don’t worry. We shot a variety of video and still photos.
Predictive Engineering: Happy Holden Discusses True DFM
Happy Holden has been involved in DFM for over 45 years, since he first started working at HP and optimized their PCB design and manufacturing processes. Naturally, for this issue, Barry Matties and Andy Shaughnessy made it a priority to get Happy’s thoughts on DFM, and what true DFM entails.
It’s Not Your Father’s DFM Anymore
What does DFM look like today? Well, for one, it’s become more than DFM. We now expect our software tools to serve us more completely to take new designs to market. DFM has evolved to become an integral part of new product introductions (NPI). Today’s NPI software spans design and manufacturing to accelerate the optimization of a PCB for manufacturing. It looks at the entire design-to-manufacturing release process and deliverables, then streamlines them.
Sensible Design: Thermal Management—The Heat is On
Thermal management materials are designed to prolong equipment life and reduce incidences of failure. They also maintain equipment performance parameters and reduce energy consumption by reducing operating temperatures, and minimising the risk of damage to surrounding components. Indirectly, they maintain brand reputation, as the reliability of the equipment will be very dependent upon the effectiveness of the thermal management technique used.
The State-of-the-Art in PCB Pre-production Engineering
If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.
RTW SMTAI: Judy Warner Discusses AltiumLive: 2017 and Her New Role
At SMTA International in Rosemont, Illinois, Judy Warner of Altium discusses her new role as director of community engagement. She also details AltiumLive: 2017, which takes place October 3-4 at the Hilton San Diego Resort and Spa. AltiumLive features Happy Holden and Charles Pfeil, as well as a robot design challenge and battle.
Whose Fault is That Bad Board?
Years ago, I held a position in an EMS company where projects were analysed before manufacturing. We found that even some of the best and most innovative circuits could not be manufactured. Why? Because the PCB designer, an electronic engineer, was not acquainted with the fabrication process. He had no idea about technological requirements necessary for electronic production. I know another designer who learned, finally, the importance of the thermal relief pad for heat restriction during reflow for a good soldering. His response? “Oh, was that what they were for? And to think I worked so much to remove them!”
Enough Blame to Go Around
The idea for this article began a few months ago when The PCB Design Magazine conducted a reader survey regarding the topic “Whose Fault is that Bad Board?” After some thought, I submitted my answers. After all, I must have some kind of input after over 25 years of PCB design. But still, whose fault is that bad board? OK, I know what you’re thinking: Don’t go there. We designers make mistakes too.
The International Paris Air Show with ASC’s Anaya Vardya
The International Paris Air show is the crème de la crème of the world’s trade shows. This is the big one, where all the aircraft, airline and defense aerospace companies meet to introduce new products, discuss the future of aviation, and make deals. This year I decided to talk to my friend Anaya Vardya, ASC’s president and CEO, about the show, why he goes and what it’s like.
Resins: Cutting Through the Technical Jargon
This month, I’m going to cut through some of the more heavy-going tech-speak, taking a few of my customers’ more frequently asked questions about resins to try to help you refine your selection process. There’s a lot of ground to cover, but for the purposes of this column, let’s concentrate on the PCB’s operating environment, caring for the components that are to be encapsulated, and the special needs of applications like LED lighting and RF systems.
New Challenges Facing Mil/Aero Segment
For this month's issue, we invited a sampling of professionals whose experience centers on the electronics industry in the military and aerospace world, including experts from design, PCB manufacturing, and the assembly arena to sit down with us for a frank discussion. Our discussion centered on the challenges associated with military work, including the new regulatory requirements for cybersecurity, dealing with leaded vs. lead-free components, and the differences and similarities with the commercial world.
Stephen V. Chavez Talks Mil/Aero PCB Design
Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.
Orange Co. Designers Council Meeting Focuses on Embedded Passives
On July 19, the Orange County Chapter of the IPC Designer’s Council hosted a lunch-and-learn meeting in Tustin to discuss the benefits of embedded passives. Approximately 40 people were in attendance, which was lighter turnout than usual, most likely because of summer vacations. But the crowd was an enthusiastic one, as usual. The first speaker was Bruce Mahler of Ohmega Technologies, followed by Jin Hyun-Hwang of Dupont.
Trilogy Circuits: Mil/Aero Demands Technological, Regulatory Expertise
In the 16 years since its founding, Trilogy Circuits has become one of the go-to companies for mil/aero PCB design and manufacturing. I spoke with Charlie Capers, president and founder of the Richardson, Texas firm, about how he keeps ahead of the game. As he explains, succeeding with mil/aero PCB work requires not only mastery of the technological side, but of the regulations and certifications as well.
Using Vibration and Acceleration Analysis to Improve Reliability
Deriving the physical constraints and fatigue issues for a design prior to manufacturing is essential to reducing board failure and thereby improving product quality. In harsh environments, fatigue can be responsible for up to 20% of failures. Customers have come to expect reliability across the industry spectrum no matter where actual production occurs. Reliable products have less risk of failure, less field returns and less warranty claims, all of which contribute to higher profitability. It is a given that every product is expected to fail at some point, however premature failures can be mitigated through proper design with attention to potential issues due to vibration and acceleration.
Performance Evaluation of Thin-Film Embedded Resistors
Thin-film microstrip circuits have been widely applied in microwave communications, electronic countermeasures (ECM), and aerospace applications, etc. When manufacturing thin-film ICs, it is very important to apply deposited thin-film resistor material to fabricate high-accuracy and highly stable thin-film embedded resistors. Thin-film ICs call for thin-film resistors that meet stringent requirements.
Embedded Technology: A Useful Tool in Freedom CAD’s Toolbox
Freedom CAD has been designing and fabricating boards with embedded technology for years, and doing some pretty innovative work along the way. I asked Scott McCurdy, Freedom CAD’s director of sales and marketing, to share some details about their embedded processes, as well as the challenges and opportunities that embedded technology offers.
Technology Enabler Highlights Benefits of Having Design Services for an EMS Firm
At the 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held last week in Manila, Robin Ramiso, design and development manager at Technology Enabler, discusses their activities, and the benefits of having a design services team for an EMS company with I-Connect007 Managing Editor Stephen Las Marias.
Romania’s PCB Design Students Compete at TIE 2017
During the last week in April, the 26th Interconnection Techniques in Electronics (TIE) show was held at the Gheorghe Asachi Technical University in Iasi, Romaina, a wonderful hill town not unlike Rome. The event, a convention for the Romanian electronic packaging community, included a series of actions designed to draw smart young students to the electronics industry, which is clearly growing. Participants had only four hours to create this PCB design, which was generated by a team of professionals from Continental Automotive Romania Timisoara.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Whose Fault is it When the Board Fails?
In an upcoming issue of The PCB Design Magazine, we will discuss a question that you've undoubtedly faced in your job: Whose fault is it when the board fails? Of course, everyone likes to blame the PCB designer. But think about it. Is the board shop at fault, or perhaps the EMS provider? Is it the customer's fault, or does the designer bear some of the blame after all? Take this quick survey and let your voice be heard!
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
PCB Design in the Age of IoT
From the early days of printed circuit boards, the electronics industry has made huge strides in board materials, copper printing methods, miniaturization, rigid-flex, ELIC, EDA, and much more. Many of the devices we use in our homes, our vehicles, and in our workplaces would not be possible without this continuous evolution of PCB design and technology. And yet in 2017, we are poised to shift from evolution to revolution, driven by the idea of the Internet of Things.
SnapEDA: Recruiting Top Engineering Talent in an Amazon World
You don’t have to love EDA to work at SnapEDA, but it helps. This startup, founded by Natasha Baker, is on its way to creating the world’s largest parts library for PCB designers. Baker leads a small team of young, fiercely talented engineers—the kind of employees that are attractive to companies like Google and Facebook. I asked Natasha to explain her hiring process, and how she ensures that each employee is the right fit for SnapEDA.
Steve Robinson Discusses APCT’s Tenfold Expansion
Steve Robinson, CEO of APCT, a PCB fabricator in Silicon Valley, has led the company to impressive growth since he acquired it nearly 10 years ago. I ran into Steve at DesignCon 2017, and we sat down to discuss the company’s remarkable transformation and his focus on working with PCB designers and engineers to create advanced, high-speed PCBs.
Altium Focuses on the Designer First
A few months before Judy Warner joined Altium, while she was still with I-Connect007, she sat down with Lawrence Romine to discuss the company’s drive to satisfy the individual PCB designer, and not necessarily the OEMs who employ them. Romine also explains what sets designers and engineers apart from the average person, and why some Altium users have a different primary EDA tool, but use Altium when they need a design done fast.
Bruce Mahler Discusses Ohmega’s Resistive Material Technology
Bruce Mahler, vice president of Ohmega Technologies, sat down for an interview with me at DesignCon 2017. He discussed the company’s latest embedded resistive materials, as well as some of the drivers and challenges in that segment of the materials industry.
Sensible Design: Casting a Spotlight on Resin Applications
Over the last few columns, I’ve given readers pointers on virtually every aspect of potting and encapsulation resins, ranging from their formulations and special properties to their applications, benefits and limitations. It’s probably high time, therefore, to take a step back from the do's and don’ts and focus instead on how these resins are bringing very real benefits to practical electronic and electrical engineering applications. A good starting point is to look at the special requirements of an industry that is enjoying explosive growth: LED lighting.
TTM Shines a Light on Optical Interconnect
Are embedded optics on PCBs set to make a breakthrough in the upcoming years? According to Dr. Craig Davidson, VP of Corporate Technology at TTM, it might be closer than you’d expect. In a recent interview with the I-Connect007 team, Craig outlines TTM’s current pursuit of high-volume manufacturing lines able to deliver embedded optical interconnect, what that would mean for the PCB industry, and why he thinks there will be manufacturing production capability by 2020.
'Flexdude' Tom Woznicki Celebrates Company’s 25th Anniversary
Twenty-five years ago, Tom “Flexdude” Woznicki got laid off. A lot of people did, back during the mini-recession that helped bring Bill Clinton into the White House. So, he launched his own flex circuit design bureau and never looked back. Since then, he’s designed flex circuitry for everything under the sun, including the Mars Rover; the flex circuits he designed are visible in many of the Rover photos. I ran into Tom at DesignCon 2017 and we discussed the benefits of flex circuits, the expansion of the flex market, and his company’s first quarter-century in operation.
Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017
Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.
Rigid-flex Design Tips and Best Practices
While the traditional “design-separately-then-assemble” approach minimized potential issues with the flex portions of the product, it also had several inherent disadvantages. These include the cost associated with the physical connectors; the space required for the physical connectors; the need to properly manage interconnects that have to transition between the separate rigid and flex PCBs (through the connectors); and, of course, the time and cost associated with assembly. The move to the current generation of rigid-flex technology mitigates these issues; however, they are replaced with a different set of challenges and concerns.
Mentor Graphics Takes Best Paper Award at DesignCon
At DesignCon, I met with Dave Kohlmeier, senior product line director for Mentor Graphics. We discussed their Best Paper award and DesignCon sessions such as the Signal Integrity Boot Camp, as well as the new rigid-flex capabilities found in the HypeLynx suite.
Capitol Connection: Direct Legislative Action—IMPACT Washington, D.C. 2017
This ties in to why IPC–Association Connecting Electronics Industries invests so much into our government relations efforts. We place a high priority on government relations because so many public policy debates have large impacts on our industry. Our members continue to value our advocacy efforts on issues such as taxes, regulations, immigration and the environment.
A New Power Design Methodology for PCB Designs
Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.
Cadence’s Zhen Mu Discusses Her Power-Aware Analysis Solution White Paper
At DesignCon, I met with Zhen Mu, senior principal product engineer with Cadence Design Systems, and Brad Griffin, product marketing director for Cadence. We discussed Zhen’s new white paper, “Power-Aware Analysis Solution.”
Exciting New Technology: Thermal Risk Management
Two years ago I entered into a collaboration with Dr. Johannes Adam, from Leimen Germany. Johannes has written a software simulation tool called Thermal Risk Management (TRM). We used it to look at the thermal characteristics of PCB traces under a variety of conditions, and it is hard for me to contain my excitement and enthusiasm for what it does and what we learned about traces using it. Our collaboration resulted in the publication of numerous articles and a book. In this article, I’ll talk about some of the capabilities of TRM that really caught my attention.
Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!
During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.
Real Time with...IPC 2017 Videos Now Available for Viewing
Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.
In Deep: The Art and Science of DFM with Gary Ferrari
When the topic of DFM techniques came up, I knew I had to talk with Gary Ferrari of FTG Corp. Gary has been involved with designing and manufacturing PCBs for decades, and he’s the past co-founder and executive director of the IPC Designers Council. I caught up with Gary between Thanksgiving and Christmas, and we conducted the following interview.
The Evolution of PCB Design and Designers
According to Rainer Asfalg of Altium, VP Sales EMEA, EDA companies owe it to their customers to provide much more than just a standard design tool. Barry Matties met with Rainer at the recent electronica show to discuss the continued evolution of the design process towards automation, and what this might mean for the education and overall requirements of PCB designers going forward.
A Handy Compilation of Our Top 10 DFM Articles
When we started working on this DFM issue, I searched through our files and found that we’ve published some great DFM articles over the past year or so. While topics like signal integrity tend to get most of the limelight, in the end it all comes down to solid DFM practices. So, without further ado, we present this compilation of our Top 10 DFM articles and columns.
Flex and Rigid Sales and Marketing with Al Wasserzug
After decades in the PCB industry, Al Wasserzug of Cirexx International has seen marketing and sales trends come and go. I recently caught up with Al and interviewed him via email about the latest sales and marketing techniques, the value of traditional methods such as trade shows and conferences, and the particular characteristics of marketing flex circuits.
Altium’s Sales Plan: Deal Directly with Designers
Altium has been shaking up the EDA world for quite some time. The Australian company once slashed the cost of Altium Designer by 75% to grow market share, and who could forget their famous (or infamous) “Bunny” ad campaign? In this email interview with Lawrence Romine, Altium’s global head of field marketing, he shares his views on sales and marketing in the EDA world, as well as Altium’s philosophy on selling EDA tools.
CES 2017: Disruptive Technologies
Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.
CES 2017: Press Day, LaunchIt and Showstoppers
Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.
Sales and Marketing with DownStream Technologies
From its inception, DownStream Technologies has been a new kind of software tool company. DownStream’s post-processing tools address one of the most unpopular parts of the design process: documentation. DownStream's CEO Rick Almeida discusses some of his firm’s marketing and sales methods, the trends that he sees, and the influence of the Internet on marketing.
Much Ado About Sales and Marketing
We recently surveyed our readers to get a better idea of what company leaders thought about sales and marketing. We sent this survey to several sales leaders; the results were informative, at times surprising, and even a bit disappointing, especially when participants reported that they had no sales and marketing plan at all. Does your company fall into that category?
TTM President Thomas Edman on the Global PCB Market, Technology, and More
The TTM and Viasystems merger put the PCB industry on notice last year when it created one of the biggest powerhouses in the world. At this year’s HKPCA and IPC show, Barry Matties met with TTM Technologies President and Chief Executive Officer, Thomas Edman to get his views on the market, technology, the culture of TTM and even the Trump effect.
Resins: Five Essentials to Achieve the Right Cure
Last month, I looked at some of the critical things you need to consider before selecting your resin. Of course, when it comes to the choice and application of resins, there’s a lot of information to take in, and over the following months I hope to distill this and provide some useful tips and design advice that will help you in your quest for reliable circuit protection.
'Can Do' in CAM Outsourcing: CAM Engineering – Automation
As volume production in PCB has shifted significantly to Asia, manufacturers in Europe and North America have been focusing on high technology, quick-turn, prototype, and lower-volume production.
SiSoft Discusses Signal Integrity Drivers and Challenges
In the last few years, SiSoft has launched a variety of innovative SI tools that help automate tasks that used to take weeks or months to complete. I recently interviewed CEO Barry Katz via email, and he detailed their customers’ challenges, and some of the market drivers in the world of signal integrity.
Sunstone Circuits Makes Shift in Strategy, Offerings
Sunstone Circuits, the Oregon-based online vendor of quickturn circuit boards, has recently made a shift in capabilities that will enable a move into the RF and microwave space. At PCB West, Publisher Barry Matties caught up with Sunstone’s David Warren, and they discussed details of this change and how they plan to approach such a competitive marketplace.
CAT’s David Wolf on Via Reliability Analysis
Conductor Analysis Technologies (CAT) has been analyzing test panels and coupon designs for over 20 years. CAT’s analysis provides valuable, quantitative data on PCB quality and reliability, which can help designers and manufacturers trace the source of defects and non-uniformities. Vice President of Technical Marketing David Wolf discusses some of the trends he’s seeing in via structures, and the common reliability and quality issues related to vias.
Sensible Design: Why are Resin Properties So Important?
Last month, I started this series of columns on resins by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions. I hope readers found this useful. Of course, when it comes to the choice and applications of resins, there’s a great deal more to discuss.
What’s the Difference Between a Manager and a True Leader?
The role of the manager is complex; it means balancing business needs with creative opportunity and flexibility, building trust and providing inspiration with a team. With the recruitment of Generation X, and now the millennials, the expectations of employees are changing, accompanied by an unprecedented growth of technology. How can today’s manager maintain an effective and motivated team?
Leo Lambert Discusses EPTAC’s Evolving Mission
This month we’ve been dealing with challenges related to being a great manager and a great leader. One of the biggest problems a manager faces is training—getting employees trained, and keeping them current on constantly changing technologies. I asked Leo Lambert, VP and CTO of EPTAC, what his thoughts were on the subject of leadership, and more specifically, what strategies EPTAC embraces with regard to training—both initial and ongoing.
Lightning Speed Laminates: The Blending of High-Speed Digital and High-Frequency RF
When the terms high-speed and high-frequency are mentioned, people think they describe the same issue. But in reality, they can be two very different matters. The term high-speed generally refers to digital technology which transfers data at very high rates. But the term high-frequency is typically related to radio frequency (RF), which involves analog signals moving energy at high frequencies.
Mentor Graphics’ PADS Platform Bridges Design and Manufacturing
At PCB West, Barry Matties spoke with Paul Musto about Mentor’s PADS environment and their introduction of scalable software tools to help design better boards, from the enterprise level down to the entry level and hobbyists. They also discussed the evolution of the design process infrastructure in North America vs. Asia, and what design engineers should focus on to increase their value.
The Shaughnessy Report: Leadership vs. Management
Is your manager one of the great ones, a true leader? Many of your colleagues would probably answer with a pointed “No.” In our reader surveys, we ask, “What is your biggest challenge?” Every time we've posed that question, we received replies along the lines of, “Management doesn’t know what the hell they’re doing.” Some replies are too salty to print.
Ventec Europe Celebrates 10 Years as 'Not Just Another Laminate Merchant'
Incorporated in November 2006 as a joint venture known as Global Ventec Laminates, Ventec Europe imported its first container-full of material in May 2007. Now, here we are 10 years on, a bit older and not a lot wiser, in Ventec Europe’s immaculate headquarters facility, still in Leamington Spa, but in smart new premises.
Patty’s Perspective: Take Me to Your Leader
We must have touched a real hot button when we decided to do this issue on leadership. When we sent out our survey on the topic, we received a lot of responses, which we’ll review in a separate article, plus many of our regular columnists were inspired to write on the subject.
Altium ActiveRoute Debuts at PCB West: Routes Under One Second Per Connection
While at PCB West, Judy Warner had the chance to sit down with Charles Pfeil of Altium and learn more about their exciting new tool, ActiveRoute, that was introduced and demonstrated during PCB West 2016. She also learned a bit of background about Pfeil, who is a living history lesson in PCB design.
SnapEDA: Inspiring Millennials in the PCB Design Community
Natasha Baker, founder of SnapEDA, is part of the new breed of entrepreneurs. She manages a group of millennials who are not much younger than she is. Natasha discusses what it means to be a manager vs. a leader, what motivates millennial engineers, and some of the changes in the world of EDA that managers have to contend with to succeed.
Let's Talk Testing: Don’t Reinvent the Wheel—Find an Expert!
Back in the day when I was an engineer fresh out of college, I quickly learned that experience is the solution to many problems. Now that being said, experience comes in many forms…it could be knowledge learned from a textbook, it could be an observatory comment jotted down in a notebook, it could be a conversation with a co-worker or colleague, or it could be an Internet search that finds a scholarly technical article, etc.
One World, One Industry: Voting—A Civic Duty and Industry Opportunity
On Tuesday, November 8, more than 240 million people in the United States will have the opportunity to go to the polls and vote, make their voices heard in government, and influence the direction of public policy for years to come. Much of the world is closely watching with interest in this major U.S. election.
Sensible Design: The Little Guide to Resins
I would like to start this series of columns by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions.
Beyond Design: How to Handle the Dreaded Danglers, Part 2
In Part 1, I deliberated on how dangling via stubs distort signals passing through an interconnect and also decrease the usable bandwidth of the signal. This is due to the via stub acting as a transmission line antenna, which has a resonant frequency determined by the quarter wavelength of the structure. The conventional solution to this problem is to back-drill (or control depth drill) the vias to bore out the via stub barrels, so that the via stubs are reduced in length if not completely removed. This month I will look into all the possible solutions.
Space: Still the Final Frontier
If this doesn’t make you feel like a “seasoned citizen,” I don’t know what will: "Star Trek" first aired 50 years ago, on Sept. 8, 1966. No one—not even the actors—thought the show would last, and it only ran for three seasons, drawing average ratings. But Captain Kirk and company are more popular than ever on their Golden Anniversary.
Flexdude Abides: PCB Design for Satellites
Tom Woznicki, aka “Flexdude,” has focused primarily on flex circuit design since he founded Flex Circuit Design Co. in the 1990s, and he designed flex circuits for the Mars rover. But recently, Tom designed rigid PCBs for the TESS satellite. I asked Tom to discuss his work with TESS, and what it’s like switching between flexible and rigid PCBs.
The Fundamentals of Improving PCB Thermal Design
Continental's automobile engineers have years of experience building critical parts and systems for automobiles. Making sure that automotive electronics are reliable, safe, and properly designed begins at the component level. Heat must be addressed early in the design process for these goals to be achieved. The most important thermal resistance for heat, outside the IC package, is the PCB.
EIPC Reliability Workshop, Tamworth, UK, September 22, 2016
EIPC’s reliability workshop, presented in cooperation with Amphenol Invotec, attracted a capacity audience from eight countries—some delegates having travelled from as far away as Russia—to take the opportunity to learn first-hand how to meet OEM, ODM and EMS product quality and safety requirements, and to understand how interconnection stress testing techniques could be applied to determine the reliability of multilayer PCBs.
John Cardone on Designing Flex for Spacecraft
If you watched footage of the Mars rover driving all over the red planet, you’re familiar with some of John Cardone’s handiwork. He’s been designing rigid, flex, and rigid-flex circuitry for spacecraft since he joined JPL in the early ‘80s, and he’s worked on some of the more ground-breaking flex circuits along the way. Now John runs his own design service bureau, JMC Design Services, and he continues to design circuitry for things that blast off. I caught up with John recently and asked him to give us the straight scoop on designing boards for spacecraft.
Sensible Design: Conformal Coatings - Beware the Boards that ‘Bare’ All!
This month, Phil Kinner departs from his usual format of providing five essential facts about conformal coatings. Instead, he provides an account of a customer’s problem—no company names mentioned, of course—that brought into question the adhesion performance of a coating that they had been using successfully for some time.
Transline Technology is Bullish on Design Engineers
At the International Microwave Symposium, I met with Chris Savalia, vice president and co-owner of Transline Technology. We discussed the California-based fabricator’s philosophy, the challenges of the RF and microwave markets, and the need to engage with young design engineers now.
Beyond Design: How to Handle the Dreaded Danglers, Part 1
Dangling via stubs can distort signals and decrease the usable bandwidth of the signal. A via stub acts as a transmission line antenna, and has a resonant frequency determined by the quarter wavelength of the structure. At this frequency, the transmitted signal is greatly attenuated, by up to 3dB. For low-frequency signals, this is not much of an issue, but for higher-frequency signals, this issue becomes a problem.
The Evolution of Altium: Road to a Record-Breaking Year
Chris Donato, VP of sales for Altium Americas, sat down with Judy Warner recently to discuss what he and Altium have been doing lately, where they came from (Australia) and what the future holds for Altium. This company has evolved from flying well under the radar during the acquisition frenzy of the ‘80s, to achieving a record $100 million in sales for fiscal year 2016.
Happy’s Essential Skills: Computer-Aided-Manufacturing, Part 1—Automation Protocols
I have addressed automation planning previously in this series, so I hope by now you realize the difference between ‘automation’ and ‘mechanization.’ In printed circuit fabrication and assembly, most of what is advertised is mechanization. But when you get to assembly test, then you begin to see true automated solutions.
Increasing Heat Dissipation in FPGAs
In recent years, the miniaturization and modularization of electronic products have led to the increased density of electronic components and the decrease of areas for effective heat dissipation. As a result, the thermal design of high-powered electronic components has become a major focus for electronics engineers. An effective solution for FPGA heat dissipation is critical. Thermal design of the PCB aims to decrease the temperature of both components and the board through suitable measures, so that the system is capable of working at a suitable temperature.
Orange Co. Designers Council Meeting Draws A Packed House
Speaker John Stine, VP of operations at Summit Interconnect’s Anaheim facility, gave a presentation on flex and rigid-flex design and fabrication. At least 75 electronics professionals listened as Stine, an expert in flex and rigid-flex technologies, discussed proper trace geometries, grounding, cover lay, adhesives, signal integrity, impedance control, book-bindings and much more in his 80-minute presentation.
The Many Voices Over the Past Year
In line with our "Voices of the Industry" theme this month, we're publishing this handy index of all of the interviews we've conducted over the past year with the movers and shakers, managers, entrepreneurs, and and rank-and-file designers and design engineers. In case you missed them, here's another bite of the apple, alphabetized by interviewee's last name. Enjoy!
Lightning Speed Laminates: Smaller Circuits--Material Properties and Thermal Issues
Coefficient of thermal expansion (CTE) is typically considered for PCB reliability, but it can also have an impact on circuit performance for applications exposed to varying temperatures. Due to CTE, a circuit will change physical dimensions when the temperature changes. If the circuit has small features or tightly coupled features, the physical change of the circuit dimensions can cause a shift in electrical performance.
Brooks' Bits: Your Traces Have Hot Spots!
The reasons for the temperature variation at high temperatures are not too hard to understand. There may be minor contamination under the trace or in the copper that accounts for it. Certainly, at higher temperatures (say above about 300°C) the board may begin to delaminate, severely disrupting its cooling characteristics. There may be small variations in trace width or thickness that help account for the delam, and these effects would be randomly distributed along the length of the trace.
Sensible Design: When Coatings Go Wrong
This month, I consider some of the more common, and often very frustrating, problems that may be encountered when coating electronic circuit boards and components. I also discuss some practical solutions. As we all know, nothing in life is straightforward.
Beyond Design: The Rise of the Independent Engineer
With the changing demographics, the old-timers in our industry—the master PCB designers—are about to retire and hand over the exacting job of PCB design to the Gen-X and Ys. These generations, shaped by technology, will tackle the most demanding designs without possessing the experience that we veterans benefit from. And to top it off, these up-and-coming designers will be degreed engineers who have to cope with both design and layout tasks as the specialized PCB designer’s positions are phased out.
New SI Techniques for Large System Performance Tuning
In this DesignCon paper, Donald Telian of SiGuys and Michael Steinberger and Barry Katz of SiSoft describe newly-developed techniques for equalization tuning and discontinuity reduction, offering additional design margin. Cost reductions are also achieved as new signal integrity techniques demonstrate performance parity, removing non-essential re-timers and PCBs layers.
Software Bytes: Having Fun With Impedance
About a year ago, I was assigned a new project: become an expert in impedance, more or less. I had no idea how much this research would bring out the nerd in me. Even if you don’t typically design controlled-impedance circuit boards, you probably will eventually. Read on!
Getting Signal Integrity Right by Design
As clock frequencies increase and active devices and interconnect traces shrink and are placed ever closer together, signal integrity becomes an increasing challenge. Today, SI is typically addressed late in the design process after the PCB layout has been completed by performing complex and time-consuming 3D extractions and simulations for high-speed lines. But with little attention being paid to SI during the layout process, simulation frequently identifies numerous SI problems.
Beyond Design: Mastering “Black Magic” with Howard Johnson’s Seminars
Dr. Howard Johnson, the world’s foremost authority on signal integrity, has recently released his High-Speed Digital Design (HSDD) Collection. I recently reviewed all three of the seminars in this collection, a total of 36 hours of viewing time. If you want to gain some of Dr. Johnson's enthusiasm and master the art of high-speed design, then the collection is a must-have.
Making Digital and Analog “Play Nice” at Peavey
Most guitarists have owned a Peavey Electronics amplifier or instrument at some point in their lives. Peavey originally drew accolades for their line-up of high-quality, budget-friendly products. Now the company also develops high-end instruments, amps, and live sound equipment. Peavey was also the last major American musical equipment maker to have product manufactured overseas. I met with Tom Stuckman, an electrical engineer at Peavey, during NAMM and asked him about the technical challenges he faces and what it’s like working at Peavey.
Designing With Tighter Tolerances
David Ledger-Thomas is a PCB design engineer with Honeywell Aerospace. He’s spent decades designing PCBs for a variety of applications, including defense, aerospace, computers, and high-performance audio. I asked David to share some of his thoughts on designing high-tech boards with increasingly finer spaces, traces and pitch.
Taylor Guitars Protected with Analog, RF Circuitry
Trenton Blizzard is an electrical engineer at Taylor Guitars and part of the team that developed the TaylorSense shock and climate change protection system. At the NAMM show, Trenton spoke with me, along with Editors Dick Crowe and Dan Feinberg, about this new device, and what it’s like being an electrical engineer for a “woodworking shop.”
From the CAM Shop: Tight Tolerance Design Tips
After you finish your design, it winds up in the hands of people like Mark Thompson, the man who runs the CAM department at Prototron Circuits in Redmond, Washington. He sees CAD data firsthand, and often has to address errors and inconsistencies in PCB designs. For this issue, we asked Mark to discuss the today’s tight tolerances, some of the problems they can cause PCB designers, and what designers can do when dealing with shrinking features.
The State of the Electronic Design Automation Nation
We are the automation nation. We are the high-speed demons, the low-frequency artists, the mixed-signal designers that make up the electronic design automation industry. We spend most of our working lives behind software, delivered to our fingertips with the promise of making things easier, faster, better, and getting us to our deadlines ever faster.
Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection
A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.
The Importance of Design for Profit (DFP)
In this interview, Interconnect Design Solutions’ Mike Brown and I took a few minutes during the recent Geek-A-Palooza event to discuss the importance of material selection and designing for profitability, how automation affects the design process, and the future of the design community.
Sensible Design: Coatings—Five Essentials for Designers
In an ideal world, PCB designs would not have an inherent weak point for corrosion; unfortunately, in the real world, they do. When a weak point is revealed, you are better equipped to deal with it. Often the spacing of components, board finish and distance to ground planes can be optimised for corrosion resistance.
Beyond Design: The Case for Artificial Intelligence in EDA Tools
There has been a lot of activity in the field of artificial intelligence recently, with such developments as voice recognition, unmanned autonomous vehicles and data mining to list a few. But how could AI possibly influence the PCB design process? This month, Barry Olney will take a look at the endless possibilities.
EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry
Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.
IPC President John Mitchell Discusses IPC's Footprint in China
At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.
EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry
Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.
Institute of Circuit Technology Annual Symposium
On June 1, Technical Director Bill Wilkie introduced the 42nd Annual Symposium of the Institute of Circuit Technology, at the Motorcycle Museum in Birmingham, UK, commenting upon the success of the recent Foundation Course and acknowledging the sterling efforts of his course tutors, although recognising that some of his longest-standing experts were now retiring.
EDA Tools: Automation vs. Control
Stephen V. Chavez, CID+, is currently the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS). He's also a frequent speaker at the IPC APEX EXPO Design Forum. I caught up with Stephen and asked for his thoughts on the EDA tools of today, and whether he’d prefer to have more control vs. more automation.
DownStream: What a Long EDA Trip it’s Been
No doubt about it: DownStream Technologies co-founder Joe Clark is an EDA veteran, with a history that dates back to the very beginning of EDA tools through the merger madness of the late ‘90s and beyond. I sat down with Joe during IPC APEX EXPO, and asked him about some of the changes he’s seen, and the direction of DownStream as it enters its 15th year.
The Shaughnessy Report: The Designer Roundtable Roundup
Every year, I attend SMTA Atlanta, just across town. You have to love a local trade show. No airlines, no jet lag, and no hotels. It’s a small show; it would fit in a school gymnasium. But for me, the highpoint of SMTA Atlanta is the Designers Roundtable. This year the roundtable had 15 attendees, up from 12 last year. Two of the new attendees were under 35, which surprised all of us "graybeards."
Design Automation Tools, Today and in the Future
Kelly Dack has been designing PCBs for over three decades, at OEMs of all kinds. Now a PCB designer with a Washington state contract manufacturer, Kelly enjoys waxing philosophic about PCB design and design automation in general. I asked Kelly about the direction EDA tools are headed, and whether he’d like to see more control, or more automation in his PCB design tools.
Beyond Design: DDR3/4 Fly-by vs. T-topology Routing
JEDEC introduced fly-by topology in the DDR3 specification for the differential clock, address, command and control signals. The advantage of fly-by topology is that it supports higher-frequency operation, reduces the quantity and length of stubs and consequently improves signal integrity and timing on heavily loaded signals. Fly-by topology also reduces simultaneous switching noise (SSN) by deliberately causing flight-time skew.
Designers and Design Engineers: Two Sides of the Same Coin
Andy and Sue Critcher have been the lead designers at Total Board Solutions Limited, a UK-based design bureau, since its founding in 1998. I asked Andy to share his opinion about the friction between some PCB designers and their engineers, and what can be done to improve communications between these groups.
Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 6
The designer is generally under pressure to release the documentation and get the flexible circuit into production. There is, however, a great deal at risk. Setting up for medium-to-high volume manufacturing requires significant physical and monetary resources. To avoid potential heat from management, the designer must insist on prototyping the product and a thorough design review prior to release.
The Partnership: Design Engineers and PCB Designers
Randy Faucette is founder, president and director of engineering at Better Boards Inc. in Cary, North Carolina. I asked Randy to talk about some of the occasional tension between PCB designers and design engineers, and what he thinks can be done to help open the lines of communication.
SiSoft: Optimizing the State of the Art
In the 20 years since its founding, SiSoft has been at the forefront of signal integrity analysis tool development. Now, the company is leading the way with a new technology called OptimEye and tools for creating accurate IBIS-AMI models. Todd Westerhoff, VP of semiconductor relations, gives us an update on the company’s newest technologies.
Behind the Scenes: Adcom’s TLA Award-Winning Design
Adcom’s design team placed first in this year’s TLA program, taking the top spot for the category of “Computers, Blade & Servers, Memory Systems.” This board, like most PCBs today, is a complex system designed by a multi-disciplinary team of designers, striving to bring an operational product to the market on schedule.
Working With Circuit Design Engineers
Until the late 1980s, many PC board designers were converted technicians, mechanical designers, and artists who learned to read a schematic and mastered artwork taping. The EEs would often share their opinions, but you could listen to them or ignore them and the circuit would likely function either way. This era created some tension between designers and their EE counterparts, because they completely ignored each other’s ideas.
EMA is Bullish on Data Management
EMA Design Automation has evolved over the years, from a typical Cadence Design Systems VAR to a distributor that functions more like a part of Cadence. During DesignCon, I met with Greg Roberts, director of marketing for EMA, and asked him to discuss the company’s focus on data management tools, and why he’s giving away certain OrCAD tools.
Quiet Power: Dynamic Models for Passive Components
A year ago, my Quiet Power column described the possible large loss of capacitance in multilayer ceramic capacitors when DC bias voltage is applied. However, DC bias effect is not the only way we can lose capacitance. Temperature, aging, and the magnitude of the AC voltage across the ceramic capacitor also can change its capacitance. This column will provide all of the details.
IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda
IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”
Design Strategies for Success—and Profit
In today’s economic environment, making money on a project is getting more and more challenging. Those years when businesses like mine were practically printing money are long gone. If you are under 30 years old, you probably do not have this point of reference; it’s been one downturn after another for your entire adult life. But for us older folks, times were really good back then. So, what happened? You happened, as well as a million others like you. In other words, the market is a little cramped now and much more competitive, which dilutes our profit per project.
Brooks' Bits: How Many Vias Does It Take To…?
During 2015, I enjoyed a very productive collaboration with Dr. Johannes Adam, from Leimen, Germany. This resulted in several papers, but one in particular is relevant for this column, “Via Currents and Temperatures.” In that paper, we used a simulation tool, thermal risk management, developed by Dr. Adam, to simulate current flowing through a via and then determine the temperature of the via. Read on to find out how our results contradicted conventional wisdom.
Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1
In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.
Beyond Design: The Need for Speed—Strategies for Design Efficiency
Years of experience with one EDA tool obviously develops efficiency, whether the tool be high-end feature-packed or basic entry-level. And one becomes accustomed to the intricacies of all the good and bad features of their PCB design tool. However, there comes a time when one should really consider a change for the better to incorporate the latest methodologies. This month, I will look at productivity issues that impede the PCB design process.
RTW IPC APEX EXPO: Mentor Graphics Takes Manufacturing Operations to the Next Level
Dan Hoz, general manager of Mentor Graphics Valor Division, discusses with I-Connect007's Andy Shaughnessy how they are helping electronics manufacturers take their operations to the next level through their Valor IoT Manufacturing solutions. He talks about the OML and the Valor IoT Device, and how these solutions will help the electronics manufacturing industry to move to Industry 4.0.
Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 5
The outline profile of the flexible circuit is seldom uniform. One of the primary advantages of the flexible design is that the outline can be sculpted to fit into very oblique shapes. This month, Vern Solberg focuses on outline planning, physical reinforcement, and accommodating bends and folds in flexible and rigid-flex circuits.
Wild River: Simplifying SI so Engineers Can Focus on Design
Al Neves is founder and chief technologist of Wild River Technology, and he’s a signal integrity engineer who likes to tell it like it is. So when I bumped into Al during DesignCon, I asked him to sit down for an interview. We discussed the paper he co-wrote for DesignCon and the challenges SI engineers are facing, as well as Wild River’s efforts to take the black magic out of signal integrity.
RTW IPC APEX EXPO: Geek-A-Palooza Coming to S. California May 12
Steve Williams sits down with Geek-A-Palooza founders Tara Dunn and Judy Warner to discuss their upcoming event in Irvine, California on May 12. The Geek-A-Palooza held in Minneapolis last year drew over 300 PCB designers, fabricators, assemblers and suppliers. Tara and Judy explain why this is not just another boring technical talk, and attendees will definitely enjoy themselves.
Steinberger Talks PAM4, the Next Generation of Modulation
I recently interviewed our old friend Michael Steinberger, SiSoft’s lead architect for serial channel products. Steinberger is always a great interview; he breaks down complex signal integrity simulation technology in ways that are simple and often humorous. Steinberger sat down and discussed a paper he presented at DesignCon, and some of the challenges his customers are facing.
RTW IPC APEX EXPO: Mentor Graphics Makes Internet of Manufacturing Affordable
Michael Ford, marketing development manager at Mentor Graphics, and I-Connect007 editor Andy Shaughnessy discuss the Open Manufacturing Language (OML), the challenges in supporting the hundreds of thousands of machines that are out there at shopfloors already, and how Mentor is making the Internet of Manufacturing affordable for everyone in the PCB assembly supply chain.
IPC APEX EXPO: Isola Introduces New Products, Increases R&D
Ed Kelley, VP of global technology, sits down with Guest Editor Dan Beaulieu at IPC APEX EXPO to discuss the company's plans for the future. The company is launching new low-loss laminates and increasing its R&D activities around the globe. He also explains why Isola often works with designers at OEMs.
IPC APEX EXPO: Gary Carter on First Board Manufactured With IPC-2581B
Gary Carter, senior manager of CAD engineering for Fujitsu Network Communications, discusses the first board fabricated and assembled using IPC-2581B. This 20-layer board features 21,000 component pins and 15,000 holes, with controlled impedance on all layers. He also gave a presentation on IPC-2581B during the Design Forum.
Standard of Excellence: Tips for Finding a Great PCB R&D Partner
This new column, Standard of Excellence, represents a cooperative writing effort by a team of experts at American Standard Circuits. This month, we begin with CEO Anaya Vardya, who focuses on R&D. In his piece, he provides his insights on what characteristics to look for in a good R&D PCB fabrication vendor partner, and a few things that are expected of them to do for you.
Catching up with…PNC: Open House Planned for May
I’m a great believer in open houses. Any time customers and vendors get together to learn and talk about what they can do for each other it’s a good thing. That’s why, when I heard that PNC, in Nutley, New Jersey, planned to hold an open house on May 20, I wanted to learn more about it. So I called my friend Sam Sangani, the company’s owner, to learn more about it.
Walt Custer Elaborates on his Annual IPC APEX EXPO Forecast Presentation
IPC APEX EXPO 2016 has come and gone, and this year, Walt Custer’s annual presentation forecasting the upcoming year for the industry was much anticipated, as always. I met up with Walt at the show to learn about his presentation and dig deeper into his findings.
IPC APEX EXPO: Electrolube to Educate PCB Designers on Coatings
Phil Kinner, technical director of coatings for Electrolube, discusses a paper on condensation testing that he presented at IPC APEX EXPO, and his plans to educate PCB designers about conformal coatings to help them avoid problems during manufacturing.
The PDN Bandini Mountain and Other Things I Didn’t Know I Didn’t Know
Originally, Bandini Mountain referred to a mound of fertilizer built by the Bandini Fertilizer Company in California prior to the 1984 Los Angeles Olympics. When the company went bankrupt, this mound of fertilizer was left behind. Steve Weir coined this term to describe the large resonant frequency peak formed by the parallel combination of the on-die capacitance and the package lead inductance, as seen from the die looking into the PDN.
Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 4
All of the design rules for the glass reinforced-portion of the board (land pattern geometry for mounting surface mount devices, solder mask and the like) are now well-established. One unique facet of fabricating the rigid-flex product is how the flexible portion of the circuit is incorporated with the rigid portion of the circuit. As a general rule for multilayer PCB design, furnish a balanced structure by building up the circuit layers in pairs (4, 6, 8 and so on).
IPC APEX EXPO: Prototron Works with Customers to Stay on Top
Prototron Circuits Operations Manager Mike Graves explains how his company's focus on customer service, including helping with PCB designs, has made Prototron "America's Board Shop." He also discusses their expansion into flex and HDI technology, and their efforts to achieve AS9100 certification.
IPC APEX EXPO: IPC's Fern Abrams Provides Updates on RoHS, REACH Directives
Fern Abrams, director of regulatory affairs and government relations at IPC, discusses with I-Connect007's Stephen Las Marias the latest updates on the changes happening in the RoHS and REACH directives this year, as well as IPC's new initiatives and advocacies.
IPC APEX EXPO: Clyde Coombs Discusses the New Printed Circuits Handbook
In this interview that was shot during the IPC APEX EXPO 2016 in Las Vegas, Nevada, Clyde Coombs discusses the latest edition of the Printed Circuits Handbook, which was published this week. The seventh edition, co-edited with Happy Holden, includes new sections on supply chain management and PCB design, with a chapter on EDA tools by Design007 Editor Andy Shaughnessy.
IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials
Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks. The paper looks at high-frequency offerings from a variety of materials providers.
Mark Thompson: It’s All About Communication
In engineering support at Prototron Circuits, Mark Thompson has seen it all. He ensures that each design is manufactured the way the designer intended, even if the CAD data is not crystal clear. During DesignCon, Barry Matties and Andy Shaughnessy talked with Thompson about why communication is paramount when designing and prototyping boards. Thompson also explained how designers can avoid making common mistakes that can set back an entire project.
Beyond Design: Faster than a Speeding Bullet
In optical communications, electrons don’t carry the signal—photons do. And we all know that photons travel at the speed of light. So surely, optical fibers must transmit information much faster than copper wires or traces on a multilayer PCB? Actually, photons and electrons transmit data at the same speed. The limiting factor is the relative permittivity (dielectric constant) of the medium in which the signal propagates.
DuPont, Taconic and PFC Team Up For High-Speed Flex
At DesignCon, I sat down with three flex circuit specialists: Glenn Oliver of DuPont, Tom McCarthy of Taconic, and Steve Kelly of PFC Flexible Circuits. Our discussion covered a lot of territory, most notably the findings they described in the paper they were about to present later that day at DesignCon, and the future of flex, as they see it.
Enhancing Thermal Performance of CSP Integrated Circuits
In order to meet size and weight requirements, constraints of portable electronic designs often force PCB designers to reduce the size of components and PCB real estate area. To meet these demands, the use of CSP packages to shrink the PCB area needed is a common change in designs. As a result of the reduction of total PCB area, the available options to move heat and route high-power PCB traces is also reduced. Furthermore, the thermal performance cannot be matched when a QFN is compared to an equivalent CSP package.
The Shaughnessy Report: Doing My Part for Medical Electronics
One interesting aspect of having hernia surgery recently was the number of PCBs in the operating room. I’ve never seen so many electronic devices together in my life. I saw one Agilent monitor, and a bunch of others with names I couldn’t make out. It reminded me of the IT room in most companies. I guess they had to be set up to handle routine surgery like mine, and the not-so-routine operations as well. Medical electronics is doing fine, no doubt.
Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 2
In this installment of "Designers Notebook," Vern Solberg discusses supplier assessment, planning of the flexible circuit outline, and various circuit routing principles. Communication between designer and fabricator is paramount, as well as an understanding of IPC-2223, which sets the specific requirements for the design of flex circuits.
American Standard Circuits: Leading the Way in Medical Electronics
When it comes to innovative fabricators, American Standard Circuits is always at the front of the pack. Naturally, when Editor Andy Shaughnessy asked me to interview a fabricator about PCBs for the medical market, ASC was the one company that immediately came to mind. I spoke with CEO Anaya Vardya about fabricating medical PCBs, the medical electronics market, and the future of this fast-growing segment.
Fabrication Drawings and Electrical Test— Reading the Fine Print
When a new PCB design is born, designers envision what the product will provide when completed. Whether the product is for the consumer, aerospace, military, medical or countless other markets, the designers—or more likely, the customers—expect certain deliverables on the commodity they wish to purchase.
Beyond Design: Plane Crazy, Part 2
In my recent four-part series on stackup planning, I described the best configurations for various stackup requirements. But I did not have the opportunity to delve into the use of planar capacitance to reduce AC impedance at frequencies above 1GHz, which is the region wherein bypass and decoupling capacitors dramatically lose their impact. In this column, I will flesh out this topic, and consider the effects of plane resonance on the power distribution network (PDN).
New Year, New Outlook for the Electronics Manufacturing Industry
As an advocate for the electronics manufacturing industry, my job is to educate and encourage policymakers to create a favorable legislative and regulatory environment for advanced manufacturing to grow and succeed. From that perspective, I think we should be proud of the significant progress we made in several areas in 2015.
Medical PCB Design: Not Just Another High-Rel Board
Some of the coolest new electronic products have come courtesy of the medical market. I wanted to find out more about this fast-growing segment, so I contacted Kenneth MacCallum, an engineering physicist with StarFish Medical. MacCallum, an engineering physicist who designs PCBs for medical applications, explained why medical PCBs are not quite like other high-reliability boards.
Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools), Part 2
The statistical representation of Six Sigma describes quantitatively how a process is performing. To achieve Six Sigma, a process must not produce more than 3.4 defects per million opportunities. A Six Sigma defect is defined as anything outside of customer specifications. A Six Sigma opportunity is then the total quantity of chances for a defect.
Systematic Estimation of Worst-Case PDN Noise: Target Impedance and Rogue Waves
In the dark ages of power distribution design, the typical advice was to use a bulk capacitor and one 0.1uF bypass capacitor for every power pin on the digital circuit. This was very unscientific, but served the industry reasonably well in low-density and low-speed circuits. As the designs got more demanding, the target impedance concept was developed. Using a target impedance, designers had a metric and a design goal to guarantee that the voltage transients stay within specified limits.
Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 1
In his new Designers Notebook column, Verb Solberg discusses primary flex circuit structures, proper design for operating environment, and base material selection. The design guidelines for flexible circuits, although similar to those for rigid circuits, have distinctive differences that are influenced by specific applications and the intended operating use environments. Communication with your fabricator is paramount when designing flex and rigid-flex circuits.
IPC Designers Council Viewpoint: Gary Ferrari
As co-founder and longtime executive director of the Designers Council, Gary Ferrari has dedicated a big part of his career to PCB design. After decades of service, he was inducted into the IPC Hall of Fame at IPC APEX EXPO this year. I caught up with Gary and asked him to fill us in on the creation of the Designers Council, and some of the changes he’s seen in the last 24 years.
Lightning Speed Laminates: Why Do Different Test Methods Yield Different Electrical Values?
A variety of different test methods may be used for any one electrical concern. This article will discuss the issues related to determining the dielectric constant (Dk) and dissipation factor (Df or Tan-Delta). On a data sheet, a designer may see a Dk value for a material to be 3.5, as an example. Once the designer buys the material and performs necessary evaluations, it may be found that the Dk of the material is 3.8. In some applications this difference in Dk is probably not meaningful; however, for many RF and high-speed digital applications, this difference could be very significant.
IPC Designers Council Viewpoint: Mike Creeden
When covering the IPC Designers Council, one quickly learns that it’s the volunteers who make the train run on time. San Diego PCB CEO Mike Creeden, CID+, is one such volunteer, and as a member of the Designers Council’s Executive Board, he was a must-have for this issue. I tracked him down and asked him to give us a rundown of his involvement with the DC, and to explain why designers might want to get involved with their local DC chapters.
Electrical Design Challenges for Automotive PCBs
A recent article in this magazine by Monica Andrei of Continental Automotive Systems emphasized the systemic nature of an automobile and discussed the characteristics and adoption of software design tools to enable such system-level design. Recognizing that electrical challenges are part of the automotive system-level discussion, this article will present more detail on signal integrity. Future discussion is planned regarding EMI, power integrity, and thermal integrity.
Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools): Part 1
In this first of many columns covering my "Twenty-Five Essential Skills Every Engineer Needs to Learn," I will expand on each of those skills. To read the introduction to this series, which published in the January issue of The PCB Magazine. As a quick recap, here are the 25 skills that I will be writing about over the next 18 months or so, to publish every three weeks or so in the PCB007 Daily Newsletter.
McCurdy: How to Build a Successful IPC Designers Council Chapter
When Scott McCurdy made his transition from PCB fabrication to a PCB layout focus about 13 years ago, he accepted an invitation to attend our local IPC Designer’s Council. Shortly after, he was recruited to serve on the group’s steering committee. At that time, 20–25 people were regularly attending the meetings. When the chapter president moved, he asked Scott to take his place. Now, Orange County chapter meetings often draw close to 100 attendees.
IPC Designers Council: Serving PCB Designers for Almost 25 Years
You may have seen Anne Marie Mulvihill at the Design Forum during IPC APEX EXPO, rounding up speakers with a sarcastic comment or two. As PCB design program manager for IPC, Anne Marie makes the design train run on time. When I told Anne Marie that we were covering the Designers Council for this issue, she jumped at the chance to help us.
Beyond Design: Plane Crazy, Part 1
A high-speed digital power distribution network (PDN) must provide a low inductance, low impedance path between all ICs on the PCB that need to communicate. In order to reduce the inductance, we must also minimize the loop area enclosed by the current flow. Obviously, the most practical way to achieve this is to use power and ground planes in a multilayer stackup. In this two-part column, I will look at the alternatives to planes, why planes are used for high-speed design, and the best combination for your application.
Industry 4.0: Creating a Standard
Mentor Graphics Valor Division's Dan Hoz, general manager, and Ofer Lavi Ben David, product line director, discuss where Industry 4.0 is taking the industry, and the changes it will bring to both large and small companies, customers, and the supply chain, including how Mentor connects different machines on the shop floor to provide universal Industry 4.0 visibility.
IPC Designers Council Viewpoint: Rick Hartley
Rick Hartley has been in involved in PCB design and design education for decades, so it’s no surprise that he started working with the IPC Designers Council early on. Now retired from his day job at L-3, Rick still teaches PCB design and shows no sign of slowing down. I asked him to discuss his work with the Designers Council, and what the group means to the design community.
The Shaughnessy Report: Are You Drowning in Data?
Data management was so much simpler during the days of Mylar and Bishop Graphics tape. Data was handwritten. All you had to do was keep track of your paperwork and you were golden. Now, you’re all much more productive, but you have data coming out of your ears; slowly but surely, incrementally, data has become much more complicated. How do designers and engineers wind up managing all of this data? With kluged-together processes and software tools, and the occasional handwritten notes.
IPC: Connecting Electronics Industries
John Mitchell, president and CEO of IPC—Association Connecting Electronics Industries, provides the basic overview of the association—its goals and basic mission, activities, and how it best serves its membership. He also provides a snapshot of how IPC promotes technology development in the industry through standardization.
DownStream Takes on Data Documentation Management
Most designers will tell you that, as much as they enjoy laying out boards, they dislike the final data documentation step, which often involves various formats, including handwritten notes. Enter DownStream Technologies, a company founded 14 years ago to address the challenges related to post-processing the design. Senior Product Marketing Manager Mark Gallant recently discussed the company’s efforts to take the pain out of data documentation, even as data becomes more complex.
Mentor Graphics: The Past, Present and Future of Analytics
Farid Anani, consulting manager with Mentor Graphics' Valor Division, discusses with I-Connect007's Andy Shaughnessy a paper he presented at SMTAI that focused on analytics and how it can be used to increase business revenue. He also talks about how far analytics has come in the last 20 years and where it may be headed in the future.
The Key to Understanding Industry 4.0: Show, Don’t Tell!
At the recent productronica event in Germany, Mentor Graphics set up a racecar track in their booth. In an interview with I-Connect007, Michael Ford, senior marketing development manager at Mentor's Valor Division, explains why it's a perfect analogy for understanding Industry 4.0.