Article Highlights
Just Ask Happy: Manufacturing Issues From a Designer’s Viewpoint
07/23/2020 | I-Connect007 Editorial Team
With App Notes, Trust But Verify
07/20/2020 | Andy Shaughnessy, Design007 Magazine
Book Excerpt: Power Integrity By Example, Chapter 5
07/16/2020 | Fadi Deek, Mentor, a Siemens Business
What Is the Proper Role of App Notes?
07/15/2020 | I-Connect007 Editorial Team
But Wait, There’s More Happy-ness: Happy Holden Wants Your Questions
07/15/2020 | I-Connect007 Editorial Team

Latest Articles

The State-of-the-Art in PCB Pre-production Engineering

If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.

RTW SMTAI: Judy Warner Discusses AltiumLive: 2017 and Her New Role

At SMTA International in Rosemont, Illinois, Judy Warner of Altium discusses her new role as director of community engagement. She also details AltiumLive: 2017, which takes place October 3-4 at the Hilton San Diego Resort and Spa. AltiumLive features Happy Holden and Charles Pfeil, as well as a robot design challenge and battle.

Fault-Finding: It’s All About Prevention, not Blame

There are thousands of things that can go wrong during the design and manufacture of a PCB assembly. One might say that it is an absolute miracle when a PCB goes through all of its phases—design, fabrication and assembly—and operates successfully. But there are some management and customer cultures who naively attempt to resolve problems by seeking out the culprits and shouting “Off with their heads!”

Whose Fault is That Bad Board?

Years ago, I held a position in an EMS company where projects were analysed before manufacturing. We found that even some of the best and most innovative circuits could not be manufactured. Why? Because the PCB designer, an electronic engineer, was not acquainted with the fabrication process. He had no idea about technological requirements necessary for electronic production. I know another designer who learned, finally, the importance of the thermal relief pad for heat restriction during reflow for a good soldering. His response? “Oh, was that what they were for? And to think I worked so much to remove them!”

Enough Blame to Go Around

The idea for this article began a few months ago when The PCB Design Magazine conducted a reader survey regarding the topic “Whose Fault is that Bad Board?” After some thought, I submitted my answers. After all, I must have some kind of input after over 25 years of PCB design. But still, whose fault is that bad board? OK, I know what you’re thinking: Don’t go there. We designers make mistakes too.

The International Paris Air Show with ASC’s Anaya Vardya

The International Paris Air show is the crème de la crème of the world’s trade shows. This is the big one, where all the aircraft, airline and defense aerospace companies meet to introduce new products, discuss the future of aviation, and make deals. This year I decided to talk to my friend Anaya Vardya, ASC’s president and CEO, about the show, why he goes and what it’s like.

Resins: Cutting Through the Technical Jargon

This month, I’m going to cut through some of the more heavy-going tech-speak, taking a few of my customers’ more frequently asked questions about resins to try to help you refine your selection process. There’s a lot of ground to cover, but for the purposes of this column, let’s concentrate on the PCB’s operating environment, caring for the components that are to be encapsulated, and the special needs of applications like LED lighting and RF systems.

New Challenges Facing Mil/Aero Segment

For this month's issue, we invited a sampling of professionals whose experience centers on the electronics industry in the military and aerospace world, including experts from design, PCB manufacturing, and the assembly arena to sit down with us for a frank discussion. Our discussion centered on the challenges associated with military work, including the new regulatory requirements for cybersecurity, dealing with leaded vs. lead-free components, and the differences and similarities with the commercial world.

Stephen V. Chavez Talks Mil/Aero PCB Design

Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.

Orange Co. Designers Council Meeting Focuses on Embedded Passives

On July 19, the Orange County Chapter of the IPC Designer’s Council hosted a lunch-and-learn meeting in Tustin to discuss the benefits of embedded passives. Approximately 40 people were in attendance, which was lighter turnout than usual, most likely because of summer vacations. But the crowd was an enthusiastic one, as usual. The first speaker was Bruce Mahler of Ohmega Technologies, followed by Jin Hyun-Hwang of Dupont.


Trilogy Circuits: Mil/Aero Demands Technological, Regulatory Expertise

In the 16 years since its founding, Trilogy Circuits has become one of the go-to companies for mil/aero PCB design and manufacturing. I spoke with Charlie Capers, president and founder of the Richardson, Texas firm, about how he keeps ahead of the game. As he explains, succeeding with mil/aero PCB work requires not only mastery of the technological side, but of the regulations and certifications as well.

IMPACT Interview: Fern Abrams, IPC

At the recent IMPACT Washington D.C. 2017 event, I-Connect007's Patty Goldman speaks with IPC's Fern Abrams to get the inside story on the meeting with EPA.

Using Vibration and Acceleration Analysis to Improve Reliability

Deriving the physical constraints and fatigue issues for a design prior to manufacturing is essential to reducing board failure and thereby improving product quality. In harsh environments, fatigue can be responsible for up to 20% of failures. Customers have come to expect reliability across the industry spectrum no matter where actual production occurs. Reliable products have less risk of failure, less field returns and less warranty claims, all of which contribute to higher profitability. It is a given that every product is expected to fail at some point, however premature failures can be mitigated through proper design with attention to potential issues due to vibration and acceleration.

PCB Designers Notebook: Embedding Components, Part 2

Technology and processes for embedding capacitor and inductor elements rely on several unique methodologies. Regarding providing capacitor functions, IPC-4821 defines two methodologies for forming capacitor elements within the PCB structure: laminate-based (copper-dielectric-copper) or planar process and non-laminate process using deposited dielectric materials.

Performance Evaluation of Thin-Film Embedded Resistors

Thin-film microstrip circuits have been widely applied in microwave communications, electronic countermeasures (ECM), and aerospace applications, etc. When manufacturing thin-film ICs, it is very important to apply deposited thin-film resistor material to fabricate high-accuracy and highly stable thin-film embedded resistors. Thin-film ICs call for thin-film resistors that meet stringent requirements.

Review of the 2017 IPC Reliability Forum

IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.

Embedded Technology: A Useful Tool in Freedom CAD’s Toolbox

Freedom CAD has been designing and fabricating boards with embedded technology for years, and doing some pretty innovative work along the way. I asked Scott McCurdy, Freedom CAD’s director of sales and marketing, to share some details about their embedded processes, as well as the challenges and opportunities that embedded technology offers.

A Deep Look Into Embedded Technology

In preparation for this month’s magazine, we set up a conference call with the goal of uncovering the challenges and opportunities related to embedded technology. Invited were a handful of the industry’s heavy hitters in the embedded world: Retired technologist and I-Connect007 Contributing Editor Happy Holden, and Ohmega’s Technical Director Daniel Brandler and Design & Test Engineer Manuel Herrera.

Launching a New PCB Design Curriculum in Serbia

Let me share with you an experience that I remember from my college days. When I was a student, I had a professor who was too proud of the fact that she was an academic. “You don’t need to know how to manually solder electrical parts or how to design printed circuit boards,” she lectured. “It is important that you understand the formula for charge carrier currents in a p-n junction.” I started working as an R&D engineer for a Swiss company that developed and manufactured instruments for measuring magnetic fields and electrical currents. And nobody ever asked me about charge carriers in p-n junctions.

Technology Enabler Highlights Benefits of Having Design Services for an EMS Firm

At the 14th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) held last week in Manila, Robin Ramiso, design and development manager at Technology Enabler, discusses their activities, and the benefits of having a design services team for an EMS company with I-Connect007 Managing Editor Stephen Las Marias.


Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

Romania’s PCB Design Students Compete at TIE 2017

During the last week in April, the 26th Interconnection Techniques in Electronics (TIE) show was held at the Gheorghe Asachi Technical University in Iasi, Romaina, a wonderful hill town not unlike Rome. The event, a convention for the Romanian electronic packaging community, included a series of actions designed to draw smart young students to the electronics industry, which is clearly growing. Participants had only four hours to create this PCB design, which was generated by a team of professionals from Continental Automotive Romania Timisoara.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

Must Work Well on a Team; CID a Bonus

Throughout my decades-long career in PCB design, I have been fortunate. I’ve only had to search for a job out of desperation once. I had no idea my IPC Certified Interconnect Designer credentials would come in handy when I hit the pavement. It also helped that I am known to "work well on a team." It turns out that being able to play well with others is a real plus in the PCB design community.

Whose Fault is it When the Board Fails?

In an upcoming issue of The PCB Design Magazine, we will discuss a question that you've undoubtedly faced in your job: Whose fault is it when the board fails? Of course, everyone likes to blame the PCB designer. But think about it. Is the board shop at fault, or perhaps the EMS provider? Is it the customer's fault, or does the designer bear some of the blame after all? Take this quick survey and let your voice be heard!

HDP User Group 2017 European Meeting Highlights Technology Progress

The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.

PCB Design in the Age of IoT

From the early days of printed circuit boards, the electronics industry has made huge strides in board materials, copper printing methods, miniaturization, rigid-flex, ELIC, EDA, and much more. Many of the devices we use in our homes, our vehicles, and in our workplaces would not be possible without this continuous evolution of PCB design and technology. And yet in 2017, we are poised to shift from evolution to revolution, driven by the idea of the Internet of Things.

SnapEDA: Recruiting Top Engineering Talent in an Amazon World

You don’t have to love EDA to work at SnapEDA, but it helps. This startup, founded by Natasha Baker, is on its way to creating the world’s largest parts library for PCB designers. Baker leads a small team of young, fiercely talented engineers—the kind of employees that are attractive to companies like Google and Facebook. I asked Natasha to explain her hiring process, and how she ensures that each employee is the right fit for SnapEDA.

Steve Robinson Discusses APCT’s Tenfold Expansion

Steve Robinson, CEO of APCT, a PCB fabricator in Silicon Valley, has led the company to impressive growth since he acquired it nearly 10 years ago. I ran into Steve at DesignCon 2017, and we sat down to discuss the company’s remarkable transformation and his focus on working with PCB designers and engineers to create advanced, high-speed PCBs.


Altium Focuses on the Designer First

A few months before Judy Warner joined Altium, while she was still with I-Connect007, she sat down with Lawrence Romine to discuss the company’s drive to satisfy the individual PCB designer, and not necessarily the OEMs who employ them. Romine also explains what sets designers and engineers apart from the average person, and why some Altium users have a different primary EDA tool, but use Altium when they need a design done fast.

San Diego IPC Designers Council Meeting Held at Del Mar Show

The Del Mar Electronics and Manufacturing Show is a long-time favorite among PCB professionals. What better place to hold a meeting of the San Diego Chapter of the IPC Designers Council? Each year, the San Diego Chapter of the Designers Council hosts their largest meeting of the year at the Del Mar show. This year, approximately 50 PCB designers and electronics professionals attended the lunch-and-learn meeting.

Bruce Mahler Discusses Ohmega’s Resistive Material Technology

Bruce Mahler, vice president of Ohmega Technologies, sat down for an interview with me at DesignCon 2017. He discussed the company’s latest embedded resistive materials, as well as some of the drivers and challenges in that segment of the materials industry.

Sensible Design: Casting a Spotlight on Resin Applications

Over the last few columns, I’ve given readers pointers on virtually every aspect of potting and encapsulation resins, ranging from their formulations and special properties to their applications, benefits and limitations. It’s probably high time, therefore, to take a step back from the do's and don’ts and focus instead on how these resins are bringing very real benefits to practical electronic and electrical engineering applications. A good starting point is to look at the special requirements of an industry that is enjoying explosive growth: LED lighting.

IMPACT Washington 2017 Just Around the Corner

IPC's Government Relations team has worked around-the-clock to ensure that IMPACT Washington D.C. 2017 is the best yet. During this two-and-a-half day event, executives from IPC-member companies will have the opportunity to speak with leaders in Congress and the Administration in support of our common priorities.

TTM Shines a Light on Optical Interconnect

Are embedded optics on PCBs set to make a breakthrough in the upcoming years? According to Dr. Craig Davidson, VP of Corporate Technology at TTM, it might be closer than you’d expect. In a recent interview with the I-Connect007 team, Craig outlines TTM’s current pursuit of high-volume manufacturing lines able to deliver embedded optical interconnect, what that would mean for the PCB industry, and why he thinks there will be manufacturing production capability by 2020.

'Flexdude' Tom Woznicki Celebrates Company’s 25th Anniversary

Twenty-five years ago, Tom “Flexdude” Woznicki got laid off. A lot of people did, back during the mini-recession that helped bring Bill Clinton into the White House. So, he launched his own flex circuit design bureau and never looked back. Since then, he’s designed flex circuitry for everything under the sun, including the Mars Rover; the flex circuits he designed are visible in many of the Rover photos. I ran into Tom at DesignCon 2017 and we discussed the benefits of flex circuits, the expansion of the flex market, and his company’s first quarter-century in operation.

China High-Speed PCB Market Update with Polar's Simon Chan

During the recent CPCA Show in Shanghai, Editor Stephen Las Marias and Polar Instruments (China) Assistant Manager Simon Chan discussed the opportunities and challenges for Polar's customers in the Asia-Pacific region, as well as the current state of the high-speed PCB market in China.

Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017

Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.

Rigid-flex Design Tips and Best Practices

While the traditional “design-separately-then-assemble” approach minimized potential issues with the flex portions of the product, it also had several inherent disadvantages. These include the cost associated with the physical connectors; the space required for the physical connectors; the need to properly manage interconnects that have to transition between the separate rigid and flex PCBs (through the connectors); and, of course, the time and cost associated with assembly. The move to the current generation of rigid-flex technology mitigates these issues; however, they are replaced with a different set of challenges and concerns.


Perpetual or Subscription EDA Tool Licenses? That is the Question

After I began working at Altium, I started learning all I could about PCB design software licensing. I wondered about the pros and cons of perpetual vs. subscription licenses. I wanted to learn firsthand from PCB designers what kind of benefits they received and challenges they faced as a result of how EDA companies offered design tools. I reached out to a variety of sources to get a broad slice of insight into this evolving issue, and thus began my trip down the EDA licensing software rabbit hole.

Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017

When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.

Mentor Graphics Takes Best Paper Award at DesignCon

At DesignCon, I met with Dave Kohlmeier, senior product line director for Mentor Graphics. We discussed their Best Paper award and DesignCon sessions such as the Signal Integrity Boot Camp, as well as the new rigid-flex capabilities found in the HypeLynx suite.

Capitol Connection: Direct Legislative Action—IMPACT Washington, D.C. 2017

This ties in to why IPC–Association Connecting Electronics Industries invests so much into our government relations efforts. We place a high priority on government relations because so many public policy debates have large impacts on our industry. Our members continue to value our advocacy efforts on issues such as taxes, regulations, immigration and the environment.

A New Power Design Methodology for PCB Designs

Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.

Tom Hausherr Discusses PCB Libraries’ BOM Builder Service

PCB Libraries CEO Tom Hausherr and Editor Kelly Dack discuss PCB Libraries’ new BOM Builder service during IPC APEX EXPO. Equipped with the new LEAP technology, the BOM Builder can potentially save PCB designers days or weeks of time normally spent turning a BOM into a CAD library.

Catching up with Polar Instruments' Geoffrey Hazelett

Product specialist Geoffrey Hazelett discusses some of the latest developments at Polar Instruments, including a new tool that will allow fabricators to determine how copper roughness will affect the end-product. He also talks about Polar's upcoming eBook on signal integrity, soon to be published by I-Connect007. Talented young technologists like Geoffrey are the future of our industry.

Cadence’s Zhen Mu Discusses Her Power-Aware Analysis Solution White Paper

At DesignCon, I met with Zhen Mu, senior principal product engineer with Cadence Design Systems, and Brad Griffin, product marketing director for Cadence. We discussed Zhen’s new white paper, “Power-Aware Analysis Solution.”

Exciting New Technology: Thermal Risk Management

Two years ago I entered into a collaboration with Dr. Johannes Adam, from Leimen Germany. Johannes has written a software simulation tool called Thermal Risk Management (TRM). We used it to look at the thermal characteristics of PCB traces under a variety of conditions, and it is hard for me to contain my excitement and enthusiasm for what it does and what we learned about traces using it. Our collaboration resulted in the publication of numerous articles and a book. In this article, I’ll talk about some of the capabilities of TRM that really caught my attention.

RTW IPC APEX EXPO: APEX EXPO Wrap-up Roundtable

Publisher Barry Matties and Managing Editor Andy Shaughnessy join Bob Neves of Microtek Labs for a review of IPC APEX EXPO 2017 and a look at the state of the PCB industry.


Kelly Dack and Mike Creeden: Are We in a PCB Design Renaissance?

Technical Editor Kelly Dack and San Diego PCB founder Mike Creeden discuss some of the trends they're seeing in the PCB design community, including greater numbers of young people becoming designers and more EEs doing design work. They also focus on IPC's training and designer certification efforts, and the need for designers to get out of the office and visit a board shop once in a while.

Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!

During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.

Selling PCB Design Services in a First-World Country

As the business operations manager for Better Boards Inc., I see our company at the focal point for consolidation: a gathering of skilled board designers to create a center of excellence. It is at this point that we have the critical problem facing a PCB design services company: How do we effectively sell these services back to the companies that cast off their own skilled employees? How do we sell PCB design services into small companies that can barely afford the one overworked electrical engineer that they hired last year?

Real Time with...IPC: Jim Fuller Offers HDPUG Update

Sanmina's Jim Fuller gives his insight on how the High-Density Packaging User Group (HDPUG) shares the experience and resources of member companies to tackle projects and get results. Also, he reviews the study of the effect of copper bonding treatment on signal integrity

Real Time with...IPC 2017 Videos Now Available for Viewing

Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.

EIPC 2017 Winter Conference Review of Day 2

Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!

In Deep: The Art and Science of DFM with Gary Ferrari

When the topic of DFM techniques came up, I knew I had to talk with Gary Ferrari of FTG Corp. Gary has been involved with designing and manufacturing PCBs for decades, and he’s the past co-founder and executive director of the IPC Designers Council. I caught up with Gary between Thanksgiving and Christmas, and we conducted the following interview.

The Evolution of PCB Design and Designers

According to Rainer Asfalg of Altium, VP Sales EMEA, EDA companies owe it to their customers to provide much more than just a standard design tool. Barry Matties met with Rainer at the recent electronica show to discuss the continued evolution of the design process towards automation, and what this might mean for the education and overall requirements of PCB designers going forward.

Help Wanted! Our 2017 Industry Hiring Survey

This month we conducted an industry survey on plans for hiring during the year. Included here is a summary of the results. We started by simply asking, “Do you plan to hire additional people this year?” More than half of the respondents answered yes while about a third said no—which we take as an optimistic sign that our industry plans to expand in 2017.

True DFM: Taking Control of Your EDA Tool

We PCB designers are doing some truly great things with our layout tools. But we must remember that these tools are so powerful that they will sometimes allow us to design things that can’t be manufactured! We must collaborate with our fabricator and assembly brethren and embrace the best DFM practices, or face the consequences downstream.


IPC Designers Council San Diego Chapter Meeting: Flex Focus Fills the House

A report from the January meeting of the San Diego chapter of the IPC Designers Council. The meeting was hosted by the PCB design bureau San Diego PCB, with the featured guest speaker John Stine of Summit Interconnect. Stine’s presentation focused on flex and rigid-flex DFM, and he offered a variety of helpful design tips to the full house of 30-40 designers in attendance.

A Handy Compilation of Our Top 10 DFM Articles

When we started working on this DFM issue, I searched through our files and found that we’ve published some great DFM articles over the past year or so. While topics like signal integrity tend to get most of the limelight, in the end it all comes down to solid DFM practices. So, without further ado, we present this compilation of our Top 10 DFM articles and columns.

Now is the Time for Comprehensive Tax Reform

Tax policy is among the most basic tools of any government to accomplish its objectives. From the private sector perspective, taxes are one of largest expenses of any business. But despite being such an important topic for government and business, there is widespread agreement that the U.S. federal tax code is a mess.

Flex and Rigid Sales and Marketing with Al Wasserzug

After decades in the PCB industry, Al Wasserzug of Cirexx International has seen marketing and sales trends come and go. I recently caught up with Al and interviewed him via email about the latest sales and marketing techniques, the value of traditional methods such as trade shows and conferences, and the particular characteristics of marketing flex circuits.

Altium’s Sales Plan: Deal Directly with Designers

Altium has been shaking up the EDA world for quite some time. The Australian company once slashed the cost of Altium Designer by 75% to grow market share, and who could forget their famous (or infamous) “Bunny” ad campaign? In this email interview with Lawrence Romine, Altium’s global head of field marketing, he shares his views on sales and marketing in the EDA world, as well as Altium’s philosophy on selling EDA tools.

CES 2017: Disruptive Technologies

Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.

CES 2017: Press Day, LaunchIt and Showstoppers

Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.

Top 10 Most-Read Design Articles of 2016

Every January, I like to go back through the last year and see which articles had the highest number of views. They're usually the articles that bring you PCB design and industry information that's relevant to your job. Check out the most-read PCB design articles from 2016.

Sales and Marketing with DownStream Technologies

From its inception, DownStream Technologies has been a new kind of software tool company. DownStream’s post-processing tools address one of the most unpopular parts of the design process: documentation. DownStream's CEO Rick Almeida discusses some of his firm’s marketing and sales methods, the trends that he sees, and the influence of the Internet on marketing.

Much Ado About Sales and Marketing

We recently surveyed our readers to get a better idea of what company leaders thought about sales and marketing. We sent this survey to several sales leaders; the results were informative, at times surprising, and even a bit disappointing, especially when participants reported that they had no sales and marketing plan at all. Does your company fall into that category?


TTM President Thomas Edman on the Global PCB Market, Technology, and More

The TTM and Viasystems merger put the PCB industry on notice last year when it created one of the biggest powerhouses in the world. At this year’s HKPCA and IPC show, Barry Matties met with TTM Technologies President and Chief Executive Officer, Thomas Edman to get his views on the market, technology, the culture of TTM and even the Trump effect.

Resins: Five Essentials to Achieve the Right Cure

Last month, I looked at some of the critical things you need to consider before selecting your resin. Of course, when it comes to the choice and application of resins, there’s a lot of information to take in, and over the following months I hope to distill this and provide some useful tips and design advice that will help you in your quest for reliable circuit protection.

'Can Do' in CAM Outsourcing: CAM Engineering – Automation

As volume production in PCB has shifted significantly to Asia, manufacturers in Europe and North America have been focusing on high technology, quick-turn, prototype, and lower-volume production.

SiSoft Discusses Signal Integrity Drivers and Challenges

In the last few years, SiSoft has launched a variety of innovative SI tools that help automate tasks that used to take weeks or months to complete. I recently interviewed CEO Barry Katz via email, and he detailed their customers’ challenges, and some of the market drivers in the world of signal integrity.

Sunstone Circuits Makes Shift in Strategy, Offerings

Sunstone Circuits, the Oregon-based online vendor of quickturn circuit boards, has recently made a shift in capabilities that will enable a move into the RF and microwave space. At PCB West, Publisher Barry Matties caught up with Sunstone’s David Warren, and they discussed details of this change and how they plan to approach such a competitive marketplace.

CAT’s David Wolf on Via Reliability Analysis

Conductor Analysis Technologies (CAT) has been analyzing test panels and coupon designs for over 20 years. CAT’s analysis provides valuable, quantitative data on PCB quality and reliability, which can help designers and manufacturers trace the source of defects and non-uniformities. Vice President of Technical Marketing David Wolf discusses some of the trends he’s seeing in via structures, and the common reliability and quality issues related to vias.

Sensible Design: Why are Resin Properties So Important?

Last month, I started this series of columns on resins by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions. I hope readers found this useful. Of course, when it comes to the choice and applications of resins, there’s a great deal more to discuss.

What’s the Difference Between a Manager and a True Leader?

The role of the manager is complex; it means balancing business needs with creative opportunity and flexibility, building trust and providing inspiration with a team. With the recruitment of Generation X, and now the millennials, the expectations of employees are changing, accompanied by an unprecedented growth of technology. How can today’s manager maintain an effective and motivated team?

DownStream Technologies: Building the Interface Between Designers and Fabricators

DownStream Technologies founder Rick Almeida speaks with Editor Pete Starkey about building the interface between the PCB designers and fabricators. He gives details on their design software and where most of the design community resides.

TTM SJ Hosts IPC Designers Council Meeting

The Silicon Valley Chapter of the IPC Designers Council was treated to a delicious barbecue lunch on October 13 at TTM’s San Jose facility. About 20 PCB designers and support professionals gathered for the tri-tip lunch-n-learn conference.


Leo Lambert Discusses EPTAC’s Evolving Mission

This month we’ve been dealing with challenges related to being a great manager and a great leader. One of the biggest problems a manager faces is training—getting employees trained, and keeping them current on constantly changing technologies. I asked Leo Lambert, VP and CTO of EPTAC, what his thoughts were on the subject of leadership, and more specifically, what strategies EPTAC embraces with regard to training—both initial and ongoing.

Lightning Speed Laminates: The Blending of High-Speed Digital and High-Frequency RF

When the terms high-speed and high-frequency are mentioned, people think they describe the same issue. But in reality, they can be two very different matters. The term high-speed generally refers to digital technology which transfers data at very high rates. But the term high-frequency is typically related to radio frequency (RF), which involves analog signals moving energy at high frequencies.

Mentor Graphics’ PADS Platform Bridges Design and Manufacturing

At PCB West, Barry Matties spoke with Paul Musto about Mentor’s PADS environment and their introduction of scalable software tools to help design better boards, from the enterprise level down to the entry level and hobbyists. They also discussed the evolution of the design process infrastructure in North America vs. Asia, and what design engineers should focus on to increase their value.

The Shaughnessy Report: Leadership vs. Management

Is your manager one of the great ones, a true leader? Many of your colleagues would probably answer with a pointed “No.” In our reader surveys, we ask, “What is your biggest challenge?” Every time we've posed that question, we received replies along the lines of, “Management doesn’t know what the hell they’re doing.” Some replies are too salty to print.

Freedom CAD: Navigating the Unpredictable Design Marketplace

As COO of the design service bureau Freedom CAD, Scott Miller has a front-row seat to the challenges currently plaguing designers and the design community as a whole. He shared his views with me recently, offering insights on the importance of picking the right partners and customer relationships in an unforgiving and sometimes unpredictable design marketplace.

Ventec Europe Celebrates 10 Years as 'Not Just Another Laminate Merchant'

Incorporated in November 2006 as a joint venture known as Global Ventec Laminates, Ventec Europe imported its first container-full of material in May 2007. Now, here we are 10 years on, a bit older and not a lot wiser, in Ventec Europe’s immaculate headquarters facility, still in Leamington Spa, but in smart new premises.

Patty’s Perspective: Take Me to Your Leader

We must have touched a real hot button when we decided to do this issue on leadership. When we sent out our survey on the topic, we received a lot of responses, which we’ll review in a separate article, plus many of our regular columnists were inspired to write on the subject.

Altium ActiveRoute Debuts at PCB West: Routes Under One Second Per Connection

While at PCB West, Judy Warner had the chance to sit down with Charles Pfeil of Altium and learn more about their exciting new tool, ActiveRoute, that was introduced and demonstrated during PCB West 2016. She also learned a bit of background about Pfeil, who is a living history lesson in PCB design.

SnapEDA: Inspiring Millennials in the PCB Design Community

Natasha Baker, founder of SnapEDA, is part of the new breed of entrepreneurs. She manages a group of millennials who are not much younger than she is. Natasha discusses what it means to be a manager vs. a leader, what motivates millennial engineers, and some of the changes in the world of EDA that managers have to contend with to succeed.

Let's Talk Testing: Don’t Reinvent the Wheel—Find an Expert!

Back in the day when I was an engineer fresh out of college, I quickly learned that experience is the solution to many problems. Now that being said, experience comes in many forms…it could be knowledge learned from a textbook, it could be an observatory comment jotted down in a notebook, it could be a conversation with a co-worker or colleague, or it could be an Internet search that finds a scholarly technical article, etc.


One World, One Industry: Voting—A Civic Duty and Industry Opportunity

On Tuesday, November 8, more than 240 million people in the United States will have the opportunity to go to the polls and vote, make their voices heard in government, and influence the direction of public policy for years to come. Much of the world is closely watching with interest in this major U.S. election.

Sensible Design: The Little Guide to Resins

I would like to start this series of columns by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions.

Beyond Design: How to Handle the Dreaded Danglers, Part 2

In Part 1, I deliberated on how dangling via stubs distort signals passing through an interconnect and also decrease the usable bandwidth of the signal. This is due to the via stub acting as a transmission line antenna, which has a resonant frequency determined by the quarter wavelength of the structure. The conventional solution to this problem is to back-drill (or control depth drill) the vias to bore out the via stub barrels, so that the via stubs are reduced in length if not completely removed. This month I will look into all the possible solutions.

2016 Election Forecast

Throughout this election cycle, candidates have offered many promises to boost the U.S. and global economy, as well as address other national priorities. As we inch closer to the finish line, it’s worth examining how the presidential and several congressional races could shape the future of policies affecting the manufacturing industry.

Space: Still the Final Frontier

If this doesn’t make you feel like a “seasoned citizen,” I don’t know what will: "Star Trek" first aired 50 years ago, on Sept. 8, 1966. No one—not even the actors—thought the show would last, and it only ran for three seasons, drawing average ratings. But Captain Kirk and company are more popular than ever on their Golden Anniversary.

Flexdude Abides: PCB Design for Satellites

Tom Woznicki, aka “Flexdude,” has focused primarily on flex circuit design since he founded Flex Circuit Design Co. in the 1990s, and he designed flex circuits for the Mars rover. But recently, Tom designed rigid PCBs for the TESS satellite. I asked Tom to discuss his work with TESS, and what it’s like switching between flexible and rigid PCBs.

The Fundamentals of Improving PCB Thermal Design

Continental's automobile engineers have years of experience building critical parts and systems for automobiles. Making sure that automotive electronics are reliable, safe, and properly designed begins at the component level. Heat must be addressed early in the design process for these goals to be achieved. The most important thermal resistance for heat, outside the IC package, is the PCB.

EIPC Reliability Workshop, Tamworth, UK, September 22, 2016

EIPC’s reliability workshop, presented in cooperation with Amphenol Invotec, attracted a capacity audience from eight countries—some delegates having travelled from as far away as Russia—to take the opportunity to learn first-hand how to meet OEM, ODM and EMS product quality and safety requirements, and to understand how interconnection stress testing techniques could be applied to determine the reliability of multilayer PCBs.

Prototron Adding a Variety of Services and Certifications

Editor Judy Warner and Prototron Sales Manager Russ Adams discuss Prototron's new capabilities and certifications. The company recently added via fill and limited flex services, and is ready to pull the trigger on AS9100 once the new rev is finalized.

Quiet Power: Evaluating Evaluation Boards

Evaluation boards are very helpful. Manufacturers of complex circuits such as DC-DC converters provide boards with those circuits ready to try out, saving us time and effort to design the printed circuit board around them. Evaluation boards are supposed to help us to understand the capabilities of the device. But with the many potential user applications, what should a particular user expect and look for in an evaluation board? We need to know how to properly evaluate an evaluation board.


John Cardone on Designing Flex for Spacecraft

If you watched footage of the Mars rover driving all over the red planet, you’re familiar with some of John Cardone’s handiwork. He’s been designing rigid, flex, and rigid-flex circuitry for spacecraft since he joined JPL in the early ‘80s, and he’s worked on some of the more ground-breaking flex circuits along the way. Now John runs his own design service bureau, JMC Design Services, and he continues to design circuitry for things that blast off. I caught up with John recently and asked him to give us the straight scoop on designing boards for spacecraft.

Mike Creeden: Care and Training of Your Designers

The I-Connect007 team recently visited San Diego PCB Inc. and received a warm welcome from CEO Mike Creeden and his youthful-looking (relatively speaking) team of designers. Creeden spoke with Barry Matties and Judy Warner about what it takes to run a successful design service center, how to properly care for the PCB designers of today and tomorrow, and why IPC’s design training is paramount when training a new designer.

Sensible Design: Conformal Coatings - Beware the Boards that ‘Bare’ All!

This month, Phil Kinner departs from his usual format of providing five essential facts about conformal coatings. Instead, he provides an account of a customer’s problem—no company names mentioned, of course—that brought into question the adhesion performance of a coating that they had been using successfully for some time.

Transline Technology is Bullish on Design Engineers

At the International Microwave Symposium, I met with Chris Savalia, vice president and co-owner of Transline Technology. We discussed the California-based fabricator’s philosophy, the challenges of the RF and microwave markets, and the need to engage with young design engineers now.

Beyond Design: How to Handle the Dreaded Danglers, Part 1

Dangling via stubs can distort signals and decrease the usable bandwidth of the signal. A via stub acts as a transmission line antenna, and has a resonant frequency determined by the quarter wavelength of the structure. At this frequency, the transmitted signal is greatly attenuated, by up to 3dB. For low-frequency signals, this is not much of an issue, but for higher-frequency signals, this issue becomes a problem.

The Evolution of Altium: Road to a Record-Breaking Year

Chris Donato, VP of sales for Altium Americas, sat down with Judy Warner recently to discuss what he and Altium have been doing lately, where they came from (Australia) and what the future holds for Altium. This company has evolved from flying well under the radar during the acquisition frenzy of the ‘80s, to achieving a record $100 million in sales for fiscal year 2016.

Happy’s Essential Skills: Computer-Aided-Manufacturing, Part 1—Automation Protocols

I have addressed automation planning previously in this series, so I hope by now you realize the difference between ‘automation’ and ‘mechanization.’ In printed circuit fabrication and assembly, most of what is advertised is mechanization. But when you get to assembly test, then you begin to see true automated solutions.

Increasing Heat Dissipation in FPGAs

In recent years, the miniaturization and modularization of electronic products have led to the increased density of electronic components and the decrease of areas for effective heat dissipation. As a result, the thermal design of high-powered electronic components has become a major focus for electronics engineers. An effective solution for FPGA heat dissipation is critical. Thermal design of the PCB aims to decrease the temperature of both components and the board through suitable measures, so that the system is capable of working at a suitable temperature.

Orange Co. Designers Council Meeting Draws A Packed House

Speaker John Stine, VP of operations at Summit Interconnect’s Anaheim facility, gave a presentation on flex and rigid-flex design and fabrication. At least 75 electronics professionals listened as Stine, an expert in flex and rigid-flex technologies, discussed proper trace geometries, grounding, cover lay, adhesives, signal integrity, impedance control, book-bindings and much more in his 80-minute presentation.

The Shaughnessy Report: Voices of the Industry

We asked readers like you to share your thoughts about PCB design. Your replies were all over the map. Of course, as journalists, we are drawn to your complaints and challenges—our publications exist to help you address these challenges. And you were not shy about sharing your complaints! Designers’ complaints haven’t changed much since I've been covering this segment.


The Many Voices Over the Past Year

In line with our "Voices of the Industry" theme this month, we're publishing this handy index of all of the interviews we've conducted over the past year with the movers and shakers, managers, entrepreneurs, and and rank-and-file designers and design engineers. In case you missed them, here's another bite of the apple, alphabetized by interviewee's last name. Enjoy!

Lightning Speed Laminates: Smaller Circuits--Material Properties and Thermal Issues

Coefficient of thermal expansion (CTE) is typically considered for PCB reliability, but it can also have an impact on circuit performance for applications exposed to varying temperatures. Due to CTE, a circuit will change physical dimensions when the temperature changes. If the circuit has small features or tightly coupled features, the physical change of the circuit dimensions can cause a shift in electrical performance.

Brooks' Bits: Your Traces Have Hot Spots!

The reasons for the temperature variation at high temperatures are not too hard to understand. There may be minor contamination under the trace or in the copper that accounts for it. Certainly, at higher temperatures (say above about 300°C) the board may begin to delaminate, severely disrupting its cooling characteristics. There may be small variations in trace width or thickness that help account for the delam, and these effects would be randomly distributed along the length of the trace.

Sensible Design: When Coatings Go Wrong

This month, I consider some of the more common, and often very frustrating, problems that may be encountered when coating electronic circuit boards and components. I also discuss some practical solutions. As we all know, nothing in life is straightforward.

Beyond Design: The Rise of the Independent Engineer

With the changing demographics, the old-timers in our industry—the master PCB designers—are about to retire and hand over the exacting job of PCB design to the Gen-X and Ys. These generations, shaped by technology, will tackle the most demanding designs without possessing the experience that we veterans benefit from. And to top it off, these up-and-coming designers will be degreed engineers who have to cope with both design and layout tasks as the specialized PCB designer’s positions are phased out.

Signal Integrity Tools and Design Methodology in the Modern Age

The PCB design process has traditionally been done in silos. One group creates the design intent (schematic), another group implements the logic on the PCB, and yet another group does some checking of the design using analysis tools. This traditional approach has run into a number of problems.

New SI Techniques for Large System Performance Tuning

In this DesignCon paper, Donald Telian of SiGuys and Michael Steinberger and Barry Katz of SiSoft describe newly-developed techniques for equalization tuning and discontinuity reduction, offering additional design margin. Cost reductions are also achieved as new signal integrity techniques demonstrate performance parity, removing non-essential re-timers and PCBs layers.

The Gerber Guide, Chapters 15 and 16

Before sending your Gerber files off to your fabricator, you are often advised to check them using a reputable Gerber viewer such as GC-Prevue. This is excellent advice. Note that this involves more than just verifying that the viewer displays your intended image: It is important that you check too that the file is valid.

Software Bytes: Having Fun With Impedance

About a year ago, I was assigned a new project: become an expert in impedance, more or less. I had no idea how much this research would bring out the nerd in me. Even if you don’t typically design controlled-impedance circuit boards, you probably will eventually. Read on!

Mentor Video: Impact of Power Integrity on Temperature

One of the most common outputs from a DC Drop simulation is a current density plot. But how much is too much current density? The answer depends on temperature rise, and requires a PI-thermal co-simulation to properly characterize.


Designing for Profitability: Don’t Over-Materialize

John Bushie, applications engineering manager at American Standard Circuits, spoke with Barry Matties recently about how designers can avoid over-materializing. He also outlined the benefits of designing for profitability.

Getting Signal Integrity Right by Design

As clock frequencies increase and active devices and interconnect traces shrink and are placed ever closer together, signal integrity becomes an increasing challenge. Today, SI is typically addressed late in the design process after the PCB layout has been completed by performing complex and time-consuming 3D extractions and simulations for high-speed lines. But with little attention being paid to SI during the layout process, simulation frequently identifies numerous SI problems.

Beyond Design: Mastering “Black Magic” with Howard Johnson’s Seminars

Dr. Howard Johnson, the world’s foremost authority on signal integrity, has recently released his High-Speed Digital Design (HSDD) Collection. I recently reviewed all three of the seminars in this collection, a total of 36 hours of viewing time. If you want to gain some of Dr. Johnson's enthusiasm and master the art of high-speed design, then the collection is a must-have.

Making Digital and Analog “Play Nice” at Peavey

Most guitarists have owned a Peavey Electronics amplifier or instrument at some point in their lives. Peavey originally drew accolades for their line-up of high-quality, budget-friendly products. Now the company also develops high-end instruments, amps, and live sound equipment. Peavey was also the last major American musical equipment maker to have product manufactured overseas. I met with Tom Stuckman, an electrical engineer at Peavey, during NAMM and asked him about the technical challenges he faces and what it’s like working at Peavey.

Designing With Tighter Tolerances

David Ledger-Thomas is a PCB design engineer with Honeywell Aerospace. He’s spent decades designing PCBs for a variety of applications, including defense, aerospace, computers, and high-performance audio. I asked David to share some of his thoughts on designing high-tech boards with increasingly finer spaces, traces and pitch.

Lightning Speed Laminates: The Dilemma--Soldermask for High-Frequency PCBs

Typically, PCBs with RF traces on the outer layers have minimal or no soldermask in the RF circuitry areas. Many times the soldermask is applied in areas where components are soldered to the PCB but the soldermask is developed away in the areas where conductors have critical RF performance. There are many reasons to avoid soldermask coverage on RF conductors, due to inherent soldermask properties.

Designing with Fine Lines and Features

Albert Gaines is the owner and senior PCB designer at HiGain Design Services in Norcross, Georgia. He’s been a PCB designer since 1981; he's designed a variety of boards in that time. I asked Albert to talk about some of the finer lines and features that come through his shop, as well as some design techniques for boards with tight tolerances.

Taylor Guitars Protected with Analog, RF Circuitry

Trenton Blizzard is an electrical engineer at Taylor Guitars and part of the team that developed the TaylorSense shock and climate change protection system. At the NAMM show, Trenton spoke with me, along with Editors Dick Crowe and Dan Feinberg, about this new device, and what it’s like being an electrical engineer for a “woodworking shop.”

From the CAM Shop: Tight Tolerance Design Tips

After you finish your design, it winds up in the hands of people like Mark Thompson, the man who runs the CAM department at Prototron Circuits in Redmond, Washington. He sees CAD data firsthand, and often has to address errors and inconsistencies in PCB designs. For this issue, we asked Mark to discuss the today’s tight tolerances, some of the problems they can cause PCB designers, and what designers can do when dealing with shrinking features.

The State of the Electronic Design Automation Nation

We are the automation nation. We are the high-speed demons, the low-frequency artists, the mixed-signal designers that make up the electronic design automation industry. We spend most of our working lives behind software, delivered to our fingertips with the promise of making things easier, faster, better, and getting us to our deadlines ever faster.


Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection

A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.

The Importance of Design for Profit (DFP)

In this interview, Interconnect Design Solutions’ Mike Brown and I took a few minutes during the recent Geek-A-Palooza event to discuss the importance of material selection and designing for profitability, how automation affects the design process, and the future of the design community.

Sensible Design: Coatings—Five Essentials for Designers

In an ideal world, PCB designs would not have an inherent weak point for corrosion; unfortunately, in the real world, they do. When a weak point is revealed, you are better equipped to deal with it. Often the spacing of components, board finish and distance to ground planes can be optimised for corrosion resistance.

Beyond Design: The Case for Artificial Intelligence in EDA Tools

There has been a lot of activity in the field of artificial intelligence recently, with such developments as voice recognition, unmanned autonomous vehicles and data mining to list a few. But how could AI possibly influence the PCB design process? This month, Barry Olney will take a look at the endless possibilities.

Changing the World of PCB Rapid Prototyping

Tony Tung is a recent graduate from Taiwan who has come up with a new way for PCB designers and makers to create breadboards using printed paper circuits. I caught up with Tony at the recent San Mateo Maker Faire and sat down with him to learn more about this project.

EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry

Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.

Rogers’ John Coonrod on Insertion Loss

John Coonrod of Rogers Corporation gave a keynote presentation at the recent Geek-A-Palooza trade show, concentrating on printed circuit board fabrication’s influences on insertion loss. I sat down with John to learn more about his presentation and what OEMs and designers need to be aware of to avoid insertion loss.

IPC President John Mitchell Discusses IPC's Footprint in China

At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.

Tim’s Takeaways: The Basics of Hybrid Design, Part 3

The world of hybrid design is growing, and we have lots of hybrid-specific functionality built into our software that helps designers meet and conquer the unique hybrid design requirements that they are faced with. And yet many designers out there (and I used to be one of them) have no idea what is meant when people start talking about hybrid design.

EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry

Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.


Romanian Electronics Industry Celebrates 25th Anniversary of TIE

The high point of the Romanian TIE event was a competition among the students to design and layout a circuit for a specific product meeting to the maximum extent possible a long list of design and product requirements. The students had four hours to deliver a design which was then evaluated by a team comprised of a university instructor and a seasoned industry engineer.

Institute of Circuit Technology Annual Symposium

On June 1, Technical Director Bill Wilkie introduced the 42nd Annual Symposium of the Institute of Circuit Technology, at the Motorcycle Museum in Birmingham, UK, commenting upon the success of the recent Foundation Course and acknowledging the sterling efforts of his course tutors, although recognising that some of his longest-standing experts were now retiring.

EDA Tools: Automation vs. Control

Stephen V. Chavez, CID+, is currently the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS). He's also a frequent speaker at the IPC APEX EXPO Design Forum. I caught up with Stephen and asked for his thoughts on the EDA tools of today, and whether he’d prefer to have more control vs. more automation.

DownStream: What a Long EDA Trip it’s Been

No doubt about it: DownStream Technologies co-founder Joe Clark is an EDA veteran, with a history that dates back to the very beginning of EDA tools through the merger madness of the late ‘90s and beyond. I sat down with Joe during IPC APEX EXPO, and asked him about some of the changes he’s seen, and the direction of DownStream as it enters its 15th year.

The Shaughnessy Report: The Designer Roundtable Roundup

Every year, I attend SMTA Atlanta, just across town. You have to love a local trade show. No airlines, no jet lag, and no hotels. It’s a small show; it would fit in a school gymnasium. But for me, the highpoint of SMTA Atlanta is the Designers Roundtable. This year the roundtable had 15 attendees, up from 12 last year. Two of the new attendees were under 35, which surprised all of us "graybeards."

PADS Paper: 10 Things to Know about Thermal Design

As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design. This PADS paper discusses 10 things designers need to know about thermal design.

Ventec's Commitment to FOD Elimination Sets the Trend

The European Space agency has led the drive for ultra-clean laminates and pre-pregs, completely free from foreign object debris. Ventec were one of the first to respond to ESA’s call for the laminate industry to support Appendix A to IPC-4101D, which the committee has agreed will be adopted. Mark Goodwin fills in the background.

Design Automation Tools, Today and in the Future

Kelly Dack has been designing PCBs for over three decades, at OEMs of all kinds. Now a PCB designer with a Washington state contract manufacturer, Kelly enjoys waxing philosophic about PCB design and design automation in general. I asked Kelly about the direction EDA tools are headed, and whether he’d like to see more control, or more automation in his PCB design tools.

Beyond Design: DDR3/4 Fly-by vs. T-topology Routing

JEDEC introduced fly-by topology in the DDR3 specification for the differential clock, address, command and control signals. The advantage of fly-by topology is that it supports higher-frequency operation, reduces the quantity and length of stubs and consequently improves signal integrity and timing on heavily loaded signals. Fly-by topology also reduces simultaneous switching noise (SSN) by deliberately causing flight-time skew.

Designers and Design Engineers: Two Sides of the Same Coin

Andy and Sue Critcher have been the lead designers at Total Board Solutions Limited, a UK-based design bureau, since its founding in 1998. I asked Andy to share his opinion about the friction between some PCB designers and their engineers, and what can be done to improve communications between these groups.


Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 6

The designer is generally under pressure to release the documentation and get the flexible circuit into production. There is, however, a great deal at risk. Setting up for medium-to-high volume manufacturing requires significant physical and monetary resources. To avoid potential heat from management, the designer must insist on prototyping the product and a thorough design review prior to release.

The Roles of the Designer and the Design Engineer

Steve Hageman has been designing electronics since elementary school. An engineer by trade, he has decades of experience performing PCB design and layout. I asked Steve to give us his opinion about the divide between some PCB designers and their engineers, and what can be done to solve this problem.

Cadence Paper: Automating Inter-Layer In-Design Checks in Rigid-Flex PCBs

Flexible PCBs make it possible to create a variety of products that require small, lightweight form factors. As flexible PCB fabrication technology has matured, new design challenges have emerged. This paper discusses some of the key challenges and introduces a new PCB design approach that enhances productivity through in-design inter-layer checks.

The Partnership: Design Engineers and PCB Designers

Randy Faucette is founder, president and director of engineering at Better Boards Inc. in Cary, North Carolina. I asked Randy to talk about some of the occasional tension between PCB designers and design engineers, and what he thinks can be done to help open the lines of communication.

SiSoft: Optimizing the State of the Art

In the 20 years since its founding, SiSoft has been at the forefront of signal integrity analysis tool development. Now, the company is leading the way with a new technology called OptimEye and tools for creating accurate IBIS-AMI models. Todd Westerhoff, VP of semiconductor relations, gives us an update on the company’s newest technologies.

Behind the Scenes: Adcom’s TLA Award-Winning Design

Adcom’s design team placed first in this year’s TLA program, taking the top spot for the category of “Computers, Blade & Servers, Memory Systems.” This board, like most PCBs today, is a complex system designed by a multi-disciplinary team of designers, striving to bring an operational product to the market on schedule.

Working With Circuit Design Engineers

Until the late 1980s, many PC board designers were converted technicians, mechanical designers, and artists who learned to read a schematic and mastered artwork taping. The EEs would often share their opinions, but you could listen to them or ignore them and the circuit would likely function either way. This era created some tension between designers and their EE counterparts, because they completely ignored each other’s ideas.

EMA is Bullish on Data Management

EMA Design Automation has evolved over the years, from a typical Cadence Design Systems VAR to a distributor that functions more like a part of Cadence. During DesignCon, I met with Greg Roberts, director of marketing for EMA, and asked him to discuss the company’s focus on data management tools, and why he’s giving away certain OrCAD tools.

Quiet Power: Dynamic Models for Passive Components

A year ago, my Quiet Power column described the possible large loss of capacitance in multilayer ceramic capacitors when DC bias voltage is applied. However, DC bias effect is not the only way we can lose capacitance. Temperature, aging, and the magnitude of the AC voltage across the ceramic capacitor also can change its capacitance. This column will provide all of the details.

IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda

IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”


Design Strategies for Success—and Profit

In today’s economic environment, making money on a project is getting more and more challenging. Those years when businesses like mine were practically printing money are long gone. If you are under 30 years old, you probably do not have this point of reference; it’s been one downturn after another for your entire adult life. But for us older folks, times were really good back then. So, what happened? You happened, as well as a million others like you. In other words, the market is a little cramped now and much more competitive, which dilutes our profit per project.

Sunstone Circuits R&D: 3D Printing Great for Prototyping

We’ve been hearing a lot about 3D printing for the past few years. But where does 3D printing fit in with traditional rigid circuit board development? Sunstone Circuits recently completed a project that focused on that very question. Sunstone Product Manager Nolan Johnson explains why 3D printing is a viable option when it comes to jigs and parts of the support infrastructure that are needed when prototyping today’s emerging technologies.

Brooks' Bits: How Many Vias Does It Take To…?

During 2015, I enjoyed a very productive collaboration with Dr. Johannes Adam, from Leimen, Germany. This resulted in several papers, but one in particular is relevant for this column, “Via Currents and Temperatures.” In that paper, we used a simulation tool, thermal risk management, developed by Dr. Adam, to simulate current flowing through a via and then determine the temperature of the via. Read on to find out how our results contradicted conventional wisdom.

Happy’s Essential Skills: Technical Writing

Technical writing is one of those topics that they don’t really talk about in college—at least not where I went. Writing and English has never been a strong like of mine compared to science and math. So I did my required time in English and wrote my lab reports the best I knew how.

Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1

In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.

Beyond Design: The Need for Speed—Strategies for Design Efficiency

Years of experience with one EDA tool obviously develops efficiency, whether the tool be high-end feature-packed or basic entry-level. And one becomes accustomed to the intricacies of all the good and bad features of their PCB design tool. However, there comes a time when one should really consider a change for the better to incorporate the latest methodologies. This month, I will look at productivity issues that impede the PCB design process.

Weiner’s World

3D printing, China’s SMT equipment and robotics markets, IPC’s mandate, counterfeiters, and Taiwan PCB makers’ shift to automotive electronics—Gene Weiner talks about these things and more in this new article.

RTW IPC APEX EXPO: Mentor Graphics Takes Manufacturing Operations to the Next Level

Dan Hoz, general manager of Mentor Graphics Valor Division, discusses with I-Connect007's Andy Shaughnessy how they are helping electronics manufacturers take their operations to the next level through their Valor IoT Manufacturing solutions. He talks about the OML and the Valor IoT Device, and how these solutions will help the electronics manufacturing industry to move to Industry 4.0.

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 5

The outline profile of the flexible circuit is seldom uniform. One of the primary advantages of the flexible design is that the outline can be sculpted to fit into very oblique shapes. This month, Vern Solberg focuses on outline planning, physical reinforcement, and accommodating bends and folds in flexible and rigid-flex circuits.

Tim's Takeaways: The Principles of Hybrid Design, Part 1

What exactly is a hybrid design? We are seeing more and more of our customers exploring the world of hybrid design, and we are getting new customers for whom hybrid design is their sole focus. The world of hybrid design is growing and we have lots of hybrid-specific functionality built into our software that helps designers conquer the unique hybrid design requirements.


The Bare (Board) Truth: The Top 10 Ways Designers Can Increase Profits

So, can you truly increase profitability through PCB design practices? Prototron's Mark Thompson believes you can. And it starts with a philosophy that embraces DFM techniques. Then you must be ready for the initial release to a fabricator by ensuring that you are communicating all of your specifications and needs clearly to the fabrication house so that you get an accurate quote. Let’s dive in, starting with Number 10 and working our way to the most important way a designer can increase company profits.

Wild River: Simplifying SI so Engineers Can Focus on Design

Al Neves is founder and chief technologist of Wild River Technology, and he’s a signal integrity engineer who likes to tell it like it is. So when I bumped into Al during DesignCon, I asked him to sit down for an interview. We discussed the paper he co-wrote for DesignCon and the challenges SI engineers are facing, as well as Wild River’s efforts to take the black magic out of signal integrity.

RTW IPC APEX EXPO: HDP Users Group Update with Jack Fisher

Jack Fisher, technical director for the High-Density Packaging Group, discusses the latest projects that the consortium is focusing on. He explains that member companies have full access to all of the R&D data that is developed. One of the group's most interesting current efforts involves optoelectronics.

RTW IPC APEX EXPO: Geek-A-Palooza Coming to S. California May 12

Steve Williams sits down with Geek-A-Palooza founders Tara Dunn and Judy Warner to discuss their upcoming event in Irvine, California on May 12. The Geek-A-Palooza held in Minneapolis last year drew over 300 PCB designers, fabricators, assemblers and suppliers. Tara and Judy explain why this is not just another boring technical talk, and attendees will definitely enjoy themselves.

Steinberger Talks PAM4, the Next Generation of Modulation

I recently interviewed our old friend Michael Steinberger, SiSoft’s lead architect for serial channel products. Steinberger is always a great interview; he breaks down complex signal integrity simulation technology in ways that are simple and often humorous. Steinberger sat down and discussed a paper he presented at DesignCon, and some of the challenges his customers are facing.

RTW IPC APEX EXPO: Mentor Graphics Makes Internet of Manufacturing Affordable

Michael Ford, marketing development manager at Mentor Graphics, and I-Connect007 editor Andy Shaughnessy discuss the Open Manufacturing Language (OML), the challenges in supporting the hundreds of thousands of machines that are out there at shopfloors already, and how Mentor is making the Internet of Manufacturing affordable for everyone in the PCB assembly supply chain.

IPC APEX EXPO: Isola Introduces New Products, Increases R&D

Ed Kelley, VP of global technology, sits down with Guest Editor Dan Beaulieu at IPC APEX EXPO to discuss the company's plans for the future. The company is launching new low-loss laminates and increasing its R&D activities around the globe. He also explains why Isola often works with designers at OEMs.

IPC APEX EXPO: IPC Government Relations—Your Advocate in Washington

IPC's VP of Government Relations, John Hasselman, explains IPC's "meet the policy makers" initiative (site visits by congressmen) to help build and broaden relationships with these decision makers.

IPC APEX EXPO: Gary Carter on First Board Manufactured With IPC-2581B

Gary Carter, senior manager of CAD engineering for Fujitsu Network Communications, discusses the first board fabricated and assembled using IPC-2581B. This 20-layer board features 21,000 component pins and 15,000 holes, with controlled impedance on all layers. He also gave a presentation on IPC-2581B during the Design Forum.

IPC APEX EXPO: EPTAC Updates on Soldering Committee Developments

Leo Lambert, vice president and technical director at EPTAC Corp., provides I-Connect007 guest editor Joe Fjelstad an update on some of the standard developments at IPC's soldering and assembly committee.


What’s New at Cadence?

Cadence Design Systems has released a variety of PCB design tools lately, and we wanted to find out a little more about what’s new at Cadence. I tracked down Product Marketing Director Brad Griffin and asked him to discuss some of the newest technology coming out of Cadence.

Standard of Excellence: Tips for Finding a Great PCB R&D Partner

This new column, Standard of Excellence, represents a cooperative writing effort by a team of experts at American Standard Circuits. This month, we begin with CEO Anaya Vardya, who focuses on R&D. In his piece, he provides his insights on what characteristics to look for in a good R&D PCB fabrication vendor partner, and a few things that are expected of them to do for you.

Catching up with…PNC: Open House Planned for May

I’m a great believer in open houses. Any time customers and vendors get together to learn and talk about what they can do for each other it’s a good thing. That’s why, when I heard that PNC, in Nutley, New Jersey, planned to hold an open house on May 20, I wanted to learn more about it. So I called my friend Sam Sangani, the company’s owner, to learn more about it.

IPC APEX EXPO: New Arlon Materials Address Design and Fab Challenges

Brad Foster, VP and general manager of Arlon, discusses some new laminates and pre-pregs that help designers and fabricators address a variety of challenges. He explains how Arlon works with customers to help them with stack-ups and other issues.

Walt Custer Elaborates on his Annual IPC APEX EXPO Forecast Presentation

IPC APEX EXPO 2016 has come and gone, and this year, Walt Custer’s annual presentation forecasting the upcoming year for the industry was much anticipated, as always. I met up with Walt at the show to learn about his presentation and dig deeper into his findings.

IPC APEX EXPO: Electrolube to Educate PCB Designers on Coatings

Phil Kinner, technical director of coatings for Electrolube, discusses a paper on condensation testing that he presented at IPC APEX EXPO, and his plans to educate PCB designers about conformal coatings to help them avoid problems during manufacturing.

What’s New at Zuken?

Zuken has developed some innovative PCB design tools in the past few years, and I wanted to find out more about the company’s new and upcoming technologies. I caught up with Bob Potock, vice president of marketing for the Americas for Zuken USA, and asked him what was new at Zuken.

The PDN Bandini Mountain and Other Things I Didn’t Know I Didn’t Know

Originally, Bandini Mountain referred to a mound of fertilizer built by the Bandini Fertilizer Company in California prior to the 1984 Los Angeles Olympics. When the company went bankrupt, this mound of fertilizer was left behind. Steve Weir coined this term to describe the large resonant frequency peak formed by the parallel combination of the on-die capacitance and the package lead inductance, as seen from the die looking into the PDN.

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 4

All of the design rules for the glass reinforced-portion of the board (land pattern geometry for mounting surface mount devices, solder mask and the like) are now well-established. One unique facet of fabricating the rigid-flex product is how the flexible portion of the circuit is incorporated with the rigid portion of the circuit. As a general rule for multilayer PCB design, furnish a balanced structure by building up the circuit layers in pairs (4, 6, 8 and so on).

IPC APEX EXPO: Prototron Works with Customers to Stay on Top

Prototron Circuits Operations Manager Mike Graves explains how his company's focus on customer service, including helping with PCB designs, has made Prototron "America's Board Shop." He also discusses their expansion into flex and HDI technology, and their efforts to achieve AS9100 certification.


IPC APEX EXPO: IPC's Fern Abrams Provides Updates on RoHS, REACH Directives

Fern Abrams, director of regulatory affairs and government relations at IPC, discusses with I-Connect007's Stephen Las Marias the latest updates on the changes happening in the RoHS and REACH directives this year, as well as IPC's new initiatives and advocacies.

IPC APEX EXPO: Hofer Discusses the Pros and Cons of Backdrilling

General Manager James Hofer of Accurate Circuit Engineering discusses the process of backdrilling vias, including the benefits and drawbacks. Backdrilling can improve signal integrity, but it can also create stubs that may act as unwanted antennas.

IPC APEX EXPO: Clyde Coombs Discusses the New Printed Circuits Handbook

In this interview that was shot during the IPC APEX EXPO 2016 in Las Vegas, Nevada, Clyde Coombs discusses the latest edition of the Printed Circuits Handbook, which was published this week. The seventh edition, co-edited with Happy Holden, includes new sections on supply chain management and PCB design, with a chapter on EDA tools by Design007 Editor Andy Shaughnessy.

What’s New at DownStream?

Since its founding in the uncertain days of 2002, DownStream Technologies has made a name for itself with its line of PCB design post-processing tools. Founder Rick Almeida gives us an update on the latest innovations at DownStream, and he discusses some of the challenges and trends he sees in the PCB design segment.

Patricia (Patty) Goldman Inducted into IPC Hall of Fame

We at I-Connect007 are thrilled that our own Patty Goldman has been awarded the highest level of volunteer recognition that IPC can give to an individual, the Raymond E. Pritchard Hall of Fame Award. The award is given in recognition of superior achievement, extraordinary contributions and distinguished service to IPC and the advancement of the electronics industry.

IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials

Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks. The paper looks at high-frequency offerings from a variety of materials providers.

Mark Thompson: It’s All About Communication

In engineering support at Prototron Circuits, Mark Thompson has seen it all. He ensures that each design is manufactured the way the designer intended, even if the CAD data is not crystal clear. During DesignCon, Barry Matties and Andy Shaughnessy talked with Thompson about why communication is paramount when designing and prototyping boards. Thompson also explained how designers can avoid making common mistakes that can set back an entire project.

Mentor Graphics’ Oren Manor Explains Exactly What Industry 4.0 Brings to Manufacturing

Oren Manor of Mentor Graphics talks about what Industry 4.0 is really about, and how it benefits electronics manufacturers. He also discusses their design to manufacture solution, and how it helps OEMs large and small make the transition to Industry 4.0 without a complete factory overhaul.

Manufacturing Institutes Can Boost the Nation

In his most recent State of the Union address, President Obama highlighted a remarkable trend of recent years: the turnaround in many corners of America’s manufacturing sector. Nearly 900,000 new jobs have been created by U.S. manufacturers in the last six years.

Beyond Design: Faster than a Speeding Bullet

In optical communications, electrons don’t carry the signal—photons do. And we all know that photons travel at the speed of light. So surely, optical fibers must transmit information much faster than copper wires or traces on a multilayer PCB? Actually, photons and electrons transmit data at the same speed. The limiting factor is the relative permittivity (dielectric constant) of the medium in which the signal propagates.


Technology Outlook with Mentor Graphics

Mentor Graphics recently announced the winners of its PCB Technology Leadership Awards. Now in its 26th year, this program provides a great barometer for measuring the newest trends in cutting-edge PCB designs. I caught up with Product Marketing Manager David Wiens and asked him to give us an idea of the trends he’s seeing in PCB design and manufacturing, and what the industry has in store for us in the next few years.

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 3

This installment of "Designers Notebook" will focus on methods for specifying base materials, and also address copper foil variations and fabrication documentation. It is important to research the various products in order to choose the one that best meets the design requirements.

DuPont, Taconic and PFC Team Up For High-Speed Flex

At DesignCon, I sat down with three flex circuit specialists: Glenn Oliver of DuPont, Tom McCarthy of Taconic, and Steve Kelly of PFC Flexible Circuits. Our discussion covered a lot of territory, most notably the findings they described in the paper they were about to present later that day at DesignCon, and the future of flex, as they see it.

Catching up With Tom Hausherr of PCB Libraries

When fate placed Tom Hausherr and I at PCB West, we made sure to carve out some time together. Tom agreed to have a long breakfast with me so I could learn more about the challenges related to component libraries and how his company addresses these issues. So, pull up a chair and join us for a chat.

Enhancing Thermal Performance of CSP Integrated Circuits

In order to meet size and weight requirements, constraints of portable electronic designs often force PCB designers to reduce the size of components and PCB real estate area. To meet these demands, the use of CSP packages to shrink the PCB area needed is a common change in designs. As a result of the reduction of total PCB area, the available options to move heat and route high-power PCB traces is also reduced. Furthermore, the thermal performance cannot be matched when a QFN is compared to an equivalent CSP package.

The Shaughnessy Report: Doing My Part for Medical Electronics

One interesting aspect of having hernia surgery recently was the number of PCBs in the operating room. I’ve never seen so many electronic devices together in my life. I saw one Agilent monitor, and a bunch of others with names I couldn’t make out. It reminded me of the IT room in most companies. I guess they had to be set up to handle routine surgery like mine, and the not-so-routine operations as well. Medical electronics is doing fine, no doubt.

Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 2

In this installment of "Designers Notebook," Vern Solberg discusses supplier assessment, planning of the flexible circuit outline, and various circuit routing principles. Communication between designer and fabricator is paramount, as well as an understanding of IPC-2223, which sets the specific requirements for the design of flex circuits.

Justifying the Need to Outsource Design Work

Mehul Dave and H.D. Shreenivasa of Entelechy Global discuss the many benefits of outsourcing and why it should not be thought of as a four-letter word. They also talk about the huge gap between design and manufacturing, and how their company can help customers address that issue.

American Standard Circuits: Leading the Way in Medical Electronics

When it comes to innovative fabricators, American Standard Circuits is always at the front of the pack. Naturally, when Editor Andy Shaughnessy asked me to interview a fabricator about PCBs for the medical market, ASC was the one company that immediately came to mind. I spoke with CEO Anaya Vardya about fabricating medical PCBs, the medical electronics market, and the future of this fast-growing segment.

Fabrication Drawings and Electrical Test— Reading the Fine Print

When a new PCB design is born, designers envision what the product will provide when completed. Whether the product is for the consumer, aerospace, military, medical or countless other markets, the designers—or more likely, the customers—expect certain deliverables on the commodity they wish to purchase.


Innovative Circuits Sees Healthy Medical Market

Medical electronics is one of the fastest growing segments of our industry. Alpharetta, Georgia-based Innovative Circuits is at the forefront of fabricating medical PCBs, both flex and rigid. I asked Innovative Business Development Manager Amir Davoud to give us a solid diagnosis of the world of medical PCBs.

Beyond Design: Plane Crazy, Part 2

In my recent four-part series on stackup planning, I described the best configurations for various stackup requirements. But I did not have the opportunity to delve into the use of planar capacitance to reduce AC impedance at frequencies above 1GHz, which is the region wherein bypass and decoupling capacitors dramatically lose their impact. In this column, I will flesh out this topic, and consider the effects of plane resonance on the power distribution network (PDN).

New Year, New Outlook for the Electronics Manufacturing Industry

As an advocate for the electronics manufacturing industry, my job is to educate and encourage policymakers to create a favorable legislative and regulatory environment for advanced manufacturing to grow and succeed. From that perspective, I think we should be proud of the significant progress we made in several areas in 2015.

Medical PCB Design: Not Just Another High-Rel Board

Some of the coolest new electronic products have come courtesy of the medical market. I wanted to find out more about this fast-growing segment, so I contacted Kenneth MacCallum, an engineering physicist with StarFish Medical. MacCallum, an engineering physicist who designs PCBs for medical applications, explained why medical PCBs are not quite like other high-reliability boards.

Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools), Part 2

The statistical representation of Six Sigma describes quantitatively how a process is performing. To achieve Six Sigma, a process must not produce more than 3.4 defects per million opportunities. A Six Sigma defect is defined as anything outside of customer specifications. A Six Sigma opportunity is then the total quantity of chances for a defect.

Systematic Estimation of Worst-Case PDN Noise: Target Impedance and Rogue Waves

In the dark ages of power distribution design, the typical advice was to use a bulk capacitor and one 0.1uF bypass capacitor for every power pin on the digital circuit. This was very unscientific, but served the industry reasonably well in low-density and low-speed circuits. As the designs got more demanding, the target impedance concept was developed. Using a target impedance, designers had a metric and a design goal to guarantee that the voltage transients stay within specified limits.

Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 1

In his new Designers Notebook column, Verb Solberg discusses primary flex circuit structures, proper design for operating environment, and base material selection. The design guidelines for flexible circuits, although similar to those for rigid circuits, have distinctive differences that are influenced by specific applications and the intended operating use environments. Communication with your fabricator is paramount when designing flex and rigid-flex circuits.

IPC Designers Council Viewpoint: Gary Ferrari

As co-founder and longtime executive director of the Designers Council, Gary Ferrari has dedicated a big part of his career to PCB design. After decades of service, he was inducted into the IPC Hall of Fame at IPC APEX EXPO this year. I caught up with Gary and asked him to fill us in on the creation of the Designers Council, and some of the changes he’s seen in the last 24 years.

Lightning Speed Laminates: Why Do Different Test Methods Yield Different Electrical Values?

A variety of different test methods may be used for any one electrical concern. This article will discuss the issues related to determining the dielectric constant (Dk) and dissipation factor (Df or Tan-Delta). On a data sheet, a designer may see a Dk value for a material to be 3.5, as an example. Once the designer buys the material and performs necessary evaluations, it may be found that the Dk of the material is 3.8. In some applications this difference in Dk is probably not meaningful; however, for many RF and high-speed digital applications, this difference could be very significant.

IPC Designers Council Viewpoint: Mike Creeden

When covering the IPC Designers Council, one quickly learns that it’s the volunteers who make the train run on time. San Diego PCB CEO Mike Creeden, CID+, is one such volunteer, and as a member of the Designers Council’s Executive Board, he was a must-have for this issue. I tracked him down and asked him to give us a rundown of his involvement with the DC, and to explain why designers might want to get involved with their local DC chapters.


Electrical Design Challenges for Automotive PCBs

A recent article in this magazine by Monica Andrei of Continental Automotive Systems emphasized the systemic nature of an automobile and discussed the characteristics and adoption of software design tools to enable such system-level design. Recognizing that electrical challenges are part of the automotive system-level discussion, this article will present more detail on signal integrity. Future discussion is planned regarding EMI, power integrity, and thermal integrity.

Happy’s Essential Skills: The Need for Total Quality Control (Six Sigma and Statistical Tools): Part 1

In this first of many columns covering my "Twenty-Five Essential Skills Every Engineer Needs to Learn," I will expand on each of those skills. To read the introduction to this series, which published in the January issue of The PCB Magazine. As a quick recap, here are the 25 skills that I will be writing about over the next 18 months or so, to publish every three weeks or so in the PCB007 Daily Newsletter.

McCurdy: How to Build a Successful IPC Designers Council Chapter

When Scott McCurdy made his transition from PCB fabrication to a PCB layout focus about 13 years ago, he accepted an invitation to attend our local IPC Designer’s Council. Shortly after, he was recruited to serve on the group’s steering committee. At that time, 20–25 people were regularly attending the meetings. When the chapter president moved, he asked Scott to take his place. Now, Orange County chapter meetings often draw close to 100 attendees.

IPC Designers Council: Serving PCB Designers for Almost 25 Years

You may have seen Anne Marie Mulvihill at the Design Forum during IPC APEX EXPO, rounding up speakers with a sarcastic comment or two. As PCB design program manager for IPC, Anne Marie makes the design train run on time. When I told Anne Marie that we were covering the Designers Council for this issue, she jumped at the chance to help us.

Beyond Design: Plane Crazy, Part 1

A high-speed digital power distribution network (PDN) must provide a low inductance, low impedance path between all ICs on the PCB that need to communicate. In order to reduce the inductance, we must also minimize the loop area enclosed by the current flow. Obviously, the most practical way to achieve this is to use power and ground planes in a multilayer stackup. In this two-part column, I will look at the alternatives to planes, why planes are used for high-speed design, and the best combination for your application.

Industry 4.0: Creating a Standard

Mentor Graphics Valor Division's Dan Hoz, general manager, and Ofer Lavi Ben David, product line director, discuss where Industry 4.0 is taking the industry, and the changes it will bring to both large and small companies, customers, and the supply chain, including how Mentor connects different machines on the shop floor to provide universal Industry 4.0 visibility.

IPC Designers Council Viewpoint: Rick Hartley

Rick Hartley has been in involved in PCB design and design education for decades, so it’s no surprise that he started working with the IPC Designers Council early on. Now retired from his day job at L-3, Rick still teaches PCB design and shows no sign of slowing down. I asked him to discuss his work with the Designers Council, and what the group means to the design community.

The Shaughnessy Report: Are You Drowning in Data?

Data management was so much simpler during the days of Mylar and Bishop Graphics tape. Data was handwritten. All you had to do was keep track of your paperwork and you were golden. Now, you’re all much more productive, but you have data coming out of your ears; slowly but surely, incrementally, data has become much more complicated. How do designers and engineers wind up managing all of this data? With kluged-together processes and software tools, and the occasional handwritten notes.

IPC: Connecting Electronics Industries

John Mitchell, president and CEO of IPC—Association Connecting Electronics Industries, provides the basic overview of the association—its goals and basic mission, activities, and how it best serves its membership. He also provides a snapshot of how IPC promotes technology development in the industry through standardization.

DownStream Takes on Data Documentation Management

Most designers will tell you that, as much as they enjoy laying out boards, they dislike the final data documentation step, which often involves various formats, including handwritten notes. Enter DownStream Technologies, a company founded 14 years ago to address the challenges related to post-processing the design. Senior Product Marketing Manager Mark Gallant recently discussed the company’s efforts to take the pain out of data documentation, even as data becomes more complex.


Mentor Graphics: The Past, Present and Future of Analytics

Farid Anani, consulting manager with Mentor Graphics' Valor Division, discusses with I-Connect007's Andy Shaughnessy a paper he presented at SMTAI that focused on analytics and how it can be used to increase business revenue. He also talks about how far analytics has come in the last 20 years and where it may be headed in the future.

The Key to Understanding Industry 4.0: Show, Don’t Tell!

At the recent productronica event in Germany, Mentor Graphics set up a racecar track in their booth. In an interview with I-Connect007, Michael Ford, senior marketing development manager at Mentor's Valor Division, explains why it's a perfect analogy for understanding Industry 4.0.

Why Autorouters Don’t Work: The Mindset!

Ask any group of PCB designers what they think of autorouters and the majority will say that they do not use them because they do not work. I have been battling this mindset for over 20 years now and it still persists today, even with the dramatic advances in routing technology. This way of thinking generally comes from those designers who use the entry-level tools. But even the most primitive autorouter may have some useful features. It’s all about changing that mindset of the designer and having a crack at it.

Rogers Scales up Production and Integrates Arlon Range

Editor Pete Starkey interviews Rogers European Sales Manager John Hendricks at productronica 2015. Hendricks updates us on Rogers’ acquisition of Arlon, and explains how the Arlon products are complementary to Rogers’ existing materials.

The Associations Issue

Well, it’s the end of the year. How did that happen? It really is true that every year goes by a little faster. You young whippersnappers out there won’t know what I’m talking about, but just you wait and see. We changed it up for our December issues this year. Instead of doing a year-end review, we decided to devote this month to our associations and trade organizations—at least some, because when you start poking around, you will find there are scads of them.

EMA: Helping Technologists Manage Disparate Data

Today’s EDA tools are better than ever, but managing design data, from schematics through Gerbers, can be an unwieldly task. I recently interviewed Manny Marcano, president and CEO of EMA Design Automation. He discusses EMA’s approach to managing a variety of types of complex data, the need for seamless data processes, and the future of compliance-aware design.

Honeywell Paper Investigates Avionics Vibration Durability

Dr. Joseph Juarez, principal mechanical engineer at Honeywell International, discusses with I-Connect007's Andy Shaughnessy his SMTA paper, which addresses avionics vibration durability between tin-lead and lead-free solder, the years of testing he conducted, the importance of doing a good soldering job, and some of the surprising findings of his research.

Pulsonix Poised to Take More EDA Market Share

Publisher Barry Matties met with Bob Williams, managing director and co-owner of Pulsonix, and Sales and Marketing Manager Tyrone Stephens to discuss the challenges facing the EDA tool market, and how they’re establishing this company in the global design tool marketplace.

SnapEDA: The Female-Owned Startup Revolutionizing CAD Data

SnapEDA founder Natasha Baker may mark the beginning of a new trend in EDA: young female entrepreneurs. (When was the last time we heard about an EDA startup?) As her company prepared for a major launch, Natasha took time to explain the philosophy behind SnapEDA, and how the company is helping designers and engineers manage an ever-increasing volume of CAD data.

Orange County IPC Designers Council Meeting Draws Record Crowd

On November 18, the Orange County Chapter of the IPC Designers Council held a “Lunch ‘n’ Learn” event at the Harvard Park Community Center in Irvine, California. Eighty-nine PCB designers and electronics industry professionals gathered to listen to a talk by Chris Heard, a signal integrity engineering consultant at CSH Consulting LLC.


Navigating the Global Materials Supply Chain: A Roundtable Discussion

At SMTAI recently, I-Connect007's Andy Shaughnessy sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group; and Jack Pattie, president of Ventec USA. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen and Bob Willis, from the National Physics Laboratory (NPL).

Good In, Good Out: Bay Area Circuits Discusses Data Strategies

A lot of companies talk about the importance of good data management, but for some firms, this amounts to little more than lip service. Then there are companies like fabricator Bay Area Circuits. I recently sat down with Bay Area Circuits President Stephen Garcia and COO Brian Paper to discuss how automating and upgrading their data systems has significantly cut down overall process time, as well as their drive to educate young PCB designers and actively promote the industry to the emerging electronics industry workforce.

The Gerber Guide, Chapter 3: The PCB Profile

The profile defines a simple region in the 2D plane. The proper way to do this is to specify a closed contour: The inside of the contour is the PCB, and the outside is not. It is that simple. Note that such a simple region is solid, without holes. By definition then, a profile cannot have holes intentionally placed within it. These are superfluous and represent an unnecessary and complicated duplication given that drill holes are well defined in the drill/rout file. One can view cut-outs in a PCB as still part of the PCB, just as much as the drill holes are.

Mentor’s Michael Ford on Lean for Surface Mount Processes

Michael Ford, senior marketing development manager with Mentor Graphics, Valor Division, discusses with I-Connect007's Andy Shaughnessy his paper presentation on lean systems in surface mount processes. He also talks about how the industry is now starting to look at Industry 4.0, and why the industry should stop focusing on the endless optimization processes, which are still important, but consider the optimization from the point of view of the product.

All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs.

productronica 2015: Ucamco's Integr8tor Incorporates Polar Stack-up Functionality

Big extensions to the capabilities of the Integr8tor client-server work-flow system, way beyond the established CAM functions, now include full product definition covering all production stages of PCB manufacture, including flex and flex-rigid technologies. Integr8tor now incorporates all of the functionality of Polar Instruments’ stack-up design package, instantly accessible.

Beyond Design: Stackup Planning, Part 4

In this final part of the Stackup Planning series, I will look at 10-plus layer counts. The methodology I have set out in previous columns can be used to construct higher layer-count boards. In general, these boards contain more planes and therefore the issues associated with split power planes can usually be avoided. Also, 10-plus layers require very thin dielectrics in order to reduce the total board thickness. This naturally provides tight coupling between adjacent signal and plane layers reducing crosstalk and electromagnetic emissions.

Polar Instruments Fine-Tunes Layer Stackup Management

Polar Instruments CEO Martyn Gaudion and Technical Editor Pete Starkey discuss Polar’s efforts to simplify specification issues related to the supply chain. Designing PCBs with mixed materials makes layer stackup management more difficult than ever, but Gaudion explains how Polar works closely with materials providers and CAD tool vendors in order to provide users with constantly updated information.

Speeding up the Design Cycle: 10 Things to Remember

Many people understand the value of a PCB, but do not understand the best way to interact with PCB manufacturers. Poor planning and communication with fabricators slows down the design cycle and increases overall costs for your project. In this column, Mark Thompson streamline the design cycle through fabrication. Following my tips will minimize the need for future revisions and ensure you get quality boards on time.

Arlon’s John Wright Discusses New High-Performance Materials

During productronica, European Editor Pete Starkey interviewed Engineering/Quality Manager John Wright of Arlon. They discussed Arlon’s new 85HP ceramic-filled polyimide, as well as a non-woven aramid material, suitable for space applications, that is a drop-in replacement for a similar material discontinued by a competitor in 2006.


The SMT Internet of Things— Back to Basics

Different people have different understandings and expectations about what the Internet of Things (IoT) actually is, especially with respect to how it could work and what it could bring to the SMT assembly industry. There are a lot of expectations to fulfil as principles behind innovations such as Industry 4.0 take hold.

Lightning Speed Laminates: Impact of Final Plated Finish on PCB Loss

A variety of plated finishes are used in the PCB industry. Depending on the circuit construction and other variables, the plated finish can cause an increase in PCB insertion loss. The plated finish used on the outer ground planes of a stripline circuit have minimal or no impact on insertion loss. However, microstrip or grounded coplanar waveguide circuits, which are common on the outer layers of multilayer high-frequency PCBs, can be impacted by the plated finish for increasing the insertion loss.

Accelerating the PCB Design Cycle

An area of communications that is often underappreciated, but has become vitally important to design efficiency, is the dialogue with the PCB fabricator. It’s critical to engage the fabricator very early in the design process to nail down the proper materials and stack-up. With so many options for via structures, it is critical to select the most appropriate structure for the design. Adding blind and/or buried vias as an afterthought can limit their utilization and drive up the printed circuit board cost.

Accelerating the Design Cycle : Moving from Discipline-Centric to Product-Centric Design

Today, the design process in most cases fans out from the requirements as defined by marketing into multiple independent design threads that converge at the prototype. There is usually no systematic method for these different disciplines to communicate their work to the other disciplines. This lack of communication often leads to conflicting design decisions, such as when an electrical engineer or purchaser selects a component without having any way of knowing that it interferes with the enclosure. Extra design turns are often needed to resolve these conflicts at the prototype stage.

The Readers Speak: Tips on Accelerating your Design Cycle

This month, in addition to publishing feature articles by well-known experts in the field, we decided to collect feedback from the readers—PCB designers and engineers working in the trenches each day. We asked our readers to provide their favorite tips, tricks, and techniques for speeding up the PCB design cycle. Here are 10 tips for cutting your design time, courtesy of designers just like you.

The Material Witness: Nonwoven Aramid Reinforcement is Back

In the 1st century AD, there was significant debate among Jewish theologians as to whether resurrection was possible. PCB designers in the early 21st century have had a similar concern about future availability of 85NT nonwoven aramid laminate and prepreg. The stakes may be somewhat less critical, but the future of a wide variety of programs designed around the properties of Thermount have been hanging in the balance.

Flex Circuit Shielding Design Options

Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.

Insulectro Hosts Silicon Valley Designers Council Meeting

On October 15, about 25 people gathered for the IPC Designers Council Silicon Valley Chapter meeting at Insulectro's Mountain View facility. Carl Schattke, senior PCB design engineer at Tesla, was the main speaker. His presentation covered a variety of facets of PCB design, from shadowing to the location of component based on weight and surface finishes.

The Shaughnessy Report: Squeezing Seconds Out of the Design Cycle

When you’re designing a board, time is always your enemy. That’s what we learned when we surveyed our readers recently. PCB designers said that time pressure was one of their least favorite parts of the job, and in some cases, they were ready to retire just to avoid design cycle challenges. I imagine that many of you near retirement, and that’s quite a few of you, feel the same way.

The Challenges of Being Competitive in Automotive Electronics Manufacturing

Simple electronics were gradually introduced into automobiles from the earliest times. At first, these were just simple electro-mechanical devices to make cars work without manual effort, such as to start the engine and keep windshields clear. But in this past decade, we have seen the effects of the gradual growth of issues with electronics systems, with recalls caused by safety issues that cost automotive manufacturers millions of dollars. Electronics within an automotive environment today requires a new approach to ensure a higher level of quality perfection.


Top Gear: PADS Professional Road Test

In this column, Barry Olney test drives the newest version of the Mentor Graphics PADS Professional EDA tool. "Based on Xpedition technology, PADS Professional is a major improvement over the previous PADS suite of tools. utilizes xDX Designer as the front-end design entry tool. The latest routing technology is fast, smooth to drive, and hugs the corners well, with all the horsepower you need for the most demanding design."

The Shaughnessy Report: Car Talk

The automotive electronics segment has exploded. Early cars didn’t have much in the way of electronics. Even in 1950, electronics made up only 1% of a car’s cost. But that figure is expected to hit 35% in 2020, and 50% in 2030. The global automotive electronics market is forecast to hit $314.4 billion by 2020, and that means a whole lot of PCBs.

Leo Lambert on EPTAC's Customized Training Plans

Andy Shaughnessy interviewed Leo Lambert, vice president and technical director of EPTAC, at SMTA International. Leo Lambert, vice president and technical director of EPTAC, explains how the New Hampshire-based company continues to provide customized training and IPC certification offerings, including its IPC Certified Interconnect Designer (CID) and CID+ classes.

The Gerber Guide, Chapter 2

Never mirror or flip layers! All layers must be viewed from the top of the PCB, which means that the text must be readable on the top layer and mirrored on the bottom layer. Alas, sometimes, in a mistaken attempt to be helpful, designers flip layers because they must anyway be mirrored on the photoplotter. This could be helpful in a world where the designer's files are used directly in fabrication, but these data layers are actually input for the CAM system.

Physics of Failure Durability Simulations for Automotive Electronics

Automotive electronics systems are becoming increasing complex and essential for the proper, safe operation of cars and trucks. Vehicle controls for basic operation and safety functions are increasingly being implemented by electronic modules. The ability of these electronic systems to function reliably is becoming a greater aspect of vehicle safety as was dramatically demonstrated by the 2009–2011 recall of over 9 million Toyota vehicles for unintended acceleration issues.

Jack Pattie Discusses New Ventec Facility

Jack Pattie, CEO of Ventec USA, discusses the company's newest laminate facility, which recently opened in Northern California. He explains how this location, the company's fourth, will help Ventec better serve customers in that region.

Automotive Systems Design: a Support Engineer’s Perspective

In a nutshell, the promise of the system design approach is to allow for hitting the “sweet spot” in terms of functionality, quality and reliability, in the shortest possible design time and with the lowest possible resource investments. In an industry that has a very long time to market (on average around 1,000 days), steadily increasing quality demands and an ever intensifying pressure to lower costs, all these promises become most attractive and compelling.

The Reindustrialisation of Europe

With an inquisitive mind and a head for challenges, besides the ability to think outside the box and the courage to dare to be different and strive to be first, Spirit Circuits MD Steve Driver can be relied upon to grab the attention of an audience of PCB professionals. As keynote speaker at the Institute of Circuit Technology Hayling Island Seminar, he lived up to his reputation with a motivational presentation, the two themes of which exemplified his latest entrepreneurial venture.

Mentor Graphics Helps Bridge Gap Between PCB and RF

Recently, Publisher Barry Matties met with Per Viklund, the director of IC packaging and RF product lines at Mentor Graphics, and Alex Caravajal, business development manager with Mentor. They discussed the challenges facing PCB designers working with RF and microwave technology, and Mentor’s efforts to help reduce the RF design cycle time.

Failure May Not Be an Option, but Sometimes It's a Reality

I’ve had mechanical engineers question why we are bothering with circuit boards instead of designing the circuitry into the plastic housing of the device. I’ve had manufacturing engineers demand that I shelve the electrical considerations in order to meet manufacturing requirements, and electrical engineers who could care less if the product could actually be built. I’ve had engineers hover over my shoulder watching each and every stroke of the mouse that I make, and others who are never available for important questions which ultimately brought the whole project to a grinding halt.


Car Talk

The automotive electronics segment has exploded. Early cars didn’t have much in the way of electronics. Even in 1950, electronics made up only 1% of a car’s cost. But that figure is expected to hit 35% in 2020, and 50% in 2030--and that means a whole lot of PCBs. This issue of The PCB Design Magazine features the impact of increasing electronics content in cars on the PCB design and manufacturing industry.

Failure Mode: Hole Wall Pullaway

This column is based on my experience in test reliability of interconnect stress test (IST) coupons. I am addressing HWPA that features moderate to severe outgassing. There may be HWPA due to thermal stressing of the board without any significant outgassing, but this type of HWPA is subtle, and it presents as a dark line between the plating and the dielectric of the hole wall. This type of HWPA is rarely detected.

Material Witness: Using Scaled Flow Data

Resin systems whose density is not very near 1.35 do not quite fit into the official IPC test method because all the stack weight data used assumes epoxy resin of a standard 1.35 density. Any resin whose density varies from that value requires a new set of calculated weights for various stack-ups in order to provide precise data. This is especially true of filled systems whose resin density now includes a ceramic component as well as the organic resins themselves and may have densities higher than standard.

Beyond Design: Stackup Planning, Part 3

Following on from the first Stackup Planning columns, this month’s Part 3 will look at higher layer-count stackups. The four- and six-layer configurations are not the best choice for high-speed design. In particular, each signal layer should be adjacent to, and closely coupled to, an uninterrupted reference plane, which creates a clear return path and eliminates broadside crosstalk. As the layer count increases, these rules become easier to implement but decisions regarding return current paths become more challenging.

Kelly Dack and Mark Thompson Unite in the War on Failure

There’s been a lot of talk about fighting the war on failure in the PCB industry. But what strategies should our generals follow to prosecute this war? What exactly constitutes a failure in the first place? Is this war even winnable? I recently spoke with longtime designer Kelly Dack and CAM support veteran Mark Thompson of Prototron Circuits about the best battle plans for beating failure, and why designers and manufacturers must team up against this common enemy.

Training the Next-Generation Engineer: When Does it Begin and End?

American engineering companies are seeing a severe shortage of the homegrown engineers required to compete globally. Just go into any company today and you’ll notice that increasingly, the engineers are foreign-born. Our local universities are seeing fewer and fewer American engineering students each year. Universities are also seeing a growth in female students. Over 50% of college student are now female, and women traditionally are not attracted to science and engineering majors. What is causing this imbalance?

Karel Tavernier: The Gerber Guide

It is possible to fabricate PCBs from the fabrication data sets currently being used—it's being done innumerable times every day. But is it being done in an efficient, reliable, automated and standardized manner? At this moment in time, the honest answer is no, because there is plenty of room for improvement in the way in which PCB fabrication data is currently transferred from design to fabrication.

Nick Barbin: From Designer to EMS Company Owner

Many PCB designers would rather do just about anything than pore over a P&L spreadsheet. But Nick Barbin isn’t a typical designer. He co-founded the design bureau Optimum Design Associates over two decades ago, and the company later expanded into contract manufacturing and Lean processes. In this interview, Nick discussed how he wound up leading an EMS company on the Inc. 5000 list.

Supply Chain Challenges and Opportunities

Let’s start by defining exactly what a supply chain is. It’s not a nautical term for an anchor chain, or a dynamic part of a chainsaw that never runs out of chain. No, it’s a key term used in the organization of resources which may form a system between entities. Now this sounds a little closer to something that may be utilized in producing an electronic end-item, in our case, a printed circuit board.

Fighting the War on Failure

No one in this industry sets out to fail, except failure analysis test engineers. But failure is a part of life for designers and manufacturers of electronics. Our reader surveys show that failure affects nearly everyone in the PCB industry: designers, fabricators, assembly providers, OEMs, and suppliers.


Gary Ferrari Shares His Thoughts on PCB Design and More

Recently, I spoke with Gary Ferrari, director of technical support at Firan Technology Group, about numerous topics related to PCB design. Our conversation ranged from CID training to the need for reaching high school students as a way of introducing more young people to career opportunities in our industry. We also covered strategies for helping customers design and build better product, and keeping designers provided with the most critical part of their supply chain—information.

Ten Considerations for Outsourcing PCB Designs

Outsourcing your design work is a big deal. How do you know that the end-result will be as you envisaged? Will you have full control of your design? Will it be done to the quality you expect and within the time frame required? Outsourcing can pose some fairly scary questions, so what are the key things to consider and what are the pitfalls to avoid? Steve Dobson of Quadra Solutions explains.

Material Witness: The Use of Fillers in Composites

The use of finely divided ceramic fillers in composites intended for use in printed wiring boards has a long history, but most people still associate the idea with reducing the cost of the product by loading it with an inexpensive inert filler. Nothing could be further from the truth...

Design and Manufacture of High-Voltage Electronics

This SMART Group webinar, presented by Ian Lake, director of engineering at Applied Kilovolts Ltd, and moderated by Bob Willis, explored the current technical barriers faced in high-voltage electronics design and manufacturing processes. Although he made it clear that within the timeframe of a webinar session he could only scratch the surface of the topic, Lake gave a valuable insight into basic concepts and drivers and set a perspective on current state of the art and future trends.

Strategies for Improving PCB Procurement

The PCB procurement process has certainly changed over the years. Some people are happy buying a board from a website, but for others the demands are different. Russ Adams should know; he’s the sales manager for Prototron Circuits, a PCB fabricator that has been in business for nearly 30 years, with facilities in Redmond, Washington, and Tucson, Arizona. I recently met up with Adams to discuss customers’ evolving requirements, along with his ideas for lowering the total procurement cost.

IPC-A-610: What's New With Rev F?

Why are new revisions created anyway? Can’t IPC just issue updates to the existing revision? Who defines what the changes are going to be and who approves of those changes? Why can’t they make changes for all the new technologies available? And the best question of all: Why does my product have some conditions that are not covered in the documents and specifications? Leo Lambert explains.

Fast Interconnect: Engineering Services for the Masses

Gary Griffin and Ana Rosique are co-founders of Fast Interconnect, an Arizona-based product engineering company designed to serve an underserved market: the small product developers, inventors, and anyone with an idea for a “cool gadget.” I caught up with Griffin recently to discuss the new company, its innovative business model, and the challenges facing smaller OEMs and product developers.

Changing the Face of Displays…One Button at a Time

Michael Detarando, president and CEO of Incom, and Emilijo Mihatov, business development manager at Fairlight discuss with I-Connect007's Barry Matties how Fairlight is incorporating Incom's technology into their famous products for the recording and broadcast industries, along with other applications such as elevator control panels.

Max Maxfield Looks at the Future of Electronics

Clive “Max” Maxfield has worked for decades in this industry, and in a variety of capacities: Engineer, author, editor, columnist, blogger, and keynote speaker, just to name a few. I caught up with my former columnist recently and asked him what he’d been doing to stay out of trouble, and what sort of technology and futuristic electronic gadgets were piquing his interest right now.

Avoid Overbuilding your RF Printed Circuit Board

Today, many companies are overbuilding and “overmaterializing” their RF printed circuit boards. In this interview, James Hofer of Accurate Circuit Engineering (ACE) shares some strategies to avoid doing both, which will help lower the total cost of your PCB and improve the overall product quality. Hofer also discusses some of the challenges in the laminate supply chain.


Rigid-Flex PCB Right the First Time--Without Paper Dolls

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.

The Past, Present, and Future of IPC-A-610

To understand the ultimate power of IPC-A-610, you need to first understand what is at the core of this standard. IPC-A-610 is a collection of visual quality acceptability requirements for electronic assemblies. It is utilized as a post-assembly acceptance standard to ensure that electronic assemblies meet acceptance requirements.

EIPC Summer Conference: Day 2

Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.

TTM: Consult Fabricators Early for PCB Designs

Recently, I attended the Designers Council “Lunch and Learn” at Broadcom’s office in Orange County, California. One of the speakers at this event was Julie Ellis, a field applications engineer with TTM Technologies. She sat down with me to discuss her presentation and some of the ways fabricators can assist PCB designers.

EIPC Summer Conference, Berlin: Day 1

Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.

Kelly Dack Discusses His Recent Move

Dan Beaulieu has known the Prototron staff for years, and worked with them for a number of years as well. So, when he heard that they had hired Kelly Dack, a longtime PCB designer and guest editor for PCBDesign007, Dan wasted no time meeting with Kelly to talk about his new position, the future of PCB design, and the nascent interest millennials are showing in the PCB industry.

Cannonball Stack for Conductor Roughness Modeling

In the GB/s regime, accurate modeling of conductor losses is a precursor to successful high-speed serial link designs. Failure to model roughness effects can ruin your day. The cannonball stack is an example of a cubic close-packing of equal spheres, and is the basis of modeling the surface roughness of a conductor in this article. So, what do cannonballs have to do with modeling copper roughness anyway? Bert Simonovich explains.

A Review of the Opportunities and Processes for Printed Electronics (Part 1)

As microsystems continue to move towards higher speed and microminiaturization, the demands for interconnection are opening up new opportunities for "innovative" interconnects. In the first part of this five-part article series, Happy Holden gives a brief background on printed electronics, as well as presents key technologies that are being employed for PE production.

Electronic Design Training Crucial to Industry Growth

In the UK, the electronics industry contributes over £80 billion (approximately US$120 million) to the economy, representing 5.4% of UK GDP, employing over 850,000 people. There is, however, in many countries, a growing concern around labour shortages within the electronics industry, with worries over appropriate workforce skill levels growing.

The Composite Properties of Rigid vs. Multilayer PCBs

Most materials systems used in PWBs (aka PCBs) are composites of resins, fabric substrates and metal cladding. Each of these components has its own unique electrical and mechanical properties that contribute to the final characteristics of the finished laminates, prepregs and fabricated multilayer boards (MLBs). In most cases variables such as glass style and resin content have offsetting impacts on physical vs. electrical properties. Chet Guiles explains.


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