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Medical PCB Design: Not Just Another High-Rel Board

Some of the coolest new electronic products have come courtesy of the medical market. I wanted to find out more about this fast-growing segment, so I contacted Kenneth MacCallum, an engineering physicist with StarFish Medical. MacCallum, an engineering physicist who designs PCBs for medical applications, explained why medical PCBs are not quite like other high-reliability boards.

Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 1

In his new Designers Notebook column, Verb Solberg discusses primary flex circuit structures, proper design for operating environment, and base material selection. The design guidelines for flexible circuits, although similar to those for rigid circuits, have distinctive differences that are influenced by specific applications and the intended operating use environments. Communication with your fabricator is paramount when designing flex and rigid-flex circuits.

Lightning Speed Laminates: Why Do Different Test Methods Yield Different Electrical Values?

A variety of different test methods may be used for any one electrical concern. This article will discuss the issues related to determining the dielectric constant (Dk) and dissipation factor (Df or Tan-Delta). On a data sheet, a designer may see a Dk value for a material to be 3.5, as an example. Once the designer buys the material and performs necessary evaluations, it may be found that the Dk of the material is 3.8. In some applications this difference in Dk is probably not meaningful; however, for many RF and high-speed digital applications, this difference could be very significant.

Electrical Design Challenges for Automotive PCBs

A recent article in this magazine by Monica Andrei of Continental Automotive Systems emphasized the systemic nature of an automobile and discussed the characteristics and adoption of software design tools to enable such system-level design. Recognizing that electrical challenges are part of the automotive system-level discussion, this article will present more detail on signal integrity. Future discussion is planned regarding EMI, power integrity, and thermal integrity.

McCurdy: How to Build a Successful IPC Designers Council Chapter

When Scott McCurdy made his transition from PCB fabrication to a PCB layout focus about 13 years ago, he accepted an invitation to attend our local IPC Designer’s Council. Shortly after, he was recruited to serve on the group’s steering committee. At that time, 20–25 people were regularly attending the meetings. When the chapter president moved, he asked Scott to take his place. Now, Orange County chapter meetings often draw close to 100 attendees.

Beyond Design: Plane Crazy, Part 1

A high-speed digital power distribution network (PDN) must provide a low inductance, low impedance path between all ICs on the PCB that need to communicate. In order to reduce the inductance, we must also minimize the loop area enclosed by the current flow. Obviously, the most practical way to achieve this is to use power and ground planes in a multilayer stackup. In this two-part column, I will look at the alternatives to planes, why planes are used for high-speed design, and the best combination for your application.

IPC Designers Council Viewpoint: Rick Hartley

Rick Hartley has been in involved in PCB design and design education for decades, so it’s no surprise that he started working with the IPC Designers Council early on. Now retired from his day job at L-3, Rick still teaches PCB design and shows no sign of slowing down. I asked him to discuss his work with the Designers Council, and what the group means to the design community.

Mentor Graphics: The Past, Present and Future of Analytics

Farid Anani, consulting manager with Mentor Graphics' Valor Division, discusses with I-Connect007's Andy Shaughnessy a paper he presented at SMTAI that focused on analytics and how it can be used to increase business revenue. He also talks about how far analytics has come in the last 20 years and where it may be headed in the future.

The Key to Understanding Industry 4.0: Show, Don’t Tell!

At the recent productronica event in Germany, Mentor Graphics set up a racecar track in their booth. In an interview with I-Connect007, Michael Ford, senior marketing development manager at Mentor's Valor Division, explains why it's a perfect analogy for understanding Industry 4.0.

Rogers Scales up Production and Integrates Arlon Range

Editor Pete Starkey interviews Rogers European Sales Manager John Hendricks at productronica 2015. Hendricks updates us on Rogers’ acquisition of Arlon, and explains how the Arlon products are complementary to Rogers’ existing materials.


Pulsonix Poised to Take More EDA Market Share

Publisher Barry Matties met with Bob Williams, managing director and co-owner of Pulsonix, and Sales and Marketing Manager Tyrone Stephens to discuss the challenges facing the EDA tool market, and how they’re establishing this company in the global design tool marketplace.

SnapEDA: The Female-Owned Startup Revolutionizing CAD Data

SnapEDA founder Natasha Baker may mark the beginning of a new trend in EDA: young female entrepreneurs. (When was the last time we heard about an EDA startup?) As her company prepared for a major launch, Natasha took time to explain the philosophy behind SnapEDA, and how the company is helping designers and engineers manage an ever-increasing volume of CAD data.

Orange County IPC Designers Council Meeting Draws Record Crowd

On November 18, the Orange County Chapter of the IPC Designers Council held a “Lunch ‘n’ Learn” event at the Harvard Park Community Center in Irvine, California. Eighty-nine PCB designers and electronics industry professionals gathered to listen to a talk by Chris Heard, a signal integrity engineering consultant at CSH Consulting LLC.

Speeding up the Design Cycle: 10 Things to Remember

Many people understand the value of a PCB, but do not understand the best way to interact with PCB manufacturers. Poor planning and communication with fabricators slows down the design cycle and increases overall costs for your project. In this column, Mark Thompson streamline the design cycle through fabrication. Following my tips will minimize the need for future revisions and ensure you get quality boards on time.

Arlon’s John Wright Discusses New High-Performance Materials

During productronica, European Editor Pete Starkey interviewed Engineering/Quality Manager John Wright of Arlon. They discussed Arlon’s new 85HP ceramic-filled polyimide, as well as a non-woven aramid material, suitable for space applications, that is a drop-in replacement for a similar material discontinued by a competitor in 2006.

Accelerating the PCB Design Cycle

An area of communications that is often underappreciated, but has become vitally important to design efficiency, is the dialogue with the PCB fabricator. It’s critical to engage the fabricator very early in the design process to nail down the proper materials and stack-up. With so many options for via structures, it is critical to select the most appropriate structure for the design. Adding blind and/or buried vias as an afterthought can limit their utilization and drive up the printed circuit board cost.

Accelerating the Design Cycle : Moving from Discipline-Centric to Product-Centric Design

Today, the design process in most cases fans out from the requirements as defined by marketing into multiple independent design threads that converge at the prototype. There is usually no systematic method for these different disciplines to communicate their work to the other disciplines. This lack of communication often leads to conflicting design decisions, such as when an electrical engineer or purchaser selects a component without having any way of knowing that it interferes with the enclosure. Extra design turns are often needed to resolve these conflicts at the prototype stage.

Flex Circuit Shielding Design Options

Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.

The Challenges of Being Competitive in Automotive Electronics Manufacturing

Simple electronics were gradually introduced into automobiles from the earliest times. At first, these were just simple electro-mechanical devices to make cars work without manual effort, such as to start the engine and keep windshields clear. But in this past decade, we have seen the effects of the gradual growth of issues with electronics systems, with recalls caused by safety issues that cost automotive manufacturers millions of dollars. Electronics within an automotive environment today requires a new approach to ensure a higher level of quality perfection.

The Shaughnessy Report: Car Talk

The automotive electronics segment has exploded. Early cars didn’t have much in the way of electronics. Even in 1950, electronics made up only 1% of a car’s cost. But that figure is expected to hit 35% in 2020, and 50% in 2030. The global automotive electronics market is forecast to hit $314.4 billion by 2020, and that means a whole lot of PCBs.


Leo Lambert on EPTAC's Customized Training Plans

Andy Shaughnessy interviewed Leo Lambert, vice president and technical director of EPTAC, at SMTA International. Leo Lambert, vice president and technical director of EPTAC, explains how the New Hampshire-based company continues to provide customized training and IPC certification offerings, including its IPC Certified Interconnect Designer (CID) and CID+ classes.

Jack Pattie Discusses New Ventec Facility

Jack Pattie, CEO of Ventec USA, discusses the company's newest laminate facility, which recently opened in Northern California. He explains how this location, the company's fourth, will help Ventec better serve customers in that region.

Automotive Systems Design: a Support Engineer’s Perspective

In a nutshell, the promise of the system design approach is to allow for hitting the “sweet spot” in terms of functionality, quality and reliability, in the shortest possible design time and with the lowest possible resource investments. In an industry that has a very long time to market (on average around 1,000 days), steadily increasing quality demands and an ever intensifying pressure to lower costs, all these promises become most attractive and compelling.

Failure Mode: Hole Wall Pullaway

This column is based on my experience in test reliability of interconnect stress test (IST) coupons. I am addressing HWPA that features moderate to severe outgassing. There may be HWPA due to thermal stressing of the board without any significant outgassing, but this type of HWPA is subtle, and it presents as a dark line between the plating and the dielectric of the hole wall. This type of HWPA is rarely detected.

Material Witness: Using Scaled Flow Data

Resin systems whose density is not very near 1.35 do not quite fit into the official IPC test method because all the stack weight data used assumes epoxy resin of a standard 1.35 density. Any resin whose density varies from that value requires a new set of calculated weights for various stack-ups in order to provide precise data. This is especially true of filled systems whose resin density now includes a ceramic component as well as the organic resins themselves and may have densities higher than standard.

Nick Barbin: From Designer to EMS Company Owner

Many PCB designers would rather do just about anything than pore over a P&L spreadsheet. But Nick Barbin isn’t a typical designer. He co-founded the design bureau Optimum Design Associates over two decades ago, and the company later expanded into contract manufacturing and Lean processes. In this interview, Nick discussed how he wound up leading an EMS company on the Inc. 5000 list.

Design and Manufacture of High-Voltage Electronics

This SMART Group webinar, presented by Ian Lake, director of engineering at Applied Kilovolts Ltd, and moderated by Bob Willis, explored the current technical barriers faced in high-voltage electronics design and manufacturing processes. Although he made it clear that within the timeframe of a webinar session he could only scratch the surface of the topic, Lake gave a valuable insight into basic concepts and drivers and set a perspective on current state of the art and future trends.

Fast Interconnect: Engineering Services for the Masses

Gary Griffin and Ana Rosique are co-founders of Fast Interconnect, an Arizona-based product engineering company designed to serve an underserved market: the small product developers, inventors, and anyone with an idea for a “cool gadget.” I caught up with Griffin recently to discuss the new company, its innovative business model, and the challenges facing smaller OEMs and product developers.

Changing the Face of Displays…One Button at a Time

Michael Detarando, president and CEO of Incom, and Emilijo Mihatov, business development manager at Fairlight discuss with I-Connect007's Barry Matties how Fairlight is incorporating Incom's technology into their famous products for the recording and broadcast industries, along with other applications such as elevator control panels.

Avoid Overbuilding your RF Printed Circuit Board

Today, many companies are overbuilding and “overmaterializing” their RF printed circuit boards. In this interview, James Hofer of Accurate Circuit Engineering (ACE) shares some strategies to avoid doing both, which will help lower the total cost of your PCB and improve the overall product quality. Hofer also discusses some of the challenges in the laminate supply chain.


Rigid-Flex PCB Right the First Time--Without Paper Dolls

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way, while maintaining good flex-circuit stability and lifespan. The next big problem to solve is the conveyance of the design to a fabricator who will clearly understand the design intent and therefore produce exactly what the designer/engineer intended.

TTM: Consult Fabricators Early for PCB Designs

Recently, I attended the Designers Council “Lunch and Learn” at Broadcom’s office in Orange County, California. One of the speakers at this event was Julie Ellis, a field applications engineer with TTM Technologies. She sat down with me to discuss her presentation and some of the ways fabricators can assist PCB designers.

Cannonball Stack for Conductor Roughness Modeling

In the GB/s regime, accurate modeling of conductor losses is a precursor to successful high-speed serial link designs. Failure to model roughness effects can ruin your day. The cannonball stack is an example of a cubic close-packing of equal spheres, and is the basis of modeling the surface roughness of a conductor in this article. So, what do cannonballs have to do with modeling copper roughness anyway? Bert Simonovich explains.

The Composite Properties of Rigid vs. Multilayer PCBs

Most materials systems used in PWBs (aka PCBs) are composites of resins, fabric substrates and metal cladding. Each of these components has its own unique electrical and mechanical properties that contribute to the final characteristics of the finished laminates, prepregs and fabricated multilayer boards (MLBs). In most cases variables such as glass style and resin content have offsetting impacts on physical vs. electrical properties. Chet Guiles explains.

Broadcom PCB Design: Miniaturization on the Cutting Edge

Editor Andy Shaughnessy recently attended the Orange County Designer's Council “Lunch and Learn” meeting, held at the Broadcom offices on the campus of the University of California, Irvine. Afterward, he sat down with Scott Davis, CID, the senior manager of PC board design at Broadcom, to discuss the company’s savvy PCB design department and their approach to PCB design.

Polar Talks Impedance Control and Insertion Loss Testing

During IPC APEX EXPO, Guest Editor Dan Feinberg sat down with Polar Instruments product specialists Michael Bode and Geoffrey Hazlett to talk about the company and its products and solutions. They also discussed some of the signal integrity technologies being enabled by the company, including controlled impedance and insertion loss testing.

BGA or CGA: When Is It Right for You?

In this interview with TopLine President and Founder Martin Hart, I-Connect007 Publisher Barry Matties focuses on column grid array (CGA) and how CGA can solve delamination problems. CGAs, also known as CCGA, are not necessarily new but are making a strong comeback in the high reliability market.

An Optical Update with TTM

Barry Matties recently met with Marika Immonen, manager of R&D optical interconnects at TTM Technologies. They last spoke one year ago. This time, they discussed the optical project that she’s been leading, as well as the future of optical technology in the PCB industry.

Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market

I-Connect007 Publisher Barry Matties and recently-appointed Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.

Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts

At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.​


Panasonic Meeting Market Needs with Higher-Performance Megtron 7

I-Connect Technical Editor Pete Starkey sat down with Panasonic’s Tony Senese and Tomoyuki Abe at IPC APEX EXPO 2015 in San Diego--and high-speed digital materials, particularly those with very low-loss characteristics, was the focus of their discussion. Also noted were the positive responses from chemical process suppliers, and the realistic length of a product development cycle.

Effective Characteristic Impedance

Reflections can occur anytime there is an impedance mismatch on the line. Sources of mismatches are plentiful and include trace width changes, vias, stubs, reference plane changes, and even the so-called fiber weave effect. In this case, a trace can encounter a different dielectric constant depending on whether it is routed over glass or the epoxy resin in the dielectric material. In this investigation by Kirk Fabbri, it is the capacitive contribution of the different components that are of interest, and how they affect the characteristic impedance the driver sees.

Cirexx Introduces Eclisp, An Alternative to Co-fired Ceramics

Al Wasserzug, SR Business Development Exec at Cirexx, talks about their new product, Eclisp. Developed in conjunction with Lockheed Martin, Eclisp is an alternative to co-fired ceramics and used to evacuate heat very efficiently with a low CTE. Wasserzug gave a paper on the new technology at IPC APEX EXPO.

Cadence’s Brad Griffin Digs Deep Into DDR

During DesignCon 2015, our roving reporter, Kelly Dack, stopped by to visit with Brad Griffen in the Cadence booth. What follows is their very interesting conversation that revolves around the evolution of DDR.

CES 2015: Preview and Predictions

Looking back over the last five years of CES and analyzing predictions and items featured by the large exhibitors, you'd likely assume the 2015 show would feature more advanced 3D TVs, as they were predicted to take over the market...wrong!

Thermal Characterization of LEDs: Enabling the Upcoming Lighting Revolution

This article describes a method that combines hardware measurement (a thermal transient tester), and computational fluid dynamics (CFD) software to provide high measurement throughput, which enables systems integrators to verify a vendor’s thermal resistance data during design and to test incoming commercial off-the-shelf parts before they are introduced into production.
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