I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Halloween is next Monday and parties will be taking place over the weekend, I’m sure. Here in the United States, at least, the “any-holiday-is-an-excuse-for-a-party” crowd has integrated Halloween, along with Valentine’s Day, St. Patrick’s Day, and Cinco de Mayo into wide-ranging opportunities for themed revelry. The news this week has been a bit crazy as well, though certainly not alcohol-fueled. There was a lot of important news and narrowing it down to just five was thought-provoking yet ultimately rewarding. Here then, are the five top pieces of news you shouldn’t miss this week.

Forming Standards for Ultra HDI

To get the latest news about ultra high-density interconnections (UHDI), we checked in with Jan Pedersen, NCAB Group’s director of technology. Jan is co-chair of IPC D-33AP, and a great source of overall DFM expertise as well. We asked him to give us a snapshot of UHDI in the industry, where we’re headed, and what this means to PCB designers.

EMA Helps Ease Designers’ Supply Chain Woes

Supply chain issues are continuing to cause disruptions in our industry, though lead times have dropped from astronomical to merely troublesome. In this interview, Chris Banton, EMA Design Automation’s director of marketing, explains how Cadence’s software has evolved as designers’ needs have changed in the past few turbulent years, including providing designers with component availability data early in the process.

Book Excerpt: 'An Introduction to The Printed Circuit Designer’s Guide to… Stackups'

To give readers a sample of 'The Printed Circuit Designer’s Guide to... Stackups—The Design within the Design,' by Bill Hargin, we are providing the book's introduction. He writes, "Another book about stackups? If you’re asking this question, I’d like to know the book you’re thinking of, as I was looking for it a few years back. I have a pretty good PCB signal integrity (SI) library, and I’ve only found one chapter on stackup design so far."

September 2022 Issue of Design007 Magazine Available Now

Supply chain management is a dynamic situation, with a number of global forces that can create pain for PCB designers. In this issue, we speak with a variety of experts and bring you up-to-the-minute insight about designing PCBs in this ever-changing environment.

Material Conservation: The PCB Designer's Role

During these times of supply chain uncertainty, many product developers are considering new ways to conserve materials—from laminates to components, layer reduction, and everything in between. Barry Matties and Happy Holden recently spoke with Alun Morgan, president of EIPC and technology ambassador for Ventec, about material conservation strategies for today’s PCB designers and design engineers. Alun explained why this may be the perfect time to educate PCB designers about conserving materials: When a model is broken, the people involved are much more open to new ideas.

Cadence Provides ‘Clarity’ in Design Tool

Nolan Johnson recently spoke with Brad Griffin, product marketing director for Cadence Design Systems, about Cadence’s Matrix solver technology. They discuss its use as a multi-disciplinary field solver as well as Cadence’s focus on thermal analysis and utilizing the power of the cloud.

John Watson Wants You—to Sign Up for His PCB Design Class

I-Connect007 columnist John Watson is teaching an introductory class on PCB design at Palomar College this fall, but this is much more than a basic design class. But John has hit a slight snafu: He needs a few more students to sign up before Aug. 23, or the class will be cancelled. It’s an online class, so you don’t have to live in San Diego to attend. In this interview, John talks about the genesis for the class and its benefits.

HyperLynx: There’s an App for That

I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.

Webinar Review: Thermal Integrity of High-Performance PCB Design

Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools. But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.

The Practical Side of Using EM Solvers

Electromagnetic (EM) solvers based on Maxwell’s equations have proven invaluable in the advancement of digital electronics and wireline communications. Plain and simple, electrical engineers need to know what a circuit or electrical interconnect will do when excited by a dynamic or varying signal. In the signal integrity world, an interconnect that passes a DC connectivity check can completely fail at higher frequencies. In the power integrity world, a power rail that measures the correct DC voltage could easily go into oscillation when a dynamic load is applied. Learning the basic skills to fire up an EM simulator, obtain qualitative answers in minutes, and higher fidelity answers in a few days, can be the difference between sleepless nights of product failures vs. robust designs with wide design margins.

The Great Divide in PCB Simulation Software

Today’s PCB design engineers have more layout and analysis tools at their disposal than ever before. Over the years we’ve seen layout tools become more automated, rules-driven, and more integrated. Now we even have integration between design tools from different vendors and ranging across domains, starting with basic circuit design, and spanning up to PLM and ERP integration. It really is a great time to be a designer.

Surveying the Land of Field Solvers

Electromagnetic field solvers have traditionally been used by a small slice of engineers—the full-time signal integrity experts—and their use has been limited to the most demanding designs. But as design speeds increase, problems requiring field solvers are becoming more mainstream and field solvers are popping up all over the place, including free or inexpensive solvers available through an internet search. Many companies are claiming that their field solvers can be used by hardware design engineers without the SI background that solvers once required.

Rambus Driving a CXL Memory Option

In this interview with Arjun Bangre, director of product for high-speed interface IPs for PCI Express and CXL at Rambus, the discussion revolves around new developments in CXL, PCI Express, and interoperable IP solutions that Rambus has developed.

Altimade Puts Designers and Manufacturers Together

Despite all of the talk about the need for communication between designers and manufacturers, many PCB designers still do not talk with their manufacturers for a variety of reasons. Altium and MacroFab aim to change this dynamic. In this interview, Ted Pawela, chief ecosystem officer of Altium and head of Altium’s Nexar Business Unit, and MacroFab CEO Misha Govshteyn, discuss the new Altimade manufacturing service that Altium is introducing in partnership with MacroFab. Ted and Misha provide an overview of the Altimade process, how it links designers to fabricators, assembly providers, and component distributors, and they explain how it could pave the way for true design with manufacturing, or DWM.

Passionate People Can Do Fantastic Things

Electrical engineer Marshall Massengill is the first to admit that he has a pretty sweet gig. Marshall serves as a mentor for the Zebracorns, a robotics team based at a STEM-oriented high school in North Carolina. And he’s not just a mentor: He’s also a graduate of North Carolina School of Science and Mathematics, and a former member of one of the earliest robotics teams organized by FIRST. We recently spoke with Marshall about his work with the FIRST robotics team, and what it’s like teaching PCB design to juniors and seniors in high school.

Altium Focusing on Educating Designers of Today and Tomorrow

We recently spoke with Rea Callender, Altium’s vice president of education, and Zach Peterson, founder of Northwest Engineering Solutions and a technical consultant for Altium’s educational programs. They discussed Altium’s curriculum—what drives the content development, the goals of their programs, and why there’s never been a better time to continue your PCB design education.

Pulsonix Collision Avoidance to Bring Mechanical Capabilities Into ECAD

The I-Connect Editorial Team recently spoke with Bob Williams, managing director of Pulsonix. He discussed some of the new features in the upcoming version of the Pulsonix PCB design tool, Version 12, including collision avoidance and other 3D options that allow certain MCAD functions within the ECAD environment.

A Textbook Look: Signal Integrity and Impedance

Believing that I knew a bit about signal integrity and controlled impedance, I was pleased to take the opportunity to connect with an educational webinar that I hoped would extend my knowledge. In the event I was surprised at how little I actually knew, and the webinar was an excellent learning opportunity. The webinar was introduced and expertly moderated by Anna Brockman of Phoenix Contact in Germany.

Additive Manufacturing Requires Additive Design Techniques

Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.

AltiumLive 2022: Tips and Tricks for Supply Chain Management

I recently spoke with Paul Ratner, a senior account executive at IHS Markit, about his AltiumLive presentation, which is now available online. Paul discusses some of the takeaways from his presentation, and he offers some advice for technologists who are grappling with long lead times on components, as well as some predictions for the rest of 2022 and beyond.

The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design

If you have ever contemplated crosstalk, eye closure, power loss, or a list of other issues defined in this textbook, then you also need to understand what, why, and how stackups can and will impact your circuit’s performance. After all, the stackup is one of the few things that directly touches every single part of your design; therefore, you must set yourself up for the highest probability of success by establishing a strong foundation through a well-designed stackup.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Welcome to April 15, everyone! There are reasons we tend to cover topics in a continuous conversation. First, there are always developments and news in the industry. Second, you dear readers respond to that content by reading it. This week the news items that drew the most reader interest verify that our industry has ongoing interest in government involvement in industry infrastructure, supply chain issues, cybersecurity, and new technologies like additive in fabrication.

Cadence System Design Solutions Guide Available Now

You already have the I-Connect007 book "The System Designer's Guide to... System Analysis", written by Brad Griffin of Cadence Design Systems. Now, download the bonus companion guide, "The Cadence System Design Solutions Guide" for solutions to all your complex system analysis needs. Put Cadence’s expert knowledge into action!

Altium Invests in Future Designers

While at IPC APEX EXPO, I stopped by the Altium booth to visit with Rea Callender, vice president of education at Altium. Rea shared information about the company’s recent design competition for students around the world, as well as a new curriculum that is drawing interest from some unique locations.

AltiumLive 2022 - Vince Mazur’s Supply Chain Advice: Always Have Alternatives

I had the chance to speak with Vince Mazur, a technical marketing engineer at Altium, about his AltiumLive presentation, “Avoiding Supply Chain Issues with Variants and Live Part Choices,” which is now available online. Vince discussed some of the high points of his talk, including the need for designers to pay closer attention to the supply chain than ever before, and to always have an alternative part or two as backup—just in case.

AltiumLive 2022: Dwight Morse Offers a Supply Chain Primer

I recently spoke with Dwight Morse, channel marketing manager for SiliconExpert, about his AltiumLive presentation, “Getting the Information to Create Successful Designs Quickly,” which is available online now. Dwight offers advice to designers who are facing 50-week component lead times, and he discusses some of the trends he sees in the supply chain right now, including a view from the vantage point of the world’s top video game makers, who are having as much trouble finding parts as you are.

Does Copper Pour on a Signal Layer Decrease Signal-To-Signal Isolation?

Does putting a ground pour on PCB signal layers make the isolation better or worse? It can go either way, but with the proper knowledge and application, this technique will improve your designs. In this article, I’ll discuss how to simulate trace-to-trace isolation with true electromagnetic simulation software. We’ll also cover a variety of rules of thumb that can help you stay away from trouble.

AltiumLive 2022: MacroFab Unites Design and Manufacturing in One Domain

I recently spoke with Joey Rodriguez, director of product management for MacroFab, which just announced a major partnership with Altium that brings supply chain information to Altium users much earlier in the design cycle. Joey and I discussed his AltiumLive presentation, now available online, which provides details about MacroFab’s efforts to “left-shift” supply chain information, and the need for designers to think holistically about the supply chain as early as possible in the design cycle.

Strategizing a Design Education Plan With John Watson

Altium’s John Watson is a veteran PCB designer and instructor, as well as a Design007 columnist. He also recently accepted a professorship at Palomar College in San Marcos, California, teaching basic and advanced PCB design. John and I recently discussed his thoughts on setting up a PCB design education strategy, the need to continue your design education for your entire career, and the kind of attitude that makes someone a successful PCB designer.

Flexible Hybrid Electronics Design: Reducing Time to Market

Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week seems jam-packed with holidays, both major and minor, doesn’t it? We started with “International Pi Day” on March 14. With all the obligatory pricing specials on most all things “pie” here in the U.S., suffice it to say, I’ve got a short stack bake-at-home pizza “pi” in my freezer, thanks to the one-day-only sales price of $3.14. Personally, I’m glad they didn’t make the promotional price = pizza diameter * Pi.

AltiumLive 2022: Alex Sapp on How to Create a Better BOM

I recently spoke with Alex Sapp, director of API commercial strategy at Octopart, about his AltiumLive presentation, “How Resilient is Your BOM?” In this interview, Alex details the takeaways of his class, and some tips and techniques for creating more reliable BOMs and dealing with the current supply chain uncertainties.

Planning Your Design Education: Keep an Open Mind

Rea Callender is the new vice president of education for Altium. He brings a background in business development and entrepreneurship, along with experience in K-12 education. This seemed like a pretty good combination, so I asked Rea to share his thoughts on the best avenues for design education, as well as strategies for setting up a lifelong PCB design education plan.

RF and Microwave: No Black Magic

I caught up with Ben Jordan after his class on RF and microwave at IPC APEX EXPO. Ben, an electrical engineer, explained how sitting through previous classes on this topic led to him developing his own class. “I wanted to bridge the gap,” he says, “with a class that makes the material approachable and teaches the intuitive nature of fields and waves and how they work in circuit boards.”

AltiumLive 2022: Left-Shifting Modeling and Simulation

Harry Kennedy and Sarmad Khemmoro of Altair recently spoke with Andy Shaughnessy about their AltiumLive presentations, which are now available online. They discuss the need for modeling, simulation, and verification in PCB design, and why these actions should be performed as early in the design process as possible.

Planning Your Design Education Strategy

If you’re a new PCB designer, you might be asking yourself: How do I set up an education and training plan for my career in PCB design? We asked Eric Bogatin to weigh in with his thoughts. Eric has a unique viewpoint: He’s a veteran signal integrity instructor, as well as a professor in the College of Engineering and Applied Science at the University of Colorado, Boulder. In this interview, Eric lays out some of his planning strategies and the need for a degree in electrical engineering in the PCB design world.

AltiumLive 2022: No Shortcuts to Disciplined Library Management

I recently met with Altium’s John Watson for a discussion about his AltiumLive presentation on coping with design challenges, particularly in library management. As John explains, with library management, there’s no substitute for sitting down and doing the hard work, particularly during times like these, with a supply chain that is erratic at best. He also discusses his new job at Palomar College, teaching basic and advanced design techniques to students who are often seeking the “easy way out” in PCB design.

AltiumLive 2022: Power and Signal Integrity—Return to Sender

I recently spoke with Heidi Barnes and Stephen Slater, both engineers with Keysight Technologies, about their presentations at this year’s virtual AltiumLive. They discussed ways to avoid signal and power integrity challenges later by following simple board design practices early on, how SI and PI are interconnected, and why the return path must be more than an afterthought in high-speed designs.

Finally! A Book About PCB Stackups

‘The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design’ is the latest addition to I-Connect007’s comprehensive, educational library. In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”

AltiumLive 2022: Don’t Phone It In - Reducing EMI in Wireless Applications

I recently spoke with Ken Wyatt, founder of Wyatt Technical Services and an expert on signal integrity and EMC. I asked him to discuss his AltiumLive 2022 presentation, which focuses on reducing EMI, particularly in the wireless arena, where self-generated emissions are often a fact of life.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

This week’s picks comprise a potpourri of published articles, a hodgepodge of helpful hints, and a brood of business news. Our collection includes several interviews from IPC APEX EXPO; we filmed over 60 of these video interviews that week, all shot with our new anti-COVID protocol. The boom microphones, selected so that we wouldn’t have to attach clip-on mics to each interviewee, gave our booth/studio an air of 60 Minutes. But unlike what we see in most news shows, almost all the news at IPC APEX EXPO was positive as companies emerge from the pandemic with even more innovative software, services, and equipment than before. It’s looking like 2022 is going to be a really good year.

Real Time with... IPC APEX EXPO 2022: AltiumLive Goes Virtual

Kelly Dack gives an update and discusses with Andy Shaughnessy the launch of AltiumLive 2022 Virtual. Kelly was the emcee of this online event, which ran at the same time as IPC APEX EXPO 2022. Kelly was often seen roaming the show floor, followed by his own camera "crew," documenting the activities for his viewers.

Changes on the Horizon: Is Resistance Futile?

For printed circuit engineers, especially those of us who have been in the industry for some time now, change is inevitable. From customer requirements that lead to design changes and deadlines being pulled in, to decreasing budgets and resource reallocations, change is one area where we must be adaptable if we want to survive and be successful in today’s industry. Engineering change orders (ECOs), schematic/drawing redlines, component placement adjustments, and mechanical features modifications are among the changes that most of us usually deal with at one point or another during a project’s design cycle.

AltiumLive 2022: Stopping Your EMC Problems Before They Start

Todd H. Hubing has been working with EMC for decades. He began as an engineer at IBM, then served as a professor at the EMC lab at the University of Missouri-Rolla (now Missouri Science and Technology), and later moved to Clemson, where he founded the Vehicular Electronics Library. Now, Todd is focusing on his most recent endeavor, LearnEMC. At AltiumLive 2022, Todd shares his thoughts on how to avoid EMC issues before they have a chance to wreak havoc on your board, simply by making smart decisions early in the design process. As he points out in this interview, this is much better than waiting until you have EMC issues later on and possibly redesigning a board until you pass EMC.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We just wrapped up IPC APEX EXPO 2022, and I think it went better than anyone could have expected. I wasn’t sure the live show would actually take place. With the COVID protocols in California changing daily, no one knew for sure that a live show would even be allowed to open. But here's my picks for the week, both from the show and from the industry.

AltiumLive 2022: Keep Your Boards From Screaming with Eric Bogatin’s EMI Tips

I recently spoke with Eric Bogatin, the “signal integrity evangelist,” about his AltiumLive keynote presentation, “How to Keep Your Boards from Screaming Like a Banshee.” Eric explains how attention to board structures during the early stages of PCB layout can keep EMI from becoming a problem in your design. He also discusses a feature of Altium Designer that some designers may not know about—a 2D field solver that's part of the Simbeor high-end electromagnetic measurement tool, but with a simple GUI that most designers can master right away.

Kelly Dack Teases AltiumLive 2022

AltiumLive 2022 is just around the corner! Editor Nolan Johnson chats with Guest Editor and columnist Kelly Dack, one of the event hosts for AltiumLive Connect 2022. Kelly updates Nolan on the latest about the upcoming AltiumLive virtual conference, what's on the agenda, how it's connected with IPC APEX EXPO, and what attendees can expect to find.

New Book From Isola Highlights Importance of Material Selection

In "The Printed Circuit Designer’s Guide to... High Performance Materials," the latest release from I-007eBooks, readers will learn how to overcome challenges associated with choosing the right material for their specific application. Author Michael Gay of Isola provides a clearer picture of what to know when determining which material is the most desirable for which products. PCB materials and DFM expert Mark Thompson says, “I love this book, particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and effective Dk."

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re driving headlong into 2022, and there’s a lot going on in the world of PCB design, fabrication, and assembly. It’s trade show season now. IPC APEX EXPO starts in less than two weeks, and we’re all getting ready for what is, for many, the first trade show in years. Do you know where you put your business cards after your last show in 2020? I keep half a box of biz cards in my glove compartment; I’m not going to make that mistake again.

A High-Voltage PCB Design Primer

Of all the different boards a designer can create, a high voltage PCB design can be complicated and requires strict attention to safety. If not laid out correctly these boards can be safety hazards or can fail to function on first power up, leaving a designer with wasted time and effort. In the best case, the board will function reliably for a long period of time thanks to correct layout practices. High-voltage PCB design can be as complex as any high-speed digital design. Boards for high-voltage systems can be space constrained and they carry important safety requirements. They also need to be highly reliable to ensure they will have a long life when run at high voltage and current.

High-Voltage PCB Design: Beating Separation Anxiety

In recent surveys, PCB designers named high voltage among the issues causing problems in their designs. That led us to speak with Zuken USA’s Andy Buja, Wilmer Companioni, and Sanu Warrier about the challenges PCB designers and design engineers must confront when working with high-voltage designs. In this conversation, we discuss everything from the nuts and bolts of high-voltage design, such as the need to separate components of a high-voltage board, to the compliance problems companies like Tesla face when installing EV chargers around the world in countries with varying regulations.

The Art of Using Symmetry—and Asymmetry—in PCB Design

An empty board outline is a PCB designer’s empty canvas. Components are the designer’s paint palette, and the traces are the brush strokes used to blend and mesh the components together on the canvas. The subject matter is defined by the schematic entry and the tone is often set according to the purpose of the design. The subject matter’s form emerges during placement and takes shape when routed. The aesthetic nature of a PCB or PCBA is typically judged by the designer’s use of symmetry, focal points, and centers of interest. The enjoyment experienced by observing a bee (a bilaterally symmetric insect) symbiotically interact with a flower (a radially symmetric plant) is derived from the realization of two well-proportioned beings striking a mutually equitable existence, a classic win-win scenario.

If You’re Not Measuring Inductance, Ask Yourself: Do You Feel Lucky?

I recently ran into Dr. Bruce Archambeault at PCB Carolina in Raleigh, North Carolina. He’s retired from IBM now, but as he explains, he’s still teaching. He taught a class at the show that focused on layout considerations and inductance, and why inductance needs to be measured. There weren’t many empty seats in his class. I asked Bruce to discuss his class and why it’s so importance for designers and engineers to measure inductance. Bruce also discusses how he’s linked the study of inductance to the “Dirty Harry” movie franchise.

Field of Dreams: The Art and Science of Designing with Field Theory

For this issue of Design007 Magazine focusing on the art and science of PCB design, we sought input from Dan Beeker, senior principal engineer of NXP Semiconductors. Dan has spent years teaching designers about the need to focus on the electromagnetic fields around the traces, not the traces themselves, as the late Ralph Morrison advised. We asked Dan to share his thoughts on the art of designing PCBs, and how art and science figure into his views on field theory.

RealTime with... American Standard Circuits: Thermal Management

In the third of a series of three RealTime with... interviews, I-Connect007 managing editor Nolan Johnson received knowledgeable and informative answers from Anaya Vardya, John Bushie, and Dave Lackey of American Standard Circuits to his questions on the topic of thermal management. Anaya Vardya began by clarifying the terminology, describing thermal conductivity as a material property defining how quickly heat was transmitted through a piece of that material, whereas thermal management was about analysing the entire system, trying to understand how much heat was being generated, and using appropriate techniques to dissipate that heat as efficiently as possible.

The Art and Science of DFM

"Education is widely available in art, which implies that it is something that can be taught and learned," said Altium's Vince Mazur. "However, I believe there is a limit to what a scientifically focused person can do in art. While anything is possible, one can pursue fluency in art, but they likely would have a difficult time becoming a Picasso or a Rodin. Just as either of these artists could likely learn more about science, they likely would not become an Einstein or a Tesla. But then there are those outliers that have extreme talent in both domains, such as Galileo."

A PCB Design Data Management Overview

In recent issues of Design007 Magazine, we’ve covered strategies for managing specific types of data. But in this issue, we’re looking into data management techniques from a company level. The I-Connect007 Editorial Team recently spoke with three PCB designers who have quite a bit to say about PCB data management: Altium’s John Watson, and Bissell’s Dugan Karnazes and Patryk Akhurst. They discussed their data management philosophies, the need for detailed processes that fit each company, and why data management techniques must undergo continuous improvement to be effective.

Pulsonix Discusses New Features, Including Design Reuse and Cross Probing

Jim Southward, executive account manager for SouthCom Technologies and head of the North American sales office for Pulsonix, recently met with Nolan Johnson to discuss what's been going on lately at Pulsonix. Jim walks us through some of the new features Pulsonix has added in recent releases, and he details a few handy functions that some users may not even be aware of.

IPC-2581: An Open, Neutral, Efficient Data Transfer Format

PCB design and manufacture has become exponentially more complex as modern electronics providers strive to meet consumer demand for greater connectivity and performance. In the current process, two major pain points need to be overcome to achieve an efficient design and manufacturing process that results in first-time-right products that go to market quickly. The first pain point is time to manufacture—the flow from end of design to start of manufacturing is dependent on multiple communications and shared files between the design house and the manufacturing partner. The second pain point is the design for manufacturing (DFM) analysis that all manufacturers run on the data to see if the design violates any of their manufacturing rules/guidelines.

DownStream Adding More Flex, Rigid-Flex Functionality

I recently spoke with Joe Clark, one of the co-founders for DownStream Technologies. We discussed the company’s latest software release, which adds more flex and rigid-flex capabilities, as well as updates to the scripting in DownStream’s tools.As Joe explained, "With our current release of software, we focused in on rigid-flex designs, which is becoming a common design challenge for our customers. We’ve implemented support for rigid-flex embedded components going to the next level now, and we’re working with some large companies to define the design for manufacturing checks that would be necessary for verifying these advanced designs. So that’s coming in our DFM release that will be out later this year."

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 2

In Chapter 2 of this book, the subject involves the challenges in the design and development of data center systems. With the exponential growth in data center infrastructure for IT networking, numerous challenges have emerged, from limited ecosystems to high-performance computing issues. There are many constraints to building data centers and updating the equipment in them. Planning is critical in managing increased capacity in the existing data center space.

Hate PCB Respins? Five Ways to Reduce or Eliminate Respins

Redesigning a printed circuit board is a chore that no one likes. Respins of printed circuit boards cost money, delay the schedule, and just aren’t enjoyable for anyone. Yet, many companies are not taking advantage of available tools that can reduce—and in many cases eliminate—PCB respins.

DFM 101: PCB Materials

One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the first in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

Why We Simulate

When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.

Alternatives to Simulation

We are living in an age where the demands on electronic product designs are constantly evolving. The IC technology and operating speeds continue to pose significant challenges for teams as they work to develop their products. The increased transistor switching speeds and less forgiving compliance standards make signal integrity and electro-magnetic compliance more difficult to achieve. The status quo seems to have become, “We expect to fail EMC testing.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

IBM Awarded Best Technical Paper at IPC APEX EXPO 2021

Nolan Johnson and Happy Holden speak with Sarah Czaplewski, whose team at IBM won the Best Technical Paper award at this year’s IPC APEX for “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction.”

Bridging the Simulation Tool Divide

Todd Westerhoff of Siemens EDA recently spoke with the I-Connect007 Editorial Team about the divide between users of high-powered enterprise simulation tools and those who need a more practical tool for everyday use, and how Siemens is working to bridge the gap. Todd also shared his views on why so many engineers do not use simulation, as well as advice for engineers just getting started with simulation tools.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In this week’s roundup, we have news about a new DFM environment from Siemens EDA, a 2D field solver from Avishtech, and a milestone for the IPC-CFX-2591 QPL. We also have a great article by Calumet’s Audra Thurston, who points out the many advantages of a virtual trade show. And in his latest column, Denny Fritz explains why the DoD is now thinking like many U.S. OEMs—worrying about single-source components, for instance—but the stakes are much higher.

Barry Olney’s High-Speed Simulation Primer

The I-Connect007 editorial team recently spoke with Barry Olney of iCD about simulation. Barry, a columnist for Design007 Magazine, explains why simulation tools can have such a steep learning curve, and why many design engineers are still not using simulation on complex high-speed designs.

Polar Instruments Driven by Customer Demand

Andy Shaughnessy recently spoke with Geoffrey Hazelett, vice president of sales for Polar Instruments, about the virtual IPC APEX EXPO and the eventual return of live trade shows and conferences. They also discussed some of the company’s newest releases, many of which came about through customer demand.

Eliminating ‘Garbage In, Garbage Out’ With Checks and Balances

The proverbial saying “garbage in, garbage out” holds true in the electronic product development world. PCB designers stand squarely in the middle of a busy information intersection flowing with inputs and outputs. Missing or bad information at the beginning of a design project will undoubtedly lead to board re-spins, increased costs, and most importantly, a delayed product release. The same can be said about the PCB designer who doesn’t provide a fully checked and comprehensive data package to the downstream manufacturers, i.e., “throwing it over the fence.”

EIPC Technical Snapshot: 5G and Loss Minimisation

Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

Turning ‘Garbage In, Garbage Out' into ‘Good In, Good Out’

In the PCB design cycle, it is so easy to unintentionally introduce “garbage” into your system. Unless you have time to extensively check everything you bring in from an external source, it is very likely that something will not match up with your design data. In the end, this means you’ll have to put more work into your design and basically reverse-engineer a part that was supposed to save you time and effort.

The Key to Eliminating Bad Design Data: Constant Vigilance

The I-Connect007 editorial team recently met with Jen Kolar and Mark Thompson of Monsoon Solutions to discuss ways to eliminate bad data from the design process, whether that be from CAD libraries, parts vendors, chip makers, or customers themselves. They key in on some problems and obstacles that allow incorrect data into the design cycle, and then highlight possible solutions.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

A perennial and yet irregular category on the popular game show Jeopardy is “potpourri.” My dad, as I was growing up, pronounced the word as “pot-poury.” It wasn’t until I was a sophomore in college that my girlfriend’s mom—who had a penchant for a soupcon of French euphemism in her tête-à-têtes—pronounced the word properly: “po-pu-ree.” Such are the risks of growing up just a bit rural.

The Magnitude of Stackup Considerations

When I was asked to write about stackup creation, I paused at the magnitude of this subject. It is similar to the framework used to pour concrete cement—you need to get the framework right because the framework has such a big impact on the final outcome. Such is the case with shaping the success or failure of our circuits. In writing the newest training manual due out early this year, I observed that the longest chapter in the textbook was dedicated to this subject.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

We’re seeing an increase in optimism as more people are vaccinated and states under lockdown begin flipping open their shutters. This positive outlook is spreading, albeit slowly.

Altium Introduces New Subscription Model

Andy Shaughnessy chats with Lawrence Romine about Altium’s new subscription model for their Altium 365 platform. They discuss what this means for existing and future Altium customers, and some of the drivers leading to this development, including evolving use patterns among customers during the pandemic.

A Library Management Cautionary Tale

The library management of footprints, land patterns, or cells—however you refer to them in your ecosystem—is one of the most critical items in the foundation of any PCB or CCA design. When I was asked to write an article on this topic, so many thoughts and experiences instantly flooded my mind. After 30+ years of designing PCBs throughout the industry, I have my share of experiences and stories about footprints. One particular experience stands out.

Best Practices: Footprint Design and CAD Library Management

The I-Connect team spoke with Altium’s John Watson about the hurdles surrounding footprints and footprint design. John talks about how being proactive and improving the CAD library can better QC processes and help protect against footprint difficulties.

Wild River ISI-56 Platform Accelerates SerDes Testing

I recently spoke with Al Neves, founder and CTO of Wild River Technology, about the release of their new ISI-56 loss modeling platform. Al explains why it was so critical that this tool meets the stringent requirements of the IEEE P370 specification (which he helped develop), and why he believes this is currently the best tool for SerDes testing and characterization.

Seven Tips for Your Next Stackup Design

Rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important. Eric Bogatin offers seven tips for stackup design.

Just Ask Heidi Barnes: The Exclusive Compilation

We asked for your questions for Keysight Technologies' Heidi Barnes, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple.

Cutting Respins: Journey to the Single-spin PCB

PCB design is more than a short sprint to the finish line; it is a journey best suited for the prepared adventurer. According to a study by Lifecycle Insights, the average PCB design project requires 2.9 respins. These respins can cost anywhere from tens of thousands to millions of dollars—each! As an engineer/business owner, I find respins frustrating because I would rather spend my time and money applying scientific principles inventing, improving technology, and solving problems. I am not an advocate for perfectionism, but rather I focus on becoming a better adventurer. Sometimes I get to taste the sweet wine that is a single spin PCB. As fellow adventurers, let’s discuss some topics that influence unnecessary return trips on our PCB design journey: simulation, technical reviews, and interest in PCB design.

Just Ask Heidi: The Most Rewarding Part of the Job

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! Today: the most rewarding part of a design engineer's job.

Just Ask Heidi: The Biggest Challenge for Design Engineers?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! Today's question: What is the biggest challenge for PCB design engineers right now?

Lee Ritchey on Reducing Respins by One

I-Connect007 recently spoke with Lee Ritchey about the subject of continuous improvement with a focus on DFM, specifically looking at the benefits of reducing the number of respins by just one. A longtime instructor and one of the authors of Right the First Time: A Practical Handbook on High-Speed PCB and System Design, Lee has spent decades preaching the value of solid DFM practices, so we asked him to discuss why so many OEMs accept multiple respins with each design project and what designers could do to eliminate just one spin. He also shares some of the lessons in reducing respins that he learned in the early days of Silicon Valley.

Just Ask Heidi: Is Power Integrity the Hot Discipline of the Future?

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn! eidi has been awarded five patents and a NASA Silver Snoopy award (each Silver Snoopy pin flies on a space mission first), and she was named DesignCon's 2017 Engineer of the Year. We hope you enjoy “Just Ask Heidi.”

EIPC Technical Snapshot: PCB Surface Finishes

For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

John Watson Discusses His Favorite Career Moments

As we celebrate the holidays after a tumultuous year, it’s important to remember all of the good things in our lives. In this short video, Altium’s John Watson discusses a few of the moments that really stand out in his career: earning his IPC Certified Interconnect Designer credentials and designing his very first circuit board.

Just Ask Heidi: Eliminating EMC Failures

First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Tara Dunn in our “Just Ask” series. Now, it’s Heidi Barnes’s turn!

Cadence’s Celsius: Don’t End up Holding the Hot Potato!

I was just thinking about the party game Hot Potato. It reminded me of today’s increasingly competitive marketplace: Accurate thermal analysis must be performed, and any potential issues have to be identified and addressed as early as possible in the design cycle. Otherwise the system will run into problems, market windows will be missed, and someone will be left holding the hot potato. Trust me, you do not want to be that someone.

Cadence’s Clarity: 'I Can See Clearly Now'

Do you recall the song “I Can See Clearly Now”? This catchy tune was first released by Johnny Nash in 1972, which was three years before I started my BSc in Control Engineering at Sheffield Hallam University, Yorkshire, England. I’ve just been looking at the Clarity 3D Transient Solver from Cadence, so the lyrics I’m hearing in my head are, “I can see clearly now the EMI is gone / I can see all EMC obstacles in my way..."

Stephen Chavez and Happy Holden on Designing Reliable Vias

Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.

Catching up With QCMS General Manager Rick McAnally

Founded in 2007, QCMS is one of the more interesting EMS companies on the East Coast. They are actually a sister company to Niche Electronics located in Pennsylvania. Dan Beaulieu interviews QCMS General Manager Rick McAnally.

Part 11 of Siemens’ Digital Twin Webinar Series: Data-Driven Manufacturing

I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 11, Gorajia discusses, “Data-Driven Manufacturing: Making Big Data Into Smart Data.”

Real Time with… AltiumLive 2020: Event Wrap-Up With Judy Warner

Andy Shaughnessy and Judy Warner, director of marketing and community engagement for Altium, discuss the recent virtual AltiumLive events and what the company—and the PCB design community—have learned from the uncertain times of 2020.

PCB Technologies Focuses on an All-in-One Solution

Recently, PCB Technologies reached out to us with news about their new All-In-One offering. Intrigued, we followed up and spoke with VP of Marketing and Business Development Arik Einhorn to get more details on the All-In-One services. We’ve included the short article and the interview here.

Real Time with… AltiumLive 2020: Vince Mazur Previews New Design Rule Features

Altium Technical Marketing Manager Vince Mazur discusses his presentation at the recent AltiumLive, which focused on updates to Altium Designer's approach to creating design rules and constraints. Vince explains that these features will be more intuitive for the user, and the update, which is currently in beta, will be released in the future. The company is shifting from “rule-centric” design rules features to capabilities that are more “design-centric,” with applicable rules for each object available at one click.

Real Time with… AltiumLive Europe 2020: Eric Bogatin’s ‘Unlearning’ Keynote

Pete Starkey admits to not being a Star Wars freak, but he was impressed by Yoda’s iconic wisdom and philosophy and intrigued by his advice that, “You must unlearn what you have learned.” Here, he describes how attending Dr. Eric Bogatin’s keynote at the AltiumLive Europe 2020 Virtual Summit was an enlightening experience.

Brad Griffin Discusses Cadence’s New Transient Solver Technology

Andy Shaughnessy speaks with Brad Griffin, product marketing director for Cadence Design Systems, about their new Clarity 3D Transient Solver, which is designed for system-level EMI simulation. Brad explains how the new solver, based on the company’s matrix technology, can yield results 10 times faster than existing solvers when simulating IC packages, PCBs, and SoIC designs.

Real Time with… AltiumLive Europe: 21st-Century Tools Keynote

Good morning, Europe!” Altium VP of Marketing Lawrence Romine said as he introduced the European edition of Altium’s PCB design conference—established as an annual must-attend event, but for 2020 presented in a virtual format. Pete Starkey brings you the details from AltiumLive Europe's opening keynote on 21st-century tools and what's coming in 2021.

EIPC Technical Snapshot: Automotive Technology

Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.

Real Time with… AltiumLive 2020: Lawrence Romine on Successful U.S. Event

Andy Shaughnessy and Lawrence Romine, vice president of corporate marketing for Altium, discuss some of the lessons learned from last week's virtual U.S. AltiumLive, as well as what attendees can expect from the European show, which takes place October 20–22, 2020.

Real Time with… AltiumLive 2020: Happy Holden’s Panel Discussions Review

AltiumLive 2020 was a virtual event, and Happy Holden attended all the keynotes, as well as many other sessions. This article summarizes three panel discussions from Dugan Karnazes, Dr. Eric Bogatin, and Judy Warner, which were all worth the time investment.

Part 6 of Siemens’ Digital Twin Webinar Series: Single CAM Solutions

I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In part 6, Gorajia discusses a “Single CAM Solution for All Process Engineering Tasks.”

Real Time with… AltiumLive 2020: Jeremy Blum on Engineering and the Supply Chain

During the last day of this year’s AltiumLive event, Dan Feinberg sat in on a very interesting talk by Jeremy Blum, who is the director of engineering for Sharper Tools Inc. Blum’s presentation was entitled “Leveraging Engineering Expertise for Supply Chain Success," and his goal was to convince the audience that taking a more proactive role in supply chain and manufacturing decisions can reduce your time to marker, workload, and product cost.

Real Time with… AltiumLive 2020: Eli Hughes’ Full-Stack Hardware Engineer Keynote

Nolan Johnson details TZero Co-founder Eli Hughes' keynote presentation titled “Crossing the Chasm: The Road to Becoming a Full-Stack Hardware Engineer,” demonstrating how it takes cross-disciplinary thinking to truly innovate.

Real Time with… AltiumLive 2020: Steven Sandler’s Simulation Keynote

Steven Sandler, managing director at Picotest, delivered a detailed and informative keynote at AltiumLive 2020 on worst-case fault simulation. Nolan Johnson details how Sandler's presentation detailed the fundamental tenets of worst-case simulation, illustrated with lots of technical examples and anecdotal stories.

Real Time with… SMTAI 2020: Reflections on the Technical Conference

This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.

Combatting Thermal Challenges With TRM Software

Johannes Adam is the creator of a simulation tool called Thermal Risk Management (TRM) used to help PCB designers and design engineers predict hot spots on the board before during layout. He and Douglas Brooks, founder of UltraCAD Design, have used the tool to produce several technical articles and a book on the subject. In this interview, they tackle the biggest misconceptions they see from designers and engineers who deal with thermal management issues.

Real Time with… AltiumLive 2020: The Need for Simulation in High-Speed PCB Design

Andy Shaughnessy and Picotest Managing Director Steven Sandler discuss the panel that Steven will be participating in at AltiumLive 2020. The panel, led by Dr. Eric Bogatin, will feature co-panelists Heidi Barnes of Keysight Technologies, Rula Bakleh of Graphcore, and Istvan Novak of Samtec, who will discuss various ways to reduce signal and power integrity issues by using simulation, measurement, and other tricks of the trade. Steven also discusses his presentation on simulation, which focuses on SPICE simulation methods.

Just Ask John Mitchell: The Exclusive Compilation

We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”

Manufacturing Test Strategy Tools: Part 4 of Siemens’ Digital Twin Webinar Series

I-007e Micro Webinars recently released a free, on-demand series titled “Implementing Digital Twin Best Practices From Design Through Manufacturing” with Siemens' Jay Gorajia. In Part 4, Gorajia discusses “Manufacturing Test Strategy Tools in the Hands of Designers.”

Mentor and Z-zero Collaborate on New Stackup Tool

I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.

The Role of EDA Tools in Creating Fab Notes

When discussing fab notes, there’s a lot of focus on what designers should and should not include in the package. But what is the role of EDA tools in this process, and can intelligent data formats streamline the tasks and help eliminate fab notes that are less than fantastic? In this interview, Pat McGoff, market development manager for Mentor, a Siemens Business, speaks frankly about fab notes and what EDA tool companies like Mentor can do to automate this process.

This Month in SMT007 Magazine: Robustness Is Not the Same as Reliability

Bob Neves discusses a disconnect he sees in reliability testing between what’s being tested and what happens out in the field, as well as why most reliability tests these days should instead be considered robustness tests.

This Month in Design007 Magazine: Dear Designers—Please Include a Sanity Check

We recently asked Rick Almeida, DownStream co-founder, and Technical Sales Manager Ray Fugitt to discuss why so many fabricators are still receiving (and correcting) inaccurate and incomplete data from their customers. And if fabricators and designers are content with this current process, is it really a problem after all?

Book Excerpt: Power Integrity By Example, Chapter 5

The following is an excerpt from The Printed Circuit Designer's Guide to... Power Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business. In this free eBook, Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.

Just Ask Happy: Integrating Design Processes With IEEE HIR

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

App Notes: What Are They Good For?

There are several schools of thought regarding IC manufacturers’ app notes. We wanted to find out more about this, so we spoke with Geof Lipman, director of operations for part data at Octopart.com, a component data platform acquired by Altium in 2015. Geof shared his thoughts on app notes, datasheets, and the need for due diligence when utilizing any unfamiliar data.

Just Ask Happy: Routing BGAs With High-Speed Diff Pairs

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Book Excerpt: Signal Integrity by Example, Chapter 3

The following is an excerpt from The Printed Circuit Designer's Guide to... Signal Integrity by Example, written by Fadi Deek of Mentor, a Siemens Business. Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements.

Letter to the Editor: Rick Hartley Offers Addendum on App Notes

In the June 2020 issue of Design007 Magazine, the I-Connect007 editorial team interviewed design instructors Rick Hartley and Dan Beeker regarding their belief that designers should not trust app notes until they've been proven to be accurate. After the issue was published this week, Rick emailed us with a few more points that he wished to contribute to the ongoing app note conversation.

Book Excerpt: Signal Integrity by Example

Editor's note: The following is an excerpt from "The Printed Circuit Designer's Guide to... Signal Integrity by Example," written by Fadi Deek of Mentor, a Siemens Business. Deek explores how to reach effective design solutions and make strong engineering tradeoffs through analysis techniques, best design principles, and software tools to achieve accurate simulations and measurements.

Book Excerpt: Cornerstone of Smart Manufacturing—The Convergence of IT and OT

The following is an excerpt from Chapter 2 of the I-Connect007 eBook The Printed Circuit Assembler’s Guide to… Advanced Manufacturing in the Digital Age, written by Oren Manor of Siemens, a Siemens Business.

Book Excerpt: Power Integrity by Example

The following is an excerpt from "The Printed Circuit Designer's Guide to... Power Integrity by Example," written by Fadi Deek of Mentor, a Siemens Business. In this free eBook, Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter.

Book Excerpt: Producing the Perfect Data Package

The following is an excerpt from Chapter 1 of Mark Thompson's I-Connect007 eBook "The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package." Mark is in engineering support at Prototron Circuits and a Design007 columnist.

Autodesk’s Fusion 360 Merges ECAD, MCAD

Andy Shaughnessy spoke with Autodesk’s Matt Berggren about the company’s Fusion 360 EDA tool and the new capabilities added to the software. Matt explains how Fusion 360 blends ECAD and MCAD functionality in one environment and at an affordable price, and why he believes it will help round out Autodesk's electronic portfolio with end-to-end capabilities.

Ventec Book Excerpt: Thermal Management with Insulated Metal Substrates

The following is an excerpt from Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

This Month in Design007 Magazine: What Did You Expect From Me, Anyway?

As engineers, we work in the middle of a (usually long) process chain. It’s sort of like working on an intellectual assembly line—we get requirements and data as input, perform our particular task, and then provide our output as requirements and data to the next person on down the line. It seems easy enough. So, why is it that so many of the requirements we’re supposed to meet and so much of the data we receive is downright bad?

The Cost of Inefficient Production of PCB Documentation

The following article is an excerpt from Chapter 5 of the I-Connect007 eBook The Printed Circuit Designer’s Guide to… Documentation, written by Mark Gallant of DownStream Technologies.

Freedom CAD’s Expert PCB Design Tips, Part 2

When you’re designing complex PCBs, knowledge truly is power. The more PCB design tips, tricks, and techniques you know, the better your cutting-edge designs will be. With that in mind, we’re bringing you a series of PCB design tips, courtesy of Freedom CAD Services.

14 ‘Business as Usual’ Tips, Part 3

In this series, Dan Beaulieu will share 14 “business as usual” tips for selling without visiting customers during the COVID-19 outbreak.

A Design Economics Horror Story

During a recent conversation with Rick Hartley, he shared one of his favorite PCB design horror stories. This is a cautionary tale about what can happen when design teams place too much faith in app notes and do not follow cost-aware design techniques. Enjoy!

Survey: Complete, Accurate Design Data Tops List of Fab Expectations

In a recent survey, we asked PCB designers about expectations, particularly fabricators’ expectations of their PCB designer customers. The overwhelming majority (84%) of respondents indicated that a fabricator’s primary expectation of a designer is a complete, accurate data package.

Happy’s Smart Factory Protocol Primer

The smart factory concept is built upon data interchange as the foundation. There has been much development in the area of industrial and manufacturing data protocols over the years, stretching back into the 1960s. This article by Happy Holden surveys what are considered the most common protocols in use in the electronics manufacturing industry today, including IPC-CFX/ Hermes, OML, SECS/GEM, and MAPS.

What It Takes to Be a Milaero Supplier, Part 3

The decision to pursue military and aerospace (milaero) certification impacts every facet of the organization, and not every shop is prepared to make this transformation. In Part 3, Anaya Vardya explores what it takes to be a milaero supplier in the areas of purchasing and quality.

MFLEX Increases Growth

Happy Holden recently spoke with Jay Desai of MFLEX about the latest flex work the company has been doing and its aim to transition toward more automation and a smart factory approach.

Cadence Helping Users to Save Time, Money With Automation

During DesignCon, Andy Shaughnessy spoke with Brad Griffin, the group director for product management for the system analysis group at Cadence Design Systems. We discussed some of the areas where PCB designers can cut costs and how EDA companies can help these designers by automating certain time-consuming tasks. As Brad says, “The ‘A’ in EDA is for automation, right?”

Business Practices Drive the Smart Factory, Not the Other Way Around (Pt. 2)

In Part 2 of this conversation, Sagi Reuven— business development manager at Mentor, a Siemens Business—continues his discussion on how smart factory implementations must start with traditional process analysis and improvement before the data capture process is useful.

EMA President Manny Marcano: EDA Tools Are Essential

In this interview, Editor Andy Shaughnessy speaks with Manny Marcano, president of EMA EDA Automation, who shares an update on the company's current level of business operations under COVID-19 restrictions. Marcano explains that EMA is classified as an essential business due to its work with the defense segment and that employees are now working from home. He also discusses the company's free work-from-home license offer and why he is available to help any designers or design engineers who have questions during these changing times.

The Formation of the Printed Circuit Engineering Association

Patty Goldman spoke with Gary Ferrari, FTG Corporation, at IPC APEX EXPO 2020 about the formation of the Printed Circuit Engineering Association, which—having been started two months ago—has attained lots of interest from the industry. The PCEA hopes to bring together designers, engineers, fabricators, assemblers through local chapters to focus mainly on education and learning.

Siemens and Valor: Two Complementary DFM Technologies

Before IPC APEX EXPO kicked off, Andy Shaughnessy attended a Siemens seminar in San Diego on smart manufacturing for electronics and the integration of technologies from Siemens’ digital industry software and Valor. Afterward, Andy spoke with Andy Farrington, director of portfolio development for the Americas, about the event, as well as some of the hot topics and solutions that the speakers addressed.

Multi-board Etching: Managing Rigid-Flex Designs and Conductivity

Good troubleshooting techniques involve considering a system as individual parts rather than as a whole. The same techniques apply to your work with multi-board PCB designs. Each board consists of a single unit that has its own lifecycle. Some product designs may use a single PCB design for multiple functions or for multiple devices. Others may interconnect multiple PCB designs to produce a complete, fully functional system.

Mentor's Oren Manor on Automation Business Adjustments

Oren Manor, director of business development at Mentor, a Siemens Business, shares an update with Barry Matties on the recent COVID-19 outbreak. Manor describes how Mentor's automation business operations have adjusted. Manor also provides some projections on how manufacturing may need to adjust as the global economies come out of this time.

This Month in Design007 Magazine: Mentor—Managing Small Problems for Profitability

At DesignCon, I met up with Todd Westerhoff, product marketing manager for highspeed design at Mentor, a Siemens Business, to discuss common design profitability issues and cost-aware PCB design. He explains how simple problems can “slip through the cracks” and cause delays, what you can do, and how first-order analysis can make simulation accessible to designers who wouldn’t simulate otherwise.

Publish Your Work, Become an Industry Leader

I recently met with Bert Simonovich, founder of Lamsim Enterprises, to discuss a new mentorship program and panel discussion at DesignCon, where veteran authors of technical papers mentor new authors through the process. Bert explained the benefits of publishing technical papers and shared Wayne Gretzky’s advice for any engineers or technologists who are considering publishing their technical work.

A Young Designer’s Journey After Grad School

Lukas Trumpler is a young PCB designer from Germany who designs boards for sensors with ITK Engineering GmbH. I recently met with Lukas and spoke with him about his job, what he’s learned in this industry so far, and his impressions of his first AltiumLive event.

Show & Tell Feature: Happy’s Highlights

Happy Holden traveled to San Diego for IPC APEX EXPO 2020. He was happy to get out of Grand Rapids, where the temperature had dropped to 28 degrees. In this article, he describes some of the highlights of the show, from beginning to end.

2020 EIPC Winter Conference, Day 2

Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.

2020 EIPC Winter Conference, Day 1

Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

Avoiding EMI Problems With Lee Ritchey

The I-Connect007 team met with design expert Lee Ritchey to pick his brain on EMI (electromagnetic interference) problems and what can be done to minimize them. Lee explains the issues are almost always tied to power delivery, as well as the abundant amount of misinformation surrounding this topic.

What It Takes to Be a Milaero Supplier, Part 1

The decision to pursue military and aerospace (milaero) certification impacts every facet of the organization, and not every shop is prepared to make this transformation. This is the first article in a four-part series, breaking down what it takes in sales and customer service, engineering and CAM, purchasing and quality, and manufacturing. Anaya Vardya starts by exploring sales and customer service.

Max Seeley: Some Designers Hesitant to Adopt New Tech

I spoke with Max Seeley of 3M about a design class he presented at AltiumLive in Frankfurt, Germany. We also discussed autorouting and the continuing advances in EDA tools, as well as the schism between users who embrace new technology and those who still prefer to layout their boards the old-fashioned way. Which camp do you belong to?

Joe Clark Says DownStream Is Ready for More Growth in 2020

Joe Clark, co-founder of DownStream Technologies, gives Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.

Solder Paste Printing From the Stencil’s Perspective

Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

AT&S: Working With Designers on a Global Level

Barry Matties recently took a tour of AT&S’s Austrian factory, which is developing new circuit design strategies surrounding embedded and active components. Gerald Weis discusses the company’s focus on serving and educating PCB designers around the world, as well as their plans to embrace the latest technology and Industry 4.0 processes going forward.

Upcoming IPC APEX EXPO Offers Sessions on 5G

Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.

Residual/Free TBBPA in FR-4

Sergei Levchik describes how testing has shown that FR-4 printed circuit boards do not contain free or residual tetrabromobisohenol-A (TBBPA).

Are ISO Procedures Strangling Innovation?

Andy Shaughnessy recently spoke with Quantel’s Roger Beers, who voiced his concerns about the struggles engineering departments face when dealing with new technologies within ISO procedures. While great for repeatable processes, Roger says ISO in its current state may be preventing engineering growth.

Fresh Thinking on the Logistics of Laminate Distribution

Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.

Flexibility Is Key to Direct Imaging Success

Brendan F. Hogan, managing director of MivaTek, explains that while each industry has its own set of requirements and difficulties, the lines between semiconductor and PCB markets are blurring, demanding more flexibility from equipment suppliers.

Todd Westerhoff on the Value of Solid Design Skills

Andy Shaughnessy recently caught up with Todd Westerhoff, product marketing manager for Mentor’s HyperLynx signal integrity (SI) tools. Todd discusses some of the challenges that he and his customers are facing and why good design skills have more influence on a PCB than any software tool.

Meet John Watson, I-Connect007 Columnist

Meet John Watson, CID, one of our newest I-Connect007 columnists! John has been in the electronics industry for 40 years, with 20 of them being in PCB design, and is now a senior PCB engineer for Legrand Corporation. Read "Elementary, Mr. Watson" in Design007 Week Newsletter.

The World of PCBs: Anything But Boring

Andy Shaughnessy had the chance to catch up with Megan Teta, CID+, product manager of design and education services at Insulectro. Megan explains why she’s excited to become more involved in training and why the world of PCBs is anything but boring, contrary to popular opinion.

Chris Banton is Bullish on New Tech

Chris Banton is the director of marketing for EMA Design Automation. He and Andy Shaughnessy discuss the need to train the next generation of designers, advent technologies like AI and machine learning, and why companies like EMA are using these advancements to help designers with today’s complex PCBs.

Bryan LaPointe: A Great Time to Be Working With Technology

I recently interviewed Bryan LaPointe, a product engineer with Cadence Design Systems, and one of the younger people in the world of PCB design and EDA tools. I asked Bryan to discuss some of the challenges technologists are facing in PCB design and engineering, as well as some of the things that make this field so exciting right now.

What You Need to Know About the Digital Factory

Barry Matties spoke with Oren Manor, director of business development for Mentor, A Siemens Business, during productronica about the many benefits of a digital factory and what’s keeping companies from becoming one. Oren also gives examples of big data analytics along with the move to a lot size of one.

What You Need to Know About a PCB Design Career

Never stop learning. Why? Because the industry never stops changing. Those that continuously stay in that state of learning are the ones who succeed. The old saying “Knowledge is power,” often attributed to Sir Francis Bacon, has never been truer. Fortunately, there is never a lack of things to learn. Don’t ever become apathetic about learning. Make a point of keeping a running list of ideas or subjects that you want to research, and then purposely set aside time in your week strictly to study and learn about these things anywhere you can.

The Value of Education and Communication

Editor Nolan Johnson recently spoke with Lawrence Romine, VP of corporate marketing at Altium, about what he thinks design customers need to know and the importance of education and communication between designers and manufacturers.

Planning a Successful Technical Conference

Amanda Lange founded DINEvent and has evolved her company into an active events planner and management company with a global client base. In this interview, Nolan Johnson asks Amanda to share how a technology company should get started with a technical conference for customers.

Top 10 Most-Read Design News Stories of 2019

As we move into 2020, we took a look back at the most popular Design007 news stories of the past year. Here for your enjoyment are the Top 10 most-read Design007 news items of 2019.

Top 10 Most-Read Design Articles of 2019

As we move into 2020, we took a look back at the most popular Design007 articles of the past year. Here for your enjoyment are the Top 10 most-read Design007 articles of 2019.

Top 10 Most-Read Design Columns of 2019

As we move into 2020, we took a look back at the most popular Design007 columns of the past year. Here for your enjoyment are the Top 10 most-read Design007 columns of 2019.

Wi-Fi 6: Wired vs. Wireless

We all know that it makes no sense to get the latest device just because they come out with a new one every year. Sure, post-millennials tend to want a new phone every year, but most of us are well past that. However, as the competitive nature of the consumer tech industry continues to increase, the rate of change is also accelerating, as is the peer pressure to upgrade. Non-techies get new phones every year, techies get new CPU and GPUs every two years, average consumers get bigger and higher-res TVs every three years, and on it goes.

Is Captive Making a Comeback?

Andy Shaughnessy recently spoke with Altium’s Steve Chalgren, senior VP of business strategy and planning. Steve shared his thoughts about why improved manufacturing and automated EMS equipment, such as robotics, might lead smaller OEMs to become captive shops like the old days. Is captive making a comeback?

Insulectro Works to Bridge the Fabricator/Designer Gap

Barry Matties sat down with Insulectro’s Megan Teta and Mike Creeden to discuss trends they see in the materials market and how they’re working to bridge the gap between fabrication and design, including helping designers understand what they can do to make a board more manufacturable.

Utilizing AI in CAD Library Development

Nolan Johnson speaks with Chico Wu of Footprintku, a company using artificial intelligence (AI) to help fill gaps in CAD library development by partnering with design teams on things like addressing resource shortages and automating custom design rulesets while also eliminating other manual steps in the process.

The Viability of a Cyanide-free Immersion Gold Bath

The Tianjin chemical blast in August 2015 sensitized the Chinese authorities to the use of cyanide in production. As a consequence, the authorities have introduced licensing with regard to the use of cyanide. In turn, this has motivated Chinese PCB manufacturers to ask suppliers for a competent cyanide-free immersion gold solution (CNF Au).

Digi-Key on Adapting to the Changing Industry Landscape, Part 2

The I-Connect007 editorial team recently spoke with Chris Beeson, executive vice president of global suppliers and new business development at Digi-Key Electronics, about trends and the changing landscape of the industry. In the second half of this interview, Beeson discusses the EDA tools market, and how Digi-Key works with PCB designers to present the most efficient, seamless process for selecting components.

Designing for Complex PCBs

The I-Connect007 editorial team sat down with Freedom CAD’s Scott Miller to talk about the industry’s demand for more increasingly complex PCBs, and the challenges this presents. They also discuss Freedom CAD’s in-house training programs, the company’s recent book authored by Scott, and why communication is such an important tool in a PCB designer’s toolbox.

AltiumLive Frankfurt 2019: Happy Holden Keynote

Nobody left early! Altium had wisely kept Happy Holden’s keynote presentation on “PCB Trends that Will Impact Your Future” until the end of the final day of the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany. Pete Starkey presents the highlights of Happy's presentation.

AltiumLive Frankfurt 2019: Carl Schattke Keynote

“How many here can remember manually taped artworks?” No more than three hands were raised in an audience of over 230 at the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany, as IPC Advanced Certified Interconnect Designer Carl Schattke introduced his keynote, entitled “Making and Breaking the Rules.” Schattke had learned PCB layout as his father’s apprentice, hand-taping several hundred PCB designs in the 1970s.

What Does Intelligent Routing Look Like?

Many PCB design projects miss schedule commitments by 70% due to delayed routing and lack of automation. Moreover, due to late-stage design changes, schedules are not met, and the addition of those new items takes 10 times longer or more to incorporate than if changes were added from the beginning. Fortunately, over the past several years, powerful routing capabilities have been added that allow designers to address a number of specific, critical tasks.

Martyn Gaudion Discusses Backdrilling Software

Martyn Gaudion updates Pete Starkey on Polar’s recent work to model signal integrity to higher speeds as well as additional laminates included in the material library. Now backdrilling is the focus for high-speed design specialists. Martyn discusses the backdrilling beta software that Polar Instruments was showing on the show floor.

Oren Manor on the Siemens-Mentor Integration

In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.

AltiumLive Frankfurt 2019: Rick Hartley Keynote

Introduced by Lawrence Romine, Altium’s VP of corporate marketing, as a “low impedance presenter with a passion for his topic,” Rick Hartley delivered the opening keynote at the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany. Pete Starkey provides an overview of Hartley's presentation, entitled “What Your Differential Pairs Wish You Knew."

A Radical New Design Perspective

Nolan Johnson recently interviewed Gordon Kruberg, CEO of Gumstix, which was acquired by Altium recently. While Gumstix designs and sells computer hardware products, Altium bought Gumstix for the Geppetto design software. Gordon discusses how the concepts of Geppetto are likely to influence future design methods in the Altium environment.

University Rover Challenge Tests Student Teams

Jose Antelo, Luis Toledo, and Francisco Fernandez, members of the California State University (CSU) Fullerton Rover Challenge team, are working on building a competitive robotic platform to compete with other universities in a competition hosted by The Mars Society known as The University Rover Challenge.

Lee Ritchey on the Direction of PCB Design

Editors Andy Shaughnessy and Nolan Johnson recently spoke with Lee Ritchey of Speeding Edge about the direction of PCB design. Lee also discusses some of the changes that he has seen in this industry over the past 40 years and some of the technological drivers that are causing designers to think more like electrical engineers than ever before.

Communication, Part 6: The Importance of Technology Fit

In the final installment of this series on how PCB fabricators and designers can better communicate, Bob Chandler from CA Design and Mark Thompson from Prototron Circuits discuss the importance of “technology fit” and how this concept impacts the synergy of the two parties involved.

Dugan Karnazes Discusses His New Startup

I caught up with Dugan Karnazes again this year and discussed his new startup, Velocity Research, which is a one-stop shop for design made up of technical creatives. The Grand Rapids company is already doing design work for a variety of customers, from individuals to multinational companies.

Design For Excellence: Karen McConnell on Standards

During the IPC Summer Meetings, I spoke with Karen McConnell, senior staff CAD CAM engineer with Northrop Grumman Mission Systems. Karen is a veteran PCB designer as well as an IPC committee chair and mentor. She offered an update on some of the IPC committees she chairs, the need for more mentor programs in this industry, and why you can call something a ham sandwich if you define it correctly in the standard.

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

Happy Holden Previews His AltiumLive Frankfurt Keynote

I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.

ODB++: Transforming Ideas Into Products

The ODB format originated with the objective of delivering on this need. The format was originally introduced for use by PCB fabricators, eliminating the need for a collection of CAM files in multiple formats—such as Gerber, Excellon, IPC-356, or even IPC-350, which was an early attempt to simplify this process. The key to the success of ODB was that it obtained industry acceptance.

Words of Advice: What Data Format do you Send Your Assembly Provider?

In a recent survey, we asked the following question: What PCB data format(s) do you send to your PCB assembly supplier? Here are just a few of the answers, edited slightly for clarity.

Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure

Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss.

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

Robert Feranec: A Lifetime of PCB Design

I recently spoke with Robert Feranec about the upcoming keynote he’ll be giving at AltiumLive in San Diego, California. Robert is a YouTube star and founder of the FEDEVEL Academy. In our interview, he discusses his keynote presentation as well as how he’s helping designers and engineers around the world understand and optimize their PCB design processes.

Pulsonix Is Bullish on Next-gen Designers

During a recent trip to the U.K., Barry Matties spoke with Bob Williams, the managing director of Pulsonix, about training the new generation of designers. He explained how the company reaches out to local high schools, colleges, universities, and user groups to advocate for careers in PCB design and manufacturing.

EIPC Summer Conference 2019, Day 1

The beautiful city of Leoben in central Austria provided the setting for the EIPC 2019 Summer Conference. In this article, EIPC Chairman Alun Morgan provides the highlights of the first day of the event, including a recap of the technical presentations.

SimplifyDA’s Floorplanning Tool Optimizes Autorouting

Zen Liao, CEO of Simplify Design Automation, recently spoke with the I-Connect007 editorial team about his company’s high-level floorplanner for autorouting, which allows engineers to pass their ideas along to PCB designers. Zen discusses the floorplanning technology and his marketing strategies as well as the challenge of getting reluctant PCB designers to embrace autorouters.

AltiumLive Q&A With Keynote Speaker Eric Bogatin

It's show season again! The 2019 AltiumLive PCB Design Summit will be here before you know it, taking place October 9-11 in San Diego, California. Teledyne LeCroy’s Eric Bogatin, the “signal integrity evangelist,” will be giving a keynote presentation titled “Breaking Bad: A Downside of Open Source Designs.” Eric gives us a preview of his presentation and discuss some of the biggest design challenges he sees today.

Decoupling Capacitors’ Impact on Power and Signal Integrity

It is crucial for hardware designers to identify the resonant frequency of each element of the PDN on a PCB and its impact on power integrity. A PCB with poor power integrity—such as a higher-than-targeted PDN impedance across the wideband range—results in SSN and a shrunken eye diagram of the signal transmitted by the IC that draws power from the PDN. This article demonstrates the post-layout co-simulation of power and signal integrity.

The Impact of Inductance on Impedance of Decoupling Capacitors

This article discusses the impact of interconnection inductance on the impedance of the decoupling capacitor, which influences the power integrity of the PCB. The investigation is performed with 3DEM simulation by varying the trace length and height of stitching vias that connect the decoupling capacitor across the power rail and ground.

Altium Designer 19.0 Features Printed Electronics Design Functions

The newest version of Altium Designer—revision 19.0—includes functionality for designing printed electronic circuits. We wanted to get the scoop on Altium’s PEC tools, so we asked Nikolay Ponomarenko, Altium’s director of product management, to give us a tour of the new functions.

IPC High-reliability Forum and Microvia Summit Review, Part II

The Microvia Summit on May 16 was a special feature of the 2019 event in Baltimore, since microvia challenges and reliability issues have become of great concern to the PCB manufacturing industry. It provided updates on the work of members of the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee and opportunities to learn about latest developments in methods to reveal and explain the presence of latent defects, identify causes and cures, and be able to consistently and confidently supply reliable products.

Mentor Tools: Optimized for Flex and Rigid-flex Design

With the launch of the new Flex007 section in Design007 Magazine, we asked David Wiens, product marketing manager with Mentor, a Siemens Business, to tell us about their tools’ flex and rigid-flex design capabilities. As David explains, today’s higher-end design software tools are optimized for flex design, making workarounds a thing of the past.

IPC High-reliability Forum and Microvia Summit Review, Part I

The IPC High-Reliability Forum and Microvia Summit covered a broad range of topics related to reliability and provided interactive opportunities to share expert knowledge and experience in determining and understanding the causes of failure and selecting the best design rules, materials, processes, and test methods to maximise product reliability.

Words of Advice: Where Do You Get Involved in the Design Process?

In a recent survey, we asked the following question: Where in the process do you typically get involved with a design project? Here are a few of the answers, edited slightly for clarity.

Identifying Product Board Class and Pre-quote Software

Deciding on the class of the final product will determine what files are needed for fabrication and assembly. It is critical to note that for a product to be built to any class level, it must be designed to that class level from its inception.

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

Pulsonix 10.5 Development Driven by Customer Demand

I recently spoke with Bob Williams, the managing director of Pulsonix, about the release of the EDA tool’s version 10.5. Bob explained how the company had made the tool more intuitive based on user input, and he discussed some of the more cutting-edge functionality not normally found in competitively priced tools.

Words of Advice: Where Do You Get Involved in the Design Process?

In a recent survey, we asked the following question: Where in the process do you typically get involved with a design project? Here are a few of the answers, edited slightly for clarity.

Libraries: A Must-have for Design

I-Connect007 was invited to attend a session of the Orange County Chapter of the IPC Designers Council (DC). Even though I have been an IPC member for over half a century (yes, almost since vacuum tubes dominated design), this was my first DC event.

Stitching Capacitor: Crosstalk Mitigation for Return Path Discontinuity

When the return path is broken due to the switching of reference planes with different potential, e.g., from ground to power or vice versa after layer transition on PCB, the return current might detour and propagate on a longer path, which causes a rise in loop inductance. This might lead to the sharing of a common return path by different signals that pose a high risk of interference among the signals due to higher mutual inductance. This interference results in signal crosstalk. To mitigate the crosstalk due to return path discontinuity (RPD), stitching capacitors are mounted on the PCB to serve as a bridge between the two reference planes of interest on different PCB layers.

Wild River, eSilicon, and Samtec Team up for 112-Gbps Test Vehicle

During DesignCon, I sat down for an interview with Tim Horel from eSilicon, Al Neves of Wild River Technology, and Matt Burns from Samtec. They’ve recently teamed up to create a 112-Gbps test vehicle that may be the first of its kind of test fixture.

The GraftWorx Fluid Management Patch Story

The GraftWorx vision is to connect patients to clinicians with clinical data that will have a meaningful impact on their care. Its first application is to monitor patients with end-stage renal disease or kidney failure using a wearable device called the SmartPatch that records numerous clinical cardiovascular metrics. This article details how GraftWorx was designed, fabricated, and assembled.

Freedom CAD Book Excerpt: The Printed Circuit Designer’s Guide to… Executing Complex PCBs

The following is an excerpt from Chapter 5 of "The Printed Circuit Designer’s Guide to… Executing Complex PCBs," written by Scott Miller of Freedom CAD Services.

Mentor’s EDA Perspective on Managing Design Rules

I recently spoke with Dave Wiens, product manager, and Mike Santarini, EDA content director of corporate marketing, both of Mentor, a Siemens business, about design rules and constraints, and what their customers want regarding design rules. They explained how EDA companies like Mentor help designers constrain for performance while avoiding over-constraining and increasing the cost of the board and also being manufacturing-aware.

Altium’s Craig Arcuri on Design Rules: Past, Present, and Future

We recently spoke with Altium’s Craig Arcuri about his views on design and manufacturing rules. Craig has experience running both design and manufacturing companies, so he has a fairly circumspect view of constraints from both sides of the product realization process. Craig details some of the challenges with setting and managing hundreds of often divergent design and manufacturing rules, and how both design and manufacturing constraints need to evolve.

Words of Advice: When do You Get Involved in the PCB Design Cycle?

In a recent survey, we asked the following question: Where in the process do you typically get involved with a design project? Here are a few of the answers, edited slightly for clarity.

Technically Appropriate Material Choices are Key to Design Success

Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. I-Connect007’s Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.

Smart Design Data Is Essential for Industry 4.0 Manufacturing

Almost all of the conversation regarding Industry 4.0 is centered on the manufacturing floor, which is where the effect of the initiative is most felt initially. Little attention is given to the starting data for manufacturing—the data that comes from design. However, you can’t have smart manufacturing if your process begins with dumb data. As Pink Floyd said, “You can’t have your pudding if you don’t eat your meat!”

XPLM: Using PLM to Integrate ECAD and MCAD Data

During AltiumLive in Munich, I met with Robert Huxel, XPLM’s director of business development for EMEA and APAC. XPLM offers data integration for some of the big EDA tool companies, and their tools can integrate ECAD and MCAD data into PLM systems. I asked Robert to tell us about the requirements of today’s PLM tools, the changing world of ECAD and MCAD integration, and whether these two types of data are ever going to converge.

EM Modeling: The Impact of Copper Ground Pour on Loss and Impedance

This article briefly introduces the general purposes of copper ground pour on printed circuit boards. Subsequently, the impact of copper ground pour on PCB channel loss in terms of insertion loss and impedance in terms of time domain reflectometry (TDR) is studied with electromagnetic modeling using Mentor HyperLynx.

An Experienced Millennial on Hiring the Next Generation

During DesignCon, I met with Geoffrey Hazelett, VP of sales for Polar Instruments. Even though he has been in EDA for a few years, Geoffrey is still in his thirties, which makes him a youthful cherub in this industry. I asked Geoffrey what he thinks about the new PCB designers and EEs entering this field, and what more can be done to expose young people to the world of PCBs.

Preparing to Enter the Workforce With PCB Design Experience

Nolan Johnson recently spoke with Alex Burt, a computer engineering student at George Fox University, at a well-attended college career fair on the GFU campus in Newberg, Oregon. In the interview, Alex discusses his PCB classwork, challenges of design, and how it has impacted his internship experience as he prepares to enter the workforce upon graduation in the spring semester of 2019.

PCB Design Is All in the Family With Nicole Pacino

I shared a flight with Nicole Pacino on the way to Altium Live in Munich, and she mentioned that her father was speaking at the show. I went down the list of speakers, and it turned out that her dad is Mike Creeden of San Diego PCB. In Germany, I asked Nicole to tell us about how she got into this industry, and what we could do to draw more young people into this career.

From Spain to Austria: A Student’s Drive to Be a Professor

The AltiumLive event in Munich drew several hundred PCB designers from around Europe, including engineering students interested in PCB design. I spoke with Pablo Sanchez Martinez, a student at FH Joanneum in Austria who is working toward being a full professor in hardware design. Pablo discussed his studies in engineering and PCB design, the classes he’s teaching, and his plans for teaching the young engineers of the future.

Andy Johnson: EDA a Great Field for Young People

At the AltiumLive event in Munich, Germany, I sat down for an interview with Altium’s Andy Johnson. Andy is 25 and just a few years out of college, so I asked for his thoughts on working in this industry and what we can do to draw more young people into the PCB design community.

Kelly Dack at IPC APEX EXPO: The Attendees Speak!

During IPC APEX EXPO, Guest Editor Kelly Dack and the I-Connect team roamed the show floor, recorders in hand. They asked various attendees for their impressions of the show, and any new tools and technology that may have caught their attention. These are their stories.

EIPC Winter Conference, Day 2

After the papers from the first day of the EIPC Winter Conference in Milan on February 14–15, the delegates were hosted at a reception and plant tour of Elga Europe at their nearby production facility. Here's a recap of the events and highlights of the Day 2 of the conference.

Nano Dimension Offers Update on Dragonfly 3D Printer a Year After Launch

The Nano Dimension Dragonfly 3D printer arrived in much fanfare a little over a year ago. The company has been selling them to customers around the world, many of whom are using them to print antennas, sensors, and PCBs. At AltiumLive in Munich, I asked Product Manager Robert Even to discuss what they’ve learned in the year since the Dragonfly debuted, and some potential uses for 3D printing technology.

SimplifyDA: Time for a New Autorouter Paradigm?

At DesignCon, I spoke with SimplifyDA CEO Zen Liao and Director of Sales and Marketing Dale Hanzelka. SimplifyDA is putting a new twist on the old autorouter by utilizing topological technology. I asked them to discuss their approach to autorouting, and how they plan to entice more PCB designers to use routers. Is it time for a paradigm shift in autorouting?

Bert Simonovich on Modeling Copper Roughness

I met with one of our contributors, Bert Simonovich of Lamsim Enterprises, at DesignCon 2019. Bert’s paper on interconnect modeling was nominated as a Best Paper finalist, so I asked him to discuss his paper and some of the challenges that engineers and their customers are facing right now.

3DEM Modeling: Influence of Metal Plating on PCB Channel Loss and Impedance

This article briefly introduces different types of metal plating commonly used in PCB fabrication. Subsequently, the influence of metal plating on PCB channel loss (i.e., insertion loss or S21) and impedance (i.e., time domain reflectometry or TDR) is studied with 3DEM modeling,

Mentor’s Cristian Filip Discusses His Award-winning DesignCon Paper

During DesignCon, I met with Cristian Filip, a senior product architect with Mentor, a Siemens business. Cristian had just received word that his paper had won a DesignCon Best Paper award—his second such award in three years. I asked Cristian to discuss his paper and how this technology can help improve manufacturing yields at high volumes.

EMA: Cadence Moves Simulation Further Up in the Design Cycle

Cadence Design Systems recently integrated more of its Sigrity capabilities into the front end of its PCB design tools. During DesignCon, Chris Banton of EMA Design Automation spoke with me about how this drive for “model-less analysis” benefits the PCB designer who can now access signal and power integrity, DFM, and electrical rule checking functionality early in the design process and have fewer issues later.

Cherie Litson on ECAD/MCAD and Training the Next Generation

Cherie Litson, CID+, was one of the instructors at AltiumLive Munich. I asked her to discuss some of the topics she covered in her class, and what the future of PCB design will look like. How are we going to pass down all of this design knowledge to the next generation?

Todd Westerhoff Discusses His New Position and Much More

At DesignCon, I met with our old friend Todd Westerhoff, a veteran signal integrity engineer. Todd joined Mentor, a Siemens Business, since we last spoke. We discussed his new job responsibilities, his drive to get more designers and engineers to use SI tools, and the increasing value of cost-reduced design techniques versus overdesigning PCBs.

RTW IPC APEX EXPO 2019: Judy Warner on Altium's Transformative Vision

During IPC APEX EXPO, Guest Editor Kelly Dack sat down for an interview with Judy Warner, Altium's director of community engagement. They discussed Altium's efforts to educate PCB designers, regardless of their CAD tools, and the company's plan to transform the industry by bringing together PCB design and manufacturing.

Linda Mazzitelli: PTC Goes all in on ECAD/MCAD Collaboration

At AltiumLive Munich, I ran into Linda Mazzitelli of PTC. Linda has worn a lot of hats in the PCB design world—she’s even married to a designer. I asked Linda to discuss her current work at PTC and the apparent convergence of ECAD and MCAD, which many think has been a long time coming for this industry.

Words of Advice: What Concerns you About the Future?

In a recent survey, we asked the following question: What concerns do you have about the future? Here are just a few of the answers, edited slightly for clarity.

Casper van Doorne Discusses His AltiumLive Class, IoT, and More

What’s in a name? When PCB designer Casper van Doorne needed to choose a name for his service bureau, only one name would do—Doofenshmirtz Evil Incorporated, a villainous name familiar to fans of Walt Disney. At AltiumLive Munich, I spoke with Casper about his company, the class he presented in Munich, and some of the benefits and ramifications of the growth of IoT.

TUM Hyperloop Team Learns PCB Design on Way to Setting World Speed Record

At AltiumLive Munich, I met with Tobias Bobrzik, a Technical University of Munich student and member of the TUM Hyperloop team. In 2018, the TUM Hyperloop team’s prototype pod set the world speed record of 290 miles per hour, which lead to their meeting with Musk. Tobias designed some of the PCBs used in that vehicle, so I asked him to tell us more about this experience, and what he hopes to do after graduation.

Words of Advice: Flex Design and Manufacturing Training

In a recent survey, we asked the following question: Where do your technologists acquire training or expertise regarding flexible circuits? Here are just a few of the answers, edited slightly for clarity.

RTW IPC APEX EXPO 2019: Oren Manor Details New Camstar Electronics Suite

In this video interview, Nolan Johnson meets with Oren Manor—director of business development for Mentor, a Siemens Business—to discuss the introduction of their new Camstar Electronics Suite software, an innovative manufacturing execution system (MES) for electronics.

AltiumLive Munich: Day 2 Keynotes

Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.

AltiumLive Munich: Day 1 Keynotes

The weather forecast was wrong! Despite my apprehension and winter clothes, there was very little snow at the Hilton Munich Airport. It could have been any season of the year inside the splendid convention facility, which was also the venue for the second European AltiumLive design summit. AltiumLive brought together a family of over 220 electronics engineers and designers eager to learn from top industry experts and applications specialists who were equally eager to share their knowledge and experience freely.

Happy Anniversary, Gerber Format: Looking Ahead to Digital Innovation

This year, we celebrate the 55th anniversary of the introduction of the Gerber machine language format. We can thank H. Joseph Gerber, the man who took manual PCB design to the next level with the automated photoplotter, for giving us this format in 1964. Gerber immigrated to the United States in 1940 with his mother following the death of his father during the Holocaust. Gerber started Gerber Scientific Instrument Company in 1948 to commercialize his first patented invention—the variable scale.

AltiumLive Munich Draws Designers from Around Europe

I’m finally unpacked after last week’s AltiumLive PCB design summit in Munich. Much like the AltiumLive event I attended in San Diego last October, the conference drew hundreds of PCB designers. This marked the second AltiumLive PCB design summit held in Munich, and Altium seems to have it down to a science. I spoke with designers from Germany, Austria, the Netherlands, and Belgium, just to name a few countries. Many of them were involved in the automotive segment but some were in medical and industrial controls as well. It’s great to be at an event that is full of PCB designers, because designers are few and far between at most PCB industry events.

The Quest for Perfect Design Data Packages

There’s an ongoing problem in the PCB industry: fabrication shops are receiving incomplete or inadequate design data packages, leaving manufacturers scrambling to fill in the blanks. For a quick-turn prototype shop like Washington-based Prototron, with over 5,000 customers and up to 60% of orders coming from new customers each month, that can add up to a lot of wasted time and effort just in the quoting stage. Dave Ryder, Prototron president, and Mark Thompson, engineering support, delve into this continuing issue and more.

Mentor and Seica Partner for Data Prep and Testing Big Boards

Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Altium Prepares for Munich Show as Growth Continues

It’s been just two months since the AltiumLive event drew several hundred designers to San Diego, California, and Altium is already gearing up for the next show in Munich, Germany (January 15–17, 2019). I recently spoke with Chris Donato, VP of global sales for Altium, about the upcoming AltiumLive show as well as the company’s growth over the past few years.

January 2019 Issue of Design007 Magazine Available Now

The component shortage is getting crazy. Some PCB designers are finding their favorite capacitors on 50-week and 80-week lead times, or worse. How do you design a board today when the components you need won’t be available for a year or more? In the January 2019 issue of Design007 Magazine, we asked our expert contributors to explain the current component shortage, as well as some of the workarounds that can help you get your next design out the door sooner rather than later.

Rainer Beerhalter Discusses His AltiumLive Munich Presentation

Rainer Beerhalter is a physicist, and according to his design bureau’s website, “founder, owner, and mastermind” of B GMBH. Rainer attended the first AltiumLive in Munich in 2017, and he’s returning to this year’s event in Munich January 15–17. I asked him to tell us about the class he’ll be teaching in Munich, and why he decided to come back for the sophomore AltiumLive show.

Words of Advice: Design Challenges

In a recent Design007 survey, we asked the following question: "What are your biggest design challenges?" Here are just a few of the replies, edited slightly for clarity.

Dan Beeker on His AltiumLive Munich Keynote and Battle With the Status Quo

Dan Beeker, senior principal engineer with NXP Semiconductors, was one of the speakers at the first AltiumLive event in San Diego in 2017. Now, he returns to AltiumLive 2019 in Munich from January 15–17 with a keynote titled, “It’s All About the Space.” Here, he discusses his keynote, which focuses on the need for designers to understand the behavior of electromagnetic fields, and why the status quo for advanced PCB design must change from, “We are going to fail,” to, “We are going to pass.”

Susy Webb: The History and Future of the Designers Council

When we started planning this issue on the IPC Designers Council, I knew I’d have to speak with design instructor Susy Webb, a longtime DC member and currently an executive board officer. I asked Susy to discuss how she first got involved with the DC, why designers should join their local chapter, and what the future holds for this group.

Effects of PCB Fiber Weave on High-Speed Signal Integrity

This article studies the effect of PCB fiber weave on signal integrity in terms of mode conversion and differential channel loss due to intra-pair skew. The study used Keysight ADS 2DEM simulation to observe s-parameter (i.e., insertion loss and differential to common-mode conversion) and an eye diagram for signal transmission at 1 Gbps and 10 Gbps.

Dock Brown on Succeeding at Failure Analysis

Dock Brown of DfR Solutions gave a keynote speech at SMTAI, “Requirements for Both Cleaning and Coating to Building Medical Hardware.” Barry Matties and Happy Holden sat down with Dock to discuss the current trends he sees in failure analysis, the concept of “rules versus tools,” and how predictive engineering software used early in the design cycle can help predict failures in components and microvias and drive cost down.

Randy Burcham Discusses New Techniques for BOM, Daughterboards

During AltiumLive, I spoke with IOTA Engineering's Randy Burcham, who taught several classes during the event. He explained his methodology for filtering BOM data as well as his new approach to working with daughterboards and how he was up and running on Altium tools after only three days.

Martin Cotton’s Parting Shot

Martin Cotton is a unique personality in the PCB industry. As Cotton says, “I’m a designer—look at my haircut!” Cotton gave the keynote at the Institute of Circuit Technology’s 2018 Harrogate Seminar, challenging his audience to consider laminate dielectric properties in the context of power and cost in a presentation entitled 'The Effect of the Dk of a PCB Laminate on the Cost-effectiveness of Office Rental Space. Intrigued?' Read on!

Words of Advice: Streamlining Your Design Process

In a recent Design007 Survey, we asked the following question: What would help you streamline your design process? Here are just a few of the answers, edited slightly for clarity.

Mentor Discusses New DFT, DFM, and Design Verification Tools

At electronica 2018, John McMillan, digital marketing program manager-Electronic Board Systems, and Mark Laing, business development manager-Valor Division of Mentor, a Siemens business, discuss new tools for PCB design verification, as well as design for manufacturing (DFM) and design for testing (DFT).

Rick Almeida Discusses DownStream's Latest News

At the 2018 electronica exhibition in Munich, Rick Almeida, founder of DownStream Technologies, brings Editor Pete Starkey up to speed with the company’s latest news.

Martyn Gaudion on Signal Integrity Modelling and Stackup Tools

The accuracy of signal integrity modelling continues to improve, and stackup tools are becoming widely used, which now include material suppliers' datasheet information. During the recent electronica show in Munich, Germany, Martyn Gaudion, managing director at Polar Instruments, explained how Polar often serves as a bridge between PCB design and fabrication, and why educating his customers is so critical.

Words of Advice: Fabricator Feedback?

In a recent Design007 Survey, we asked the following question: What is the most important feedback that you receive after your board is manufactured? Here are just a few of the answers, edited slightly for clarity.

New Grad Designs PCBs for Smart Baby Beds

The best ideas in the electronics industry improve the quality of our lives. At AltiumLive, I ran into Tamara Jovanovic, a new PCB designer and junior electrical engineer with Happiest Baby, a Los Angeles-based company that makes smart beds that can protect babies from crib death. After joking that I save the world from dangling participles while she’s saving babies, I asked Tamara to tell us more about smart baby beds, and how she got into PCB design in the first place.

Impact of Serpentine Routing on Multi-gigabit Signal Transmission

Serpentine is a technique to minimize skew or misalignment of differential pairs. The number of segments and intra-pair spacing of serpentining impacts the high-speed signal transmission. As the intra-pair gap is enlarged for serpentining, the characteristic impedance of the PCB trace in differential mode will rise. This leads to impedance discontinuity, signal reflection, and ultimately, attenuation. The signal attenuation is heavily dependent on the number of segments and intra-pair spacing of the serpentine.

Life Beyond 10 Gbps: Localize or Fail!

Ideally, all interconnects should look like uniform transmission lines (or wave-guiding structures) with the specified characteristic impedance. In reality, an interconnect link is typically composed of transmission lines of different types (microstrip, strip, coplanar, coaxial, etc.) and transitions between them such as vias, connectors, breakouts and so on. Transmission lines may be coupled to each other that cause crosstalk. The transitions may reflect and radiate energy due to discontinuities in signal and reference conductors. The crosstalk, reflections and radiation cause unwanted and sometime unpredictable signal degradation.

Achieving Minimal Crosstalk in Multi-board Interconnect

In an electronic system, the signal transmission exists in a closed-loop form. The forward current propagates from transmitter to receiver through the signal trace. On the other hand, for a single PCB, the return current travels backward from receiver to transmitter through the ground plane closest to the signal trace. Meanwhile, for multi-board interconnect (e.g., connectivity through flex or ribbon cable), the return current travels back to the transmitter through the ground or return wire, preferably as close as possible to the signal wire. The path of forward current and return current forms a loop inductance.

ESD Alliance Advisory Council to Shape ES Design West at SEMICON West

The Electronic System Design Alliance, a SEMI Strategic Association Partner, today hosted the first meeting of the Advisory Council of ES Design West co-located with SEMICON West 2019 West at San Francisco’s Moscone Center, July 9-11, 2019.

Julie Ellis: Communication and Fabrication Knowledge Critical for Designers

Field Application Engineer Julie Ellis of TTM sees it all: good designs, bad designs, and everything in between. Her classes on proper DFM techniques are always a big draw. She taught at the inaugural AltiumLive in 2017 and was back at this year’s event. I caught up with Julie and asked her to discuss some of the things she covered in class. As she points out, many issues could be eliminated if designers communicated with their fabricators and had a better understanding of how PCBs are manufactured.

Max Seeley’s PCB Design Career is No Fish Story

Max Seeley, senior electrical, PCB, and manufacturing engineer with 3M, was an instructor at the first AltiumLive event in 2017, and he made a return visit to this year’s event in San Diego. I asked Max why he decided to come back to AltiumLive this year and to share the story of his rather circuitous journey into PCB design, which included a turn as a custom aquarium builder. Everyone in PCB design has a different backstory.

Pulsonix Expands into North America with Version 10 Release

At PCB West in Santa Clara, California, Guest Editor Tim Haag and Publisher Barry Matties sat down with Ty Stephens of Pulsonix on the eve of the software developer's much-anticipated version 10 release date. Stephens outlined many new updates in the upcoming release—which has been in development for over two years—and discussed the company’s desire to break into the highly competitive North American software market.

Amway Sells Beauty Products—and Designs its Own PCBs

During AltiumLive in San Diego, I met Dugan M. Karnazes, an associate electrical engineer and PCB designer at Amway. The company is famous for selling nutritional supplements and soap, but apparently Amway has been busy diversifying over the years. I was interested in finding out more about Amway’s electronics development. Dugan sat down with me to discuss his role at Amway, and how this company grew into an $8 billion global giant.

Cadence Presents New Software System and Technical Papers at PCB West 2018

During PCB West 2018, I spoke with Dan Fernsebner, product marketing group director, and Hemant Shah, product management group director for enterprise PCB products, both with Cadence Design Systems, about their new software launch—DesignTrue DFM Ecosystem. Fernsebner and Shah also address recent technical papers from Cadence on Industry 4.0, IPC-2581, system-level design, and return-path analysis and management.

Altium Designer Increasingly Used for High-Speed Design

I recently met with Mark Forbes, the director of technical marketing at Altium, during the AltiumLive event in San Diego. We discussed Mark’s class on MCAD/ECAD collaboration and the success of AltiumLive, as well as the growth of Altium users who design high-speed PCBs with Altium Designer.

Catching up With Scott McCurdy and Freedom CAD

During PCB West, Scott McCurdy of Freedom CAD Services sat down with Technical Editor Tim Haag for an interview. We discussed Freedom CAD’s latest news, some trends in PCB design software tools, and the continuing need to draw more young people into a career in PCB design.

Darwin E. George: Seeking PCB Design Job at Retirement Age

Some of us dream of living a life of leisure at 70. But not Darwin E. George. This septuagenarian wants to find a job designing PCBs. We met up with Darwin at AltiumLive, where he was networking and trying to get his foot in the door with one of the companies that are hiring now. Darwin told us about his career in PCB design, his experience learning a new EDA tool, and why he would rather design high-speed PCBs instead of playing shuffleboard for the rest of his life.

RTW SMTAI: PalPilot on Adding Value to Design and Assembly

Tim Sullivan, vice president of sales at PalPilot International Corp., speaks with I-Connect007 Managing Editor Nolan Johnson about their services, and how they add value to their customers from design to assembly/manufacturing. He also talks about their online platform called FootPrintKu, which help designers when it comes to footprints of their design.

One-Question Survey, Part 2: What Advice Would You Offer a New Designer?

During AltiumLive 2018, the I-Connect007 editorial team asked some of the attendees to answer one question: What advice would you offer to a brand-new PCB designer? Here are just a few of the replies we received.

Mentor and TEXMAC Takaya Team up to Optimize DFT

At SMTAI, Mark Laing of Mentor, a Siemens Business, and Dave Levine of TEXMAC Takaya, sat down with Editor Nolan Johnson to discuss design for test, and their collaboration to improve DFT in PCB design tools and test machinery. They also traced the evolution of DFT over the past decade as it has begun to "left-shift" farther into the realm of the designer, all the way up to schematic entry.

Simon Fried: Additive Manufacturing Through Printed Electronics

Simon Fried, president of Nano Dimension, discusses how the company has taken the additive manufacturing process to the next level through printed electronics. He also shares his thoughts on the growing demand for 3D circuits, as well as how this could potentially be a game-changer for PCB designers.

Cadence: Bullish on AI

David White has been involved with artificial intelligence research for almost 30 years. Now, David is the senior group director of R&D for Cadence Design Systems, and I knew we’d have to speak with him for this issue on AI. In a recent interview, we discussed his decades of work in AI, Cadence’s research into AI and machine learning, and what he believes AI could mean for the EDA tools of the future.

Artificial Intelligence: The Future of EDA?

Artificial intelligence (AI) has been making inroads into a variety of industries in the past decade or so, from automobiles to medical devices. Naturally, EDA tool companies are taking a look at AI. Does AI offer a way forward for PCB design tool developers? I recently interviewed Paul Musto, director of marketing for the Board Systems Division of Mentor. We discussed Mentor’s plans for integrating AI into EDA tools, and why we may be at the very beginning of understanding the pros and cons of this new technology.

One-Question Survey: What Advice Would You Offer a New Designer?

During AltiumLive 2018, the I-Connect007 editorial team asked some of the attendees to answer one question: What advice would you offer to a brand-new PCB designer? Here are just a few of the replies we received.

AltiumLive 2018 a Mecca for PCB Designers

AltiumLive 2018 San Diego is now in the history books. This is the second annual AltiumLive (North America), and it was even better than the first. With nearly 300 hundred participants, from all parts of the country and industry, the event was a huge success.

John R. Watson Returns to AltiumLive in San Diego

When AltiumLive launched last year, John R. Watson, CID, of Legrand signed up as an instructor. He’ll be presenting at this week’s AltiumLive in San Diego as well. I spoke with John recently about his AltiumLive class, and the state of PCB design. He also discussed a few tricks for designing boards with components that are currently on an 80-week lead time, and why this problem is likely to get worse before it gets better.

AltiumLive to Feature Altium Designer 19 Release

This week, Altium Designer 19 will be officially launched to the public during AltiumLive, which takes place October 3-5 in San Diego. I asked Altium COO Ted Pawela to give us a preview of Altium Designer 19, and to explain how AD19 fits in with the company’s long-term plans. He also discusses Altium Live’s plan to provide PCB design content that is not vendor-specific to help support the entire industry, not just customers.

Lee Ritchey Returns to AltiumLive with 32 Gbps Design Class

Lee Ritchey was one of the instructors for last year’s inaugural AltiumLive event, which drew hundreds of PCB designers. Now, Lee is back, teaching a high-speed design class at next week’s AltiumLive in San Diego. That class is sold-out, but you can catch Lee teaching the same class at the January AltiumLive event in Germany. I asked Lee to explain what he plans to cover in this course, and why PCB designers and design engineers should consider attending one of the events.

Judy Warner: AltiumLive’s Second Year to Be Even Better Than First

Last year, Altium launched its AltiumLive event with shows in San Diego and Munich, Germany. This year, the event has expanded to include an extra day of classes. Altium is gearing up for the San Diego event in early October and the German show in January 2019. I recent spoke with Judy Warner, director of community engagement for Altium, about what designers should expect at both shows, and how the company can build on the success of the 2017 events going into the future.

PCB Design Challenges: A Package Designer’s Perspective

The challenges faced by the PCB designers of today are significant. If we examine the breadth of designs, we find ever-increasing data rates and more high-speed signal routing that drive additional challenges meeting signal-quality requirements, including reflection signal loss and crosstalk issues. At the same time, designers are being asked to complete designs in shorter cycle times and in smaller form factors. They must come up with new and more complex routing strategies to better control impedance and crosstalk. Manual implementation is often time-consuming and prone to layout errors.

The Impact of PCB Dielectric Thickness on Signal Crosstalk

Crosstalk is an unintentional electromagnetic (EM) field coupling between transmission lines on a PCB. This phenomenon becomes a major culprit in signal integrity (SI), contributing to the rise of bit error occurrence in data communications and electromagnetic interference (EMI). With the existence of mutual inductance and capacitance between two adjacent transmission lines on a PCB, crosstalk has become more severe due to the shorter signal rise/fall times at today’s higher data speed rates.