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- From The Show
Polar Instruments’ Martyn Gaudion Discusses Tools and Books
10/18/2017 | Andy Shaughnessy, PCBDesign007
Dan Beeker’s Keynote: It's All about the Space
10/18/2017 | Barry Matties, Publisher, I-Connect007
PCB Signal Integrity Optimization Using X-ray Metrology
10/16/2017 | Scott Jewler, SILICON VALLEY X-RAY
AltiumLive 2017 Attracts Hundreds of Designers
10/12/2017 | Happy Holden, I-Connect007
Altium Designer 18 Introduced at AltiumLive 2017
10/12/2017 | Barry Matties, Publisher, I-Connect007
Design :: Testing
Polar Instruments’ Martyn Gaudion Discusses Tools and Books
Polar Instruments has pretty been busy lately. In the last year, Managing Director Martyn Gaudion has written two books for I-Connect007, and the company has been working to upgrade its tools, especially library functionality. I met with Martyn at PCB West. We discussed Polar’s newest tool updates, Martyn’s new side job as an author of technical books, and the continuing growth of the EDA segment, including among young people.
Dan Beeker’s Keynote: It's All about the Space
Dan Beeker of NXP Semiconductors was a keynote speaker at the recent AltiumLive 2017 event in San Diego. His presentation focused primarily on the design of three-dimensional structures and how it’s all about space. I caught up with Dan, and we discussed his presentation, his background and career, and what kind of advice he would give to young PCB designers.
PCB Signal Integrity Optimization Using X-ray Metrology
It happens again. A new backbone router/switch build or a line card upgrade is approaching completion when something goes wrong. The system won’t operate at the targeted data rate. Deadlines are looming and the root cause of the problem is buried somewhere in a big rack of electronic components.
Whose Fault is That Bad Board?
Years ago, I held a position in an EMS company where projects were analysed before manufacturing. We found that even some of the best and most innovative circuits could not be manufactured. Why? Because the PCB designer, an electronic engineer, was not acquainted with the fabrication process. He had no idea about technological requirements necessary for electronic production. I know another designer who learned, finally, the importance of the thermal relief pad for heat restriction during reflow for a good soldering. His response? “Oh, was that what they were for? And to think I worked so much to remove them!”
Orange Co. Designers Council Meeting Focuses on Embedded Passives
On July 19, the Orange County Chapter of the IPC Designer’s Council hosted a lunch-and-learn meeting in Tustin to discuss the benefits of embedded passives. Approximately 40 people were in attendance, which was lighter turnout than usual, most likely because of summer vacations. But the crowd was an enthusiastic one, as usual. The first speaker was Bruce Mahler of Ohmega Technologies, followed by Jin Hyun-Hwang of Dupont.
Using Vibration and Acceleration Analysis to Improve Reliability
Deriving the physical constraints and fatigue issues for a design prior to manufacturing is essential to reducing board failure and thereby improving product quality. In harsh environments, fatigue can be responsible for up to 20% of failures. Customers have come to expect reliability across the industry spectrum no matter where actual production occurs. Reliable products have less risk of failure, less field returns and less warranty claims, all of which contribute to higher profitability. It is a given that every product is expected to fail at some point, however premature failures can be mitigated through proper design with attention to potential issues due to vibration and acceleration.
Embedded Technology: A Useful Tool in Freedom CAD’s Toolbox
Freedom CAD has been designing and fabricating boards with embedded technology for years, and doing some pretty innovative work along the way. I asked Scott McCurdy, Freedom CAD’s director of sales and marketing, to share some details about their embedded processes, as well as the challenges and opportunities that embedded technology offers.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
PCB Design in the Age of IoT
From the early days of printed circuit boards, the electronics industry has made huge strides in board materials, copper printing methods, miniaturization, rigid-flex, ELIC, EDA, and much more. Many of the devices we use in our homes, our vehicles, and in our workplaces would not be possible without this continuous evolution of PCB design and technology. And yet in 2017, we are poised to shift from evolution to revolution, driven by the idea of the Internet of Things.
San Diego IPC Designers Council Meeting Held at Del Mar Show
The Del Mar Electronics and Manufacturing Show is a long-time favorite among PCB professionals. What better place to hold a meeting of the San Diego Chapter of the IPC Designers Council? Each year, the San Diego Chapter of the Designers Council hosts their largest meeting of the year at the Del Mar show. This year, approximately 50 PCB designers and electronics professionals attended the lunch-and-learn meeting.
China High-Speed PCB Market Update with Polar's Simon Chan
During the recent CPCA Show in Shanghai, Editor Stephen Las Marias and Polar Instruments (China) Assistant Manager Simon Chan discussed the opportunities and challenges for Polar's customers in the Asia-Pacific region, as well as the current state of the high-speed PCB market in China.
Mentor Graphics Takes Best Paper Award at DesignCon
At DesignCon, I met with Dave Kohlmeier, senior product line director for Mentor Graphics. We discussed their Best Paper award and DesignCon sessions such as the Signal Integrity Boot Camp, as well as the new rigid-flex capabilities found in the HypeLynx suite.
A New Power Design Methodology for PCB Designs
Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.
Catching up with Polar Instruments' Geoffrey Hazelett
Product specialist Geoffrey Hazelett discusses some of the latest developments at Polar Instruments, including a new tool that will allow fabricators to determine how copper roughness will affect the end-product. He also talks about Polar's upcoming eBook on signal integrity, soon to be published by I-Connect007. Talented young technologists like Geoffrey are the future of our industry.
Cadence’s Zhen Mu Discusses Her Power-Aware Analysis Solution White Paper
At DesignCon, I met with Zhen Mu, senior principal product engineer with Cadence Design Systems, and Brad Griffin, product marketing director for Cadence. We discussed Zhen’s new white paper, “Power-Aware Analysis Solution.”
Exciting New Technology: Thermal Risk Management
Two years ago I entered into a collaboration with Dr. Johannes Adam, from Leimen Germany. Johannes has written a software simulation tool called Thermal Risk Management (TRM). We used it to look at the thermal characteristics of PCB traces under a variety of conditions, and it is hard for me to contain my excitement and enthusiasm for what it does and what we learned about traces using it. Our collaboration resulted in the publication of numerous articles and a book. In this article, I’ll talk about some of the capabilities of TRM that really caught my attention.
Real Time with...IPC: Jim Fuller Offers HDPUG Update
Sanmina's Jim Fuller gives his insight on how the High-Density Packaging User Group (HDPUG) shares the experience and resources of member companies to tackle projects and get results. Also, he reviews the study of the effect of copper bonding treatment on signal integrity
EIPC 2017 Winter Conference Review of Day 2
Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!
A Handy Compilation of Our Top 10 DFM Articles
When we started working on this DFM issue, I searched through our files and found that we’ve published some great DFM articles over the past year or so. While topics like signal integrity tend to get most of the limelight, in the end it all comes down to solid DFM practices. So, without further ado, we present this compilation of our Top 10 DFM articles and columns.
SiSoft Discusses Signal Integrity Drivers and Challenges
In the last few years, SiSoft has launched a variety of innovative SI tools that help automate tasks that used to take weeks or months to complete. I recently interviewed CEO Barry Katz via email, and he detailed their customers’ challenges, and some of the market drivers in the world of signal integrity.
Lightning Speed Laminates: The Blending of High-Speed Digital and High-Frequency RF
When the terms high-speed and high-frequency are mentioned, people think they describe the same issue. But in reality, they can be two very different matters. The term high-speed generally refers to digital technology which transfers data at very high rates. But the term high-frequency is typically related to radio frequency (RF), which involves analog signals moving energy at high frequencies.
Mentor Graphics’ PADS Platform Bridges Design and Manufacturing
At PCB West, Barry Matties spoke with Paul Musto about Mentor’s PADS environment and their introduction of scalable software tools to help design better boards, from the enterprise level down to the entry level and hobbyists. They also discussed the evolution of the design process infrastructure in North America vs. Asia, and what design engineers should focus on to increase their value.
The Shaughnessy Report: Leadership vs. Management
Is your manager one of the great ones, a true leader? Many of your colleagues would probably answer with a pointed “No.” In our reader surveys, we ask, “What is your biggest challenge?” Every time we've posed that question, we received replies along the lines of, “Management doesn’t know what the hell they’re doing.” Some replies are too salty to print.
Freedom CAD: Navigating the Unpredictable Design Marketplace
As COO of the design service bureau Freedom CAD, Scott Miller has a front-row seat to the challenges currently plaguing designers and the design community as a whole. He shared his views with me recently, offering insights on the importance of picking the right partners and customer relationships in an unforgiving and sometimes unpredictable design marketplace.
The Evolution of Altium: Road to a Record-Breaking Year
Chris Donato, VP of sales for Altium Americas, sat down with Judy Warner recently to discuss what he and Altium have been doing lately, where they came from (Australia) and what the future holds for Altium. This company has evolved from flying well under the radar during the acquisition frenzy of the ‘80s, to achieving a record $100 million in sales for fiscal year 2016.
Orange Co. Designers Council Meeting Draws A Packed House
Speaker John Stine, VP of operations at Summit Interconnect’s Anaheim facility, gave a presentation on flex and rigid-flex design and fabrication. At least 75 electronics professionals listened as Stine, an expert in flex and rigid-flex technologies, discussed proper trace geometries, grounding, cover lay, adhesives, signal integrity, impedance control, book-bindings and much more in his 80-minute presentation.
New SI Techniques for Large System Performance Tuning
In this DesignCon paper, Donald Telian of SiGuys and Michael Steinberger and Barry Katz of SiSoft describe newly-developed techniques for equalization tuning and discontinuity reduction, offering additional design margin. Cost reductions are also achieved as new signal integrity techniques demonstrate performance parity, removing non-essential re-timers and PCBs layers.
Software Bytes: Having Fun With Impedance
About a year ago, I was assigned a new project: become an expert in impedance, more or less. I had no idea how much this research would bring out the nerd in me. Even if you don’t typically design controlled-impedance circuit boards, you probably will eventually. Read on!
Getting Signal Integrity Right by Design
As clock frequencies increase and active devices and interconnect traces shrink and are placed ever closer together, signal integrity becomes an increasing challenge. Today, SI is typically addressed late in the design process after the PCB layout has been completed by performing complex and time-consuming 3D extractions and simulations for high-speed lines. But with little attention being paid to SI during the layout process, simulation frequently identifies numerous SI problems.
Beyond Design: Mastering “Black Magic” with Howard Johnson’s Seminars
Dr. Howard Johnson, the world’s foremost authority on signal integrity, has recently released his High-Speed Digital Design (HSDD) Collection. I recently reviewed all three of the seminars in this collection, a total of 36 hours of viewing time. If you want to gain some of Dr. Johnson's enthusiasm and master the art of high-speed design, then the collection is a must-have.
Designing With Tighter Tolerances
David Ledger-Thomas is a PCB design engineer with Honeywell Aerospace. He’s spent decades designing PCBs for a variety of applications, including defense, aerospace, computers, and high-performance audio. I asked David to share some of his thoughts on designing high-tech boards with increasingly finer spaces, traces and pitch.
The State of the Electronic Design Automation Nation
We are the automation nation. We are the high-speed demons, the low-frequency artists, the mixed-signal designers that make up the electronic design automation industry. We spend most of our working lives behind software, delivered to our fingertips with the promise of making things easier, faster, better, and getting us to our deadlines ever faster.
EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry
Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.
The Shaughnessy Report: The Designer Roundtable Roundup
Every year, I attend SMTA Atlanta, just across town. You have to love a local trade show. No airlines, no jet lag, and no hotels. It’s a small show; it would fit in a school gymnasium. But for me, the highpoint of SMTA Atlanta is the Designers Roundtable. This year the roundtable had 15 attendees, up from 12 last year. Two of the new attendees were under 35, which surprised all of us "graybeards."
Beyond Design: DDR3/4 Fly-by vs. T-topology Routing
JEDEC introduced fly-by topology in the DDR3 specification for the differential clock, address, command and control signals. The advantage of fly-by topology is that it supports higher-frequency operation, reduces the quantity and length of stubs and consequently improves signal integrity and timing on heavily loaded signals. Fly-by topology also reduces simultaneous switching noise (SSN) by deliberately causing flight-time skew.
SiSoft: Optimizing the State of the Art
In the 20 years since its founding, SiSoft has been at the forefront of signal integrity analysis tool development. Now, the company is leading the way with a new technology called OptimEye and tools for creating accurate IBIS-AMI models. Todd Westerhoff, VP of semiconductor relations, gives us an update on the company’s newest technologies.
Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1
In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.
Wild River: Simplifying SI so Engineers Can Focus on Design
Al Neves is founder and chief technologist of Wild River Technology, and he’s a signal integrity engineer who likes to tell it like it is. So when I bumped into Al during DesignCon, I asked him to sit down for an interview. We discussed the paper he co-wrote for DesignCon and the challenges SI engineers are facing, as well as Wild River’s efforts to take the black magic out of signal integrity.
Steinberger Talks PAM4, the Next Generation of Modulation
I recently interviewed our old friend Michael Steinberger, SiSoft’s lead architect for serial channel products. Steinberger is always a great interview; he breaks down complex signal integrity simulation technology in ways that are simple and often humorous. Steinberger sat down and discussed a paper he presented at DesignCon, and some of the challenges his customers are facing.
What’s New at Cadence?
Cadence Design Systems has released a variety of PCB design tools lately, and we wanted to find out a little more about what’s new at Cadence. I tracked down Product Marketing Director Brad Griffin and asked him to discuss some of the newest technology coming out of Cadence.
The PDN Bandini Mountain and Other Things I Didn’t Know I Didn’t Know
Originally, Bandini Mountain referred to a mound of fertilizer built by the Bandini Fertilizer Company in California prior to the 1984 Los Angeles Olympics. When the company went bankrupt, this mound of fertilizer was left behind. Steve Weir coined this term to describe the large resonant frequency peak formed by the parallel combination of the on-die capacitance and the package lead inductance, as seen from the die looking into the PDN.
IPC APEX EXPO: Hofer Discusses the Pros and Cons of Backdrilling
General Manager James Hofer of Accurate Circuit Engineering discusses the process of backdrilling vias, including the benefits and drawbacks. Backdrilling can improve signal integrity, but it can also create stubs that may act as unwanted antennas.
Mark Thompson: It’s All About Communication
In engineering support at Prototron Circuits, Mark Thompson has seen it all. He ensures that each design is manufactured the way the designer intended, even if the CAD data is not crystal clear. During DesignCon, Barry Matties and Andy Shaughnessy talked with Thompson about why communication is paramount when designing and prototyping boards. Thompson also explained how designers can avoid making common mistakes that can set back an entire project.
DuPont, Taconic and PFC Team Up For High-Speed Flex
At DesignCon, I sat down with three flex circuit specialists: Glenn Oliver of DuPont, Tom McCarthy of Taconic, and Steve Kelly of PFC Flexible Circuits. Our discussion covered a lot of territory, most notably the findings they described in the paper they were about to present later that day at DesignCon, and the future of flex, as they see it.
Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 2
In this installment of "Designers Notebook," Vern Solberg discusses supplier assessment, planning of the flexible circuit outline, and various circuit routing principles. Communication between designer and fabricator is paramount, as well as an understanding of IPC-2223, which sets the specific requirements for the design of flex circuits.
Electrical Design Challenges for Automotive PCBs
A recent article in this magazine by Monica Andrei of Continental Automotive Systems emphasized the systemic nature of an automobile and discussed the characteristics and adoption of software design tools to enable such system-level design. Recognizing that electrical challenges are part of the automotive system-level discussion, this article will present more detail on signal integrity. Future discussion is planned regarding EMI, power integrity, and thermal integrity.
McCurdy: How to Build a Successful IPC Designers Council Chapter
When Scott McCurdy made his transition from PCB fabrication to a PCB layout focus about 13 years ago, he accepted an invitation to attend our local IPC Designer’s Council. Shortly after, he was recruited to serve on the group’s steering committee. At that time, 20–25 people were regularly attending the meetings. When the chapter president moved, he asked Scott to take his place. Now, Orange County chapter meetings often draw close to 100 attendees.
Orange County IPC Designers Council Meeting Draws Record Crowd
On November 18, the Orange County Chapter of the IPC Designers Council held a “Lunch ‘n’ Learn” event at the Harvard Park Community Center in Irvine, California. Eighty-nine PCB designers and electronics industry professionals gathered to listen to a talk by Chris Heard, a signal integrity engineering consultant at CSH Consulting LLC.
productronica 2015: Ucamco's Integr8tor Incorporates Polar Stack-up Functionality
Big extensions to the capabilities of the Integr8tor client-server work-flow system, way beyond the established CAM functions, now include full product definition covering all production stages of PCB manufacture, including flex and flex-rigid technologies. Integr8tor now incorporates all of the functionality of Polar Instruments’ stack-up design package, instantly accessible.
Polar Instruments Fine-Tunes Layer Stackup Management
Polar Instruments CEO Martyn Gaudion and Technical Editor Pete Starkey discuss Polar’s efforts to simplify specification issues related to the supply chain. Designing PCBs with mixed materials makes layer stackup management more difficult than ever, but Gaudion explains how Polar works closely with materials providers and CAD tool vendors in order to provide users with constantly updated information.
Accelerating the Design Cycle : Moving from Discipline-Centric to Product-Centric Design
Today, the design process in most cases fans out from the requirements as defined by marketing into multiple independent design threads that converge at the prototype. There is usually no systematic method for these different disciplines to communicate their work to the other disciplines. This lack of communication often leads to conflicting design decisions, such as when an electrical engineer or purchaser selects a component without having any way of knowing that it interferes with the enclosure. Extra design turns are often needed to resolve these conflicts at the prototype stage.
Flex Circuit Shielding Design Options
Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.
Automotive Systems Design: a Support Engineer’s Perspective
In a nutshell, the promise of the system design approach is to allow for hitting the “sweet spot” in terms of functionality, quality and reliability, in the shortest possible design time and with the lowest possible resource investments. In an industry that has a very long time to market (on average around 1,000 days), steadily increasing quality demands and an ever intensifying pressure to lower costs, all these promises become most attractive and compelling.
Material Witness: Using Scaled Flow Data
Resin systems whose density is not very near 1.35 do not quite fit into the official IPC test method because all the stack weight data used assumes epoxy resin of a standard 1.35 density. Any resin whose density varies from that value requires a new set of calculated weights for various stack-ups in order to provide precise data. This is especially true of filled systems whose resin density now includes a ceramic component as well as the organic resins themselves and may have densities higher than standard.
Nick Barbin: From Designer to EMS Company Owner
Many PCB designers would rather do just about anything than pore over a P&L spreadsheet. But Nick Barbin isn’t a typical designer. He co-founded the design bureau Optimum Design Associates over two decades ago, and the company later expanded into contract manufacturing and Lean processes. In this interview, Nick discussed how he wound up leading an EMS company on the Inc. 5000 list.
Fast Interconnect: Engineering Services for the Masses
Gary Griffin and Ana Rosique are co-founders of Fast Interconnect, an Arizona-based product engineering company designed to serve an underserved market: the small product developers, inventors, and anyone with an idea for a “cool gadget.” I caught up with Griffin recently to discuss the new company, its innovative business model, and the challenges facing smaller OEMs and product developers.
Avoid Overbuilding your RF Printed Circuit Board
Today, many companies are overbuilding and “overmaterializing” their RF printed circuit boards. In this interview, James Hofer of Accurate Circuit Engineering (ACE) shares some strategies to avoid doing both, which will help lower the total cost of your PCB and improve the overall product quality. Hofer also discusses some of the challenges in the laminate supply chain.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
Polar Talks Impedance Control and Insertion Loss Testing
During IPC APEX EXPO, Guest Editor Dan Feinberg sat down with Polar Instruments product specialists Michael Bode and Geoffrey Hazlett to talk about the company and its products and solutions. They also discussed some of the signal integrity technologies being enabled by the company, including controlled impedance and insertion loss testing.
HDPUG Demonstrates Benefits of Cooperative R&D
The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.
Effective Characteristic Impedance
Reflections can occur anytime there is an impedance mismatch on the line. Sources of mismatches are plentiful and include trace width changes, vias, stubs, reference plane changes, and even the so-called fiber weave effect. In this case, a trace can encounter a different dielectric constant depending on whether it is routed over glass or the epoxy resin in the dielectric material. In this investigation by Kirk Fabbri, it is the capacitive contribution of the different components that are of interest, and how they affect the characteristic impedance the driver sees.
Cadence’s Brad Griffin Digs Deep Into DDR
During DesignCon 2015, our roving reporter, Kelly Dack, stopped by to visit with Brad Griffen in the Cadence booth. What follows is their very interesting conversation that revolves around the evolution of DDR.
Polar Takes on China's Test Equipment Counterfeiters
Recently, while in China, Barry Matties spoke with Jonson Jiang, country manager of Polar Instruments. They discussed the company's latest impedance test equipment offerings and the challenges Polar faces in China, including companies that create counterfeits of their testing equipment. Can legitimate companies rely on China's government to fight counterfeiting?
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