Article Highlights
Communication, Part 6: The Importance of Technology Fit
11/08/2019 | Steve Williams, The Right Approach Consulting LLC
Words of Advice: The OEM Systems Designer
11/07/2019 | Andy Shaughnessy, Design007 Magazine
Why Does the PCB Industry Still Use Gerber?
11/07/2019 | Karel Tavernier, Ucamco
Dugan Karnazes Discusses His New Startup
11/07/2019 | Andy Shaughnessy, Design007 Magazine
Communication, Part 5: Internet Impedance Calculators for Modeling
11/05/2019 | Steve Williams, The Right Approach Consulting LLC
Design :: Education

Latest Articles

Explaining the QSFP-DD Data Center Interconnect Standard

According to Cisco’s report, most IP traffic either originates or terminates in data centers. Yet as massive as the flows between centers are becoming, the data managed within those same facilities is going even higher. All of this activity means that “hyperscale” is the word of the future. Roughly one-quarter of all servers installed in 2016 went to hyperscale facilities, but that number will grow to almost one-half by next year.

Communication, Part 5: Internet Impedance Calculators for Modeling

Bob Chandler of CA Design and Mark Thompson of Prototron Circuits address how new engineers use internet impedance calculators for modeling (e.g., formulas versus recipes) in Part 5 of this series. Do you use impedance calculators that you found on the internet? Read on!

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

So Many Standards Committees, So Little Time

During the IPC Summer Meetings and Panelpalooza in Raleigh, North Carolina, I met with Leo Lambert, vice president and director of technology at EPTAC. We discussed IPC’s recent efforts to revamp the way standards are developed and interpreted as well as changes to training and education committees and a variety of methods for eliminating errors and duplicated comments when revising standards.

Why Designers Need to Be at the SMTA Additive Electronics Conference

In a recent interview, Kelly Dack and Tara Dunn (Omni PCB president and conference co-chair) discussed why designers need to attend the SMTA Additive Electronics Conference. Tara will also be attending and moderating a panel discussion at the conference.

Happy Holden Previews His AltiumLive Frankfurt Keynote

I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.

Words of Advice: Starting a New Design

In a recent survey, we asked the following question: What do you think is the most important thing a designer should remember when planning a new PCB design? Here are a few of the answers, edited slightly for clarity.

Bob Martin Brings Maker Attitude to AltiumLive Keynote

Bob Martin is a self-proclaimed “Wizard of Make” and senior staff engineer with Microchip Technology. Next week, this leader of the maker community will be one of the keynote speakers at AltiumLive in San Diego, California. I caught up with Bob and asked him to give us a preview of his presentation.

Words of Advice: What Data Format do you Send Your Assembly Provider?

In a recent survey, we asked the following question: What PCB data format(s) do you send to your PCB assembly supplier? Here are just a few of the answers, edited slightly for clarity.

John Michael Pierobon Discusses His Flex Design Class

If you’re new to flex design, you might want to check out an online course offered by All Flex, a flex fabricator. The course, Designing Flexible Circuits, was created by John Michael Pierobon. I asked John Michael to discuss his flexible circuit design course, and whether online curriculum can ever replace good old-fashioned live instruction.


Words of Advice: First Steps in the Design Process

In a recent survey, we asked the following question: What are the first steps you take in the PCB design process? Here are some of the answers, edited slightly for clarity.

Leo Lambert on Training the Next Generation of Technologists

I sat down for an interview with Leo Lambert, VP of technical director for EPTAC Corporation, during the IPC Summer Meetings in Raleigh, North Carolina. We discussed the company’s growth, including plans to have training centers across different regions of the country to help cut down on students’ travel times, and why training methods must constantly evolve to remain effective.

Design Rule Checks Cut Down Board Respins

PCB designs commonly undergo multiple respins as a result of inconspicuous signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) violations. At an average cost of nearly $28,000 per respin, ensuring that a given design meets its performance, time to market, and cost goals is imperative. To help eliminate complicated and difficult-to-diagnose layout violations, some PCB tool suites offer unique electrical design rule checks (DRC).

Words of Advice: What are Your Biggest Design Challenges?

In a recent survey, we asked the following question: What are your biggest design challenges? Here are just a few of the answers, edited slightly for clarity.

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

Robert Feranec: A Lifetime of PCB Design

I recently spoke with Robert Feranec about the upcoming keynote he’ll be giving at AltiumLive in San Diego, California. Robert is a YouTube star and founder of the FEDEVEL Academy. In our interview, he discusses his keynote presentation as well as how he’s helping designers and engineers around the world understand and optimize their PCB design processes.

Words of Advice: Flex Design Problems

In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are just a few of the answers, edited slightly for clarity. Not designing "enough flex to get good at it" is a fairly common refrain.

SimplifyDA’s Floorplanning Tool Optimizes Autorouting

Zen Liao, CEO of Simplify Design Automation, recently spoke with the I-Connect007 editorial team about his company’s high-level floorplanner for autorouting, which allows engineers to pass their ideas along to PCB designers. Zen discusses the floorplanning technology and his marketing strategies as well as the challenge of getting reluctant PCB designers to embrace autorouters.

PCB Design Training: More Critical Than Ever

I interviewed Gary Ferrari of FTG at the IPC High-Reliability Forum and Microvia Summit in Baltimore. Gary is a co-founder of the IPC Designers Council and a longtime advocate for PCB design and PCB designers. We discussed the crucial role that PCB designers play in the entire electronics development process, and how IPC and the Designers Council are helping to educate and inform the next generation of designers.

AltiumLive Q&A With Keynote Speaker Eric Bogatin

It's show season again! The 2019 AltiumLive PCB Design Summit will be here before you know it, taking place October 9-11 in San Diego, California. Teledyne LeCroy’s Eric Bogatin, the “signal integrity evangelist,” will be giving a keynote presentation titled “Breaking Bad: A Downside of Open Source Designs.” Eric gives us a preview of his presentation and discuss some of the biggest design challenges he sees today.


Decoupling Capacitors’ Impact on Power and Signal Integrity

It is crucial for hardware designers to identify the resonant frequency of each element of the PDN on a PCB and its impact on power integrity. A PCB with poor power integrity—such as a higher-than-targeted PDN impedance across the wideband range—results in SSN and a shrunken eye diagram of the signal transmitted by the IC that draws power from the PDN. This article demonstrates the post-layout co-simulation of power and signal integrity.

Words of Advice: Obstacles to Solid Data Hand-off

In a recent survey, we asked the following question: What are the biggest obstacles you face in getting your design to the fabricator? Here are a few of the answers, edited slightly for clarity.

Words of Advice: Your Company’s Design Process

In a recent survey, we asked PCB designers to describe their company’s design process: Is it a rigid workflow they follow to the letter, or a process that allows for their individual techniques? Of course, the comments were illustrative.

Bill Brooks on Teaching PCB Design at Palomar College

Bill Brooks of Nordson ASYMTEK is a long-time PCB designer and one of the first people to teach PCB design courses in a college setting. He recently spoke with the I-Connect007 editorial team about his history in design and his time as a PCB design instructor, the curriculum he developed and taught, and various techniques that might be enacted today to better educate the designers of tomorrow.

Words of Advice: Drawbacks to Your PCB Data Format?

In a recent survey, we asked the following question: What is the biggest drawback to your current PCB data format? Here are a few of the answers, edited slightly for clarity.

Development of Flexible Hybrid Electronics

This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.

The Impact of Inductance on Impedance of Decoupling Capacitors

This article discusses the impact of interconnection inductance on the impedance of the decoupling capacitor, which influences the power integrity of the PCB. The investigation is performed with 3DEM simulation by varying the trace length and height of stitching vias that connect the decoupling capacitor across the power rail and ground.

IPC High-reliability Forum and Microvia Summit Review, Part II

The Microvia Summit on May 16 was a special feature of the 2019 event in Baltimore, since microvia challenges and reliability issues have become of great concern to the PCB manufacturing industry. It provided updates on the work of members of the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee and opportunities to learn about latest developments in methods to reveal and explain the presence of latent defects, identify causes and cures, and be able to consistently and confidently supply reliable products.

26 Meters of Flex!

Barry Matties spoke with Philip Johnston, managing director of Trackwise Designs, about the company’s patented length-unlimited multilayer printed circuits aimed at replacing conventional wire harnesses. Originally created for the aerospace industry, Trackwise has since seen growing interest from a number of different industries. Jake Kelly, managing director and chairman of Viking Test Ltd., also joined the conversation to discuss the importance of having a flexible equipment supplier when dealing with such a unique technology.

IPC High-reliability Forum and Microvia Summit Review, Part I

The IPC High-Reliability Forum and Microvia Summit covered a broad range of topics related to reliability and provided interactive opportunities to share expert knowledge and experience in determining and understanding the causes of failure and selecting the best design rules, materials, processes, and test methods to maximise product reliability.


Words of Advice: Where Do You Get Involved in the Design Process?

In a recent survey, we asked the following question: Where in the process do you typically get involved with a design project? Here are a few of the answers, edited slightly for clarity.

Words of Advice: What are Your Biggest Problems Related to Flex Design?

In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are a few of the answers, edited slightly for clarity.

PCB Reliability: Via Design

When considering the long-term reliability of a PCB, you must take into account any vias on your board. While an invaluable and essential part of board design, vias introduce weaknesses and affect solderability. This article will discuss vias, the potential concerns that are introduced into your board through their implementation, and how to minimize those concerns to acceptable levels.

Identifying Product Board Class and Pre-quote Software

Deciding on the class of the final product will determine what files are needed for fabrication and assembly. It is critical to note that for a product to be built to any class level, it must be designed to that class level from its inception.

Design Is a Pivotal Piece of the Puzzle

As a field applications engineer at TTM Technologies, which has fabrication and manufacturing locations around the world, Julie Ellis sees a wide variety of customer design requirements. In this interview with the I-Connect007 Editorial Team, Julie explains how PCB designers can influence the development of the PCB. She shares a variety of tips and tricks that designers can implement early in the design process to help optimize fabrication and assembly later on and keep small issues from becoming big problems downstream.

Words of Advice: Making Life Easier for Fabrication and Assembly

In a recent survey, we asked the following question: What steps do you take to make the job easier for your fabrication and assembly providers? Here are a few of the answers, edited slightly for clarity.

Design for the Unknown

Our industry loves DFx, also known as the “Design Fors.” As PCB designers, we not only design for manufacturability (DFM) but we design for assembly, reliability, cost, test, and many more factors which we like to lump together as DFx. But now, I think it’s time we embrace a new DFx: Design for the Unknown, or DFU.

Words of Advice: Planning a New Design

In a recent survey, we asked the following question: What do you think is the most important thing a designer should remember when planning a new PCB design? Here are a few of the answers, edited slightly for clarity.

Design Rules Recipe: Solvability, Manufacturability, and Performance

One thing that we’ve noticed lately: Each designer seems to have his or her own way of using PCB design rules. There doesn’t seem to be much agreement about setting or using design rules. So, in this true experts panel, Mike Creeden of San Diego PCB joined Freedom CAD’s Scott McCurdy, Jay Carbone, and Rich Kluever to share their views on PCB design rules.

Wild River, eSilicon, and Samtec Team up for 112-Gbps Test Vehicle

During DesignCon, I sat down for an interview with Tim Horel from eSilicon, Al Neves of Wild River Technology, and Matt Burns from Samtec. They’ve recently teamed up to create a 112-Gbps test vehicle that may be the first of its kind of test fixture.


Freedom CAD Book Excerpt: The Printed Circuit Designer’s Guide to… Executing Complex PCBs

The following is an excerpt from Chapter 5 of "The Printed Circuit Designer’s Guide to… Executing Complex PCBs," written by Scott Miller of Freedom CAD Services.

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

Mentor’s EDA Perspective on Managing Design Rules

I recently spoke with Dave Wiens, product manager, and Mike Santarini, EDA content director of corporate marketing, both of Mentor, a Siemens business, about design rules and constraints, and what their customers want regarding design rules. They explained how EDA companies like Mentor help designers constrain for performance while avoiding over-constraining and increasing the cost of the board and also being manufacturing-aware.

Altium’s Craig Arcuri on Design Rules: Past, Present, and Future

We recently spoke with Altium’s Craig Arcuri about his views on design and manufacturing rules. Craig has experience running both design and manufacturing companies, so he has a fairly circumspect view of constraints from both sides of the product realization process. Craig details some of the challenges with setting and managing hundreds of often divergent design and manufacturing rules, and how both design and manufacturing constraints need to evolve.

Technically Appropriate Material Choices are Key to Design Success

Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. I-Connect007’s Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.

Words of Advice: Your Company’s Design Process

In a recent survey, we asked PCB designers to describe their company’s design process: Is it a rigid workflow they follow to the letter, or a process that allows for their individual techniques? Of course, the comments were illustrative. Only one respondent said, "We just wing it."

Learning to Be More Flexible: Case Studies on Improving FPC Design

As miniaturization requirements force manufacturers to pack more functionality into ever-smaller packages, it becomes more difficult to conform to IPC construction recommendations. Achieving robust FPCs requires frequent, iterative interaction internally among the mechanical, electrical, and PCB design teams, as well as with the fabricators and assemblers. The sooner in the design cycle you can engage the supplier and assembler, the better.

Automation and the Smart Factory: Introduction to Industry 4.0

There’s a lot of talk about automation, but I find that there is very little available on automation planning. This is one of my specialties. I started by studying for an MSEE in control theory, which went well with my bachelor’s degree in chemical engineering because I specialized in process control and IC manufacturing.

Words of Advice: Long Component and Laminate Lead Times

In a recent survey, we asked the following question: What advice do you have regarding the current supply chain issues? Here are just a few of the answers, edited slightly for clarity. One reply really sticks out: "If the end customer is large, use their power."

EM Modeling: The Impact of Copper Ground Pour on Loss and Impedance

This article briefly introduces the general purposes of copper ground pour on printed circuit boards. Subsequently, the impact of copper ground pour on PCB channel loss in terms of insertion loss and impedance in terms of time domain reflectometry (TDR) is studied with electromagnetic modeling using Mentor HyperLynx.


Youth in the Industry Putting Training to Work

At a job fair on campus at George Fox University, Nolan Johnson sat down with Jake Whipple, a computer engineering senior, to discuss the GFU engineering program. This is one of the few engineering programs in the U.S. that gives students experience designing PCBs before they enter the work force.

PCB Designer Survey: Everything Starts With Design

Recently, a variety of technologists who fabricate and assembly PCBs have made the following statement: “Everything starts with design.” We want to get your thoughts on this. What are some of the steps you take early in the design process that can affect your downstream partners? Let us know!

George Fox University: Teaching PCB Design to EE Students

Gary Spivey is director of engineering projects at George Fox University, a Christian college in the Pacific Northwest, and his students learn to design and fabricate a PCB while also giving back to the community. Not surprisingly, these graduates get snapped up quickly. In this wide-ranging interview, Spivey discusses GFU’s engineering curriculum, their cutting-edge lab facilities, and the need to teach students to think critically.

Words of Advice: Flex Design Challenges

In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are just a few of the answers, edited slightly for clarity.

Project MARCH Students’ Exoskeleton Helps Paraplegics Walk Again

Project MARCH student volunteers design and build futuristic exoskeletons that can help paraplegics walk. The students do most of the work themselves, including designing the various PCBs. I saw their latest exoskeleton up close at AltiumLive in Munich, and I had to find out more about this program. Delft Students Martijn van der Marel and Roy Arriens sat down with me to discuss their work on the exoskeleton, including their PCB design experience, and whether they plan to pursue PCB design as a career.

Words of Advice: Obstacles to Getting Designs to Fab

In a recent survey, we asked, "What are the biggest obstacles you face in getting your design to the fabricator?" Here are a few of the responses, edited slightly for clarity.

Nano Dimension Offers Update on Dragonfly 3D Printer a Year After Launch

The Nano Dimension Dragonfly 3D printer arrived in much fanfare a little over a year ago. The company has been selling them to customers around the world, many of whom are using them to print antennas, sensors, and PCBs. At AltiumLive in Munich, I asked Product Manager Robert Even to discuss what they’ve learned in the year since the Dragonfly debuted, and some potential uses for 3D printing technology.

Bert Simonovich on Modeling Copper Roughness

I met with one of our contributors, Bert Simonovich of Lamsim Enterprises, at DesignCon 2019. Bert’s paper on interconnect modeling was nominated as a Best Paper finalist, so I asked him to discuss his paper and some of the challenges that engineers and their customers are facing right now.

Mentor’s Cristian Filip Discusses His Award-winning DesignCon Paper

During DesignCon, I met with Cristian Filip, a senior product architect with Mentor, a Siemens business. Cristian had just received word that his paper had won a DesignCon Best Paper award—his second such award in three years. I asked Cristian to discuss his paper and how this technology can help improve manufacturing yields at high volumes.

EMA: Cadence Moves Simulation Further Up in the Design Cycle

Cadence Design Systems recently integrated more of its Sigrity capabilities into the front end of its PCB design tools. During DesignCon, Chris Banton of EMA Design Automation spoke with me about how this drive for “model-less analysis” benefits the PCB designer who can now access signal and power integrity, DFM, and electrical rule checking functionality early in the design process and have fewer issues later.


Electromagnetic Analysis Design Insight: Effects of Meshed Reference Planes on Interconnects

Most of the transmission lines in PCB or packaging interconnects have so-called quasi-TEM waves with the electric and magnetic fields mostly perpendicular or transverse to the propagation direction. Parameters of such transmission lines can be accurately approximated with the analysis of a single cross-section in a 2D field solver. With the cutouts in the reference plane, the waves become non-TEM and not even quasi-TEM due to the presence of the longitudinal components in the electric and magnetic fields.

Todd Westerhoff Discusses His New Position and Much More

At DesignCon, I met with our old friend Todd Westerhoff, a veteran signal integrity engineer. Todd joined Mentor, a Siemens Business, since we last spoke. We discussed his new job responsibilities, his drive to get more designers and engineers to use SI tools, and the increasing value of cost-reduced design techniques versus overdesigning PCBs.

Words of Advice: Component Shortages in 2019

In a recent survey, we asked the following question: What components do you expect to be in short supply in 2019? Here are just a few of the answers, edited slightly for clarity.

RTW IPC APEX EXPO 2019: Judy Warner on Altium's Transformative Vision

During IPC APEX EXPO, Guest Editor Kelly Dack sat down for an interview with Judy Warner, Altium's director of community engagement. They discussed Altium's efforts to educate PCB designers, regardless of their CAD tools, and the company's plan to transform the industry by bringing together PCB design and manufacturing.

Carl Schattke on Stackup Design and Managing the Component Shortage

At AltiumLive, I met Carl Schattke, CID+, a lead PCB designer with an American automaker. Carl and TTM’s Julie Ellis taught a packed class on good stackup practices complete with plenty of slides showing examples of all kinds of stackups. After class, Carl explained why the stackup is often the root of manufacturing problems downstream, and why today’s discrete component shortages are likely to be around for quite some time.

Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program

At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.

Words of Advice: What Concerns you About the Future?

In a recent survey, we asked the following question: What concerns do you have about the future? Here are just a few of the answers, edited slightly for clarity.

Casper van Doorne Discusses His AltiumLive Class, IoT, and More

What’s in a name? When PCB designer Casper van Doorne needed to choose a name for his service bureau, only one name would do—Doofenshmirtz Evil Incorporated, a villainous name familiar to fans of Walt Disney. At AltiumLive Munich, I spoke with Casper about his company, the class he presented in Munich, and some of the benefits and ramifications of the growth of IoT.

Natasha Baker: Supply Chain Transparency Inside the CAD Tool

Natasha Baker, CEO and founder of SnapEDA, an online parts library, discusses the benefits of transparency in online libraries to designers, and discusses strategies on how to solve supply chain challenges, and more.

RTW IPC APEX EXPO: Rogers' Anthony Mattingly Discusses the Advanced Laminate Market

Rogers Corporation's Senior Product Manager Anthony Mattingly and Editor Pete Starkey discuss the ever-evolving market for advanced laminates for technologies such as 5G. Mattingly explains how Rogers has invested heavily in infrastructure for adding about 40% more capacity in the next few years.


A Drone's-eye View of the IPC APEX EXPO Show Floor

If you couldn't make it to IPC APEX EXPO in San Diego, don't worry. We have full coverage of this annual must-attend event, from the opening ceremony to the close of the final day. To get a sense of the size of this year's show, check out our drone's-eye view of the show floor. Can we name our drone Air007?

TUM Hyperloop Team Learns PCB Design on Way to Setting World Speed Record

At AltiumLive Munich, I met with Tobias Bobrzik, a Technical University of Munich student and member of the TUM Hyperloop team. In 2018, the TUM Hyperloop team’s prototype pod set the world speed record of 290 miles per hour, which lead to their meeting with Musk. Tobias designed some of the PCBs used in that vehicle, so I asked him to tell us more about this experience, and what he hopes to do after graduation.

Words of Advice: Flex Design and Manufacturing Training

In a recent survey, we asked the following question: Where do your technologists acquire training or expertise regarding flexible circuits? Here are just a few of the answers, edited slightly for clarity.

Joe Clark Discusses DownStream’s Updated Tool Lineup and IPC-2581

DownStream Technologies recently revamped their entire product line, from CAM350 through BluePrint-PCB. DownStream co-founder Joseph Clark and Guest Editor Kelly Dack discuss some of these updates, including a new GUI and capabilities such as 3D analysis, as well as news about IPC-2581.

The Designers Council: A Chapter Primer From the Ground Up

Thinking it might be a way to make new contacts with PCB designers in Orange County, I attended a couple of Designers Council meetings. The chapter president at that time was Paul Fleming, who asked me to be part of his steering committee because he learned that I had spent decades in fabrication. Within a few months, he had gotten a job transfer to Arizona, so he twisted my arm to take over as the chapter president. I agreed, but little did I know that this would become a major turning point in my PCB career.

Words of Advice: Flex Design Problems

In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are just a few of the answers, edited slightly for clarity. How many of you would agree that "educating the customer" is your biggest challenge?

AltiumLive Munich: Day 2 Keynotes

Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.

The Sun Rises on IPC APEX EXPO 2019

It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.

AltiumLive Munich: Day 1 Keynotes

The weather forecast was wrong! Despite my apprehension and winter clothes, there was very little snow at the Hilton Munich Airport. It could have been any season of the year inside the splendid convention facility, which was also the venue for the second European AltiumLive design summit. AltiumLive brought together a family of over 220 electronics engineers and designers eager to learn from top industry experts and applications specialists who were equally eager to share their knowledge and experience freely.

Words of Advice: Advice for Systems Designers

In a recent Design007 survey, we asked the following question: What advice would you give an OEM system designer? Here are just a few of the replies, slightly edited for clarity.


STEM: The Future of Our Industry

Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.

CES 2019 Showstoppers, the Show Floor, and Some Neat Stuff

CES 2019 is over, and those of us who spent four to five days trying to see and hear as much as possible are in recovery mode. There were over 182,000 attendees, and 6,600 of us were media all trying to get to as much of the 2.9-million-square-feet exhibit space as possible.

The Quest for Perfect Design Data Packages

There’s an ongoing problem in the PCB industry: fabrication shops are receiving incomplete or inadequate design data packages, leaving manufacturers scrambling to fill in the blanks. For a quick-turn prototype shop like Washington-based Prototron, with over 5,000 customers and up to 60% of orders coming from new customers each month, that can add up to a lot of wasted time and effort just in the quoting stage. Dave Ryder, Prototron president, and Mark Thompson, engineering support, delve into this continuing issue and more.

Altium Prepares for Munich Show as Growth Continues

It’s been just two months since the AltiumLive event drew several hundred designers to San Diego, California, and Altium is already gearing up for the next show in Munich, Germany (January 15–17, 2019). I recently spoke with Chris Donato, VP of global sales for Altium, about the upcoming AltiumLive show as well as the company’s growth over the past few years.

January 2019 Issue of Design007 Magazine Available Now

The component shortage is getting crazy. Some PCB designers are finding their favorite capacitors on 50-week and 80-week lead times, or worse. How do you design a board today when the components you need won’t be available for a year or more? In the January 2019 issue of Design007 Magazine, we asked our expert contributors to explain the current component shortage, as well as some of the workarounds that can help you get your next design out the door sooner rather than later.

A Fractal Conversation with Jim Howard and Greg Lucas

Veteran PCB technologists Jim Howard and Greg Lucas have made an interesting discovery: Certain shapes of copper planes make a PCB run more efficiently than other shapes, a process they dubbed fractal design. It doesn’t appear to cost a penny more, and testing suggests that fractal design techniques could eliminate edge noise. Barry Matties and Andy Shaughnessy asked Jim and Greg to discuss the fractal design process, and the advantages of using this technique.

Words of Advice: Streamlining Your Design Process

In a recent Design007 Survey, we asked the following question: What would help you streamline your design process? Here are just a few of the answers, edited slightly for clarity.

Rainer Beerhalter Discusses His AltiumLive Munich Presentation

Rainer Beerhalter is a physicist, and according to his design bureau’s website, “founder, owner, and mastermind” of B GMBH. Rainer attended the first AltiumLive in Munich in 2017, and he’s returning to this year’s event in Munich January 15–17. I asked him to tell us about the class he’ll be teaching in Munich, and why he decided to come back for the sophomore AltiumLive show.

Dan Beeker on His AltiumLive Munich Keynote and Battle With the Status Quo

Dan Beeker, senior principal engineer with NXP Semiconductors, was one of the speakers at the first AltiumLive event in San Diego in 2017. Now, he returns to AltiumLive 2019 in Munich from January 15–17 with a keynote titled, “It’s All About the Space.” Here, he discusses his keynote, which focuses on the need for designers to understand the behavior of electromagnetic fields, and why the status quo for advanced PCB design must change from, “We are going to fail,” to, “We are going to pass.”

Susy Webb: The History and Future of the Designers Council

When we started planning this issue on the IPC Designers Council, I knew I’d have to speak with design instructor Susy Webb, a longtime DC member and currently an executive board officer. I asked Susy to discuss how she first got involved with the DC, why designers should join their local chapter, and what the future holds for this group.


Calculation of Frequency-Dependent Effective Roughness Dielectric Parameters for Copper Foil Using Equivalent Capacitance Models

Knowledge of the correct parameters of laminate PCB dielectrics refined from any copper foil roughness impact and the proper foil roughness characterization are important constituents of modeling high-speed digital electronics designs.

Effects of PCB Fiber Weave on High-Speed Signal Integrity

This article studies the effect of PCB fiber weave on signal integrity in terms of mode conversion and differential channel loss due to intra-pair skew. The study used Keysight ADS 2DEM simulation to observe s-parameter (i.e., insertion loss and differential to common-mode conversion) and an eye diagram for signal transmission at 1 Gbps and 10 Gbps.

Randy Burcham Discusses New Techniques for BOM, Daughterboards

During AltiumLive, I spoke with IOTA Engineering's Randy Burcham, who taught several classes during the event. He explained his methodology for filtering BOM data as well as his new approach to working with daughterboards and how he was up and running on Altium tools after only three days.

The Readers Speak: The Design Data Format Survey

If you’re or designer or a design engineer, the odds are good that you have a few things to say regarding design data formats. We want to hear from you! Your participation in this design data survey would be much appreciated. We know that your time is valuable, and you’re getting ready for the holidays, so we’ve kept it short and sweet.

Martin Cotton’s Parting Shot

Martin Cotton is a unique personality in the PCB industry. As Cotton says, “I’m a designer—look at my haircut!” Cotton gave the keynote at the Institute of Circuit Technology’s 2018 Harrogate Seminar, challenging his audience to consider laminate dielectric properties in the context of power and cost in a presentation entitled 'The Effect of the Dk of a PCB Laminate on the Cost-effectiveness of Office Rental Space. Intrigued?' Read on!

Embedded Inductors with Laser Machined Gap

The power magnetics are often the largest and most expensive devices in the circuit. Integrating them into either a power converter module or system board can significantly reduce size and cost of the power converter function. This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure.

Mentor Discusses New DFT, DFM, and Design Verification Tools

At electronica 2018, John McMillan, digital marketing program manager-Electronic Board Systems, and Mark Laing, business development manager-Valor Division of Mentor, a Siemens business, discuss new tools for PCB design verification, as well as design for manufacturing (DFM) and design for testing (DFT).

Rick Almeida Discusses DownStream's Latest News

At the 2018 electronica exhibition in Munich, Rick Almeida, founder of DownStream Technologies, brings Editor Pete Starkey up to speed with the company’s latest news.

Martyn Gaudion on Signal Integrity Modelling and Stackup Tools

The accuracy of signal integrity modelling continues to improve, and stackup tools are becoming widely used, which now include material suppliers' datasheet information. During the recent electronica show in Munich, Germany, Martyn Gaudion, managing director at Polar Instruments, explained how Polar often serves as a bridge between PCB design and fabrication, and why educating his customers is so critical.

Words of Advice: Fabricator Feedback?

In a recent Design007 Survey, we asked the following question: What is the most important feedback that you receive after your board is manufactured? Here are just a few of the answers, edited slightly for clarity.


New Designers Council Column: The Digital Layout

The IPC Designers Council is launching a new column in Design007 Magazine: “The Digital Layout.” I recently asked two IPC Designers Council (DC) Executive Board members, Mike Creeden and Stephen Chavez, to discuss the content and objective of their new column, and how this all ties in with the DC.

Impact of Serpentine Routing on Multi-gigabit Signal Transmission

Serpentine is a technique to minimize skew or misalignment of differential pairs. The number of segments and intra-pair spacing of serpentining impacts the high-speed signal transmission. As the intra-pair gap is enlarged for serpentining, the characteristic impedance of the PCB trace in differential mode will rise. This leads to impedance discontinuity, signal reflection, and ultimately, attenuation. The signal attenuation is heavily dependent on the number of segments and intra-pair spacing of the serpentine.

Achieving Minimal Crosstalk in Multi-board Interconnect

In an electronic system, the signal transmission exists in a closed-loop form. The forward current propagates from transmitter to receiver through the signal trace. On the other hand, for a single PCB, the return current travels backward from receiver to transmitter through the ground plane closest to the signal trace. Meanwhile, for multi-board interconnect (e.g., connectivity through flex or ribbon cable), the return current travels back to the transmitter through the ground or return wire, preferably as close as possible to the signal wire. The path of forward current and return current forms a loop inductance.

PCB Carolina 2018 Draws a Crowd of Technologists

PCB Carolina 2018, the one-day tabletop show based in Raleigh, North Carolina, drew quite a crowd to the McKimmon Conference and Training Center at NC State University on November 7. Show managers Tony Cosentino, Randy Faucette, and Lance Olive (all employees of the Better Boards service bureau) said that this year’s event showed signs of growth compared to the 2017 show, which was also larger than the previous year. They estimated that about 1,000 people attended this year, and they expect another increase in attendance in 2019.

Max Seeley’s PCB Design Career is No Fish Story

Max Seeley, senior electrical, PCB, and manufacturing engineer with 3M, was an instructor at the first AltiumLive event in 2017, and he made a return visit to this year’s event in San Diego. I asked Max why he decided to come back to AltiumLive this year and to share the story of his rather circuitous journey into PCB design, which included a turn as a custom aquarium builder. Everyone in PCB design has a different backstory.

Amway Sells Beauty Products—and Designs its Own PCBs

During AltiumLive in San Diego, I met Dugan M. Karnazes, an associate electrical engineer and PCB designer at Amway. The company is famous for selling nutritional supplements and soap, but apparently Amway has been busy diversifying over the years. I was interested in finding out more about Amway’s electronics development. Dugan sat down with me to discuss his role at Amway, and how this company grew into an $8 billion global giant.

Altium Designer Increasingly Used for High-Speed Design

I recently met with Mark Forbes, the director of technical marketing at Altium, during the AltiumLive event in San Diego. We discussed Mark’s class on MCAD/ECAD collaboration and the success of AltiumLive, as well as the growth of Altium users who design high-speed PCBs with Altium Designer.

Catching up With Scott McCurdy and Freedom CAD

During PCB West, Scott McCurdy of Freedom CAD Services sat down with Technical Editor Tim Haag for an interview. We discussed Freedom CAD’s latest news, some trends in PCB design software tools, and the continuing need to draw more young people into a career in PCB design.

Rick Hartley is Bullish on PCB Design, 3D Printing

At the recent PCB West in Silicon Valley, Consulting Technical Editor Tim Haag met with long-time design industry veteran Rick Hartley to discuss the changing landscape of circuit board design, the layout designers of the future, and how designers can benefit from 3D printing of circuit boards.

One-Question Survey, Part 2: What Advice Would You Offer a New Designer?

During AltiumLive 2018, the I-Connect007 editorial team asked some of the attendees to answer one question: What advice would you offer to a brand-new PCB designer? Here are just a few of the replies we received.


Leo Lambert Discusses IPC Training Program Updates

During SMTA International, EPTAC Technical Director Leo Lambert and Managing Editor Nolan Johnson discuss a variety of recent IPC educational program updates, many of which are designed to smooth out the training process. Lambert also explains how these changes will allow EPTAC instructors to optimize the way they present IPC classes, which include the CID and CID+.

Simon Fried: Additive Manufacturing Through Printed Electronics

Simon Fried, president of Nano Dimension, discusses how the company has taken the additive manufacturing process to the next level through printed electronics. He also shares his thoughts on the growing demand for 3D circuits, as well as how this could potentially be a game-changer for PCB designers.

Artificial Intelligence: The Future of EDA?

Artificial intelligence (AI) has been making inroads into a variety of industries in the past decade or so, from automobiles to medical devices. Naturally, EDA tool companies are taking a look at AI. Does AI offer a way forward for PCB design tool developers? I recently interviewed Paul Musto, director of marketing for the Board Systems Division of Mentor. We discussed Mentor’s plans for integrating AI into EDA tools, and why we may be at the very beginning of understanding the pros and cons of this new technology.

One-Question Survey: What Advice Would You Offer a New Designer?

During AltiumLive 2018, the I-Connect007 editorial team asked some of the attendees to answer one question: What advice would you offer to a brand-new PCB designer? Here are just a few of the replies we received.

Institute of Circuit Technology Hayling Island Seminar

After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.

AltiumLive 2018 a Mecca for PCB Designers

AltiumLive 2018 San Diego is now in the history books. This is the second annual AltiumLive (North America), and it was even better than the first. With nearly 300 hundred participants, from all parts of the country and industry, the event was a huge success.

AltiumLive to Feature Altium Designer 19 Release

This week, Altium Designer 19 will be officially launched to the public during AltiumLive, which takes place October 3-5 in San Diego. I asked Altium COO Ted Pawela to give us a preview of Altium Designer 19, and to explain how AD19 fits in with the company’s long-term plans. He also discusses Altium Live’s plan to provide PCB design content that is not vendor-specific to help support the entire industry, not just customers.

Lee Ritchey Returns to AltiumLive with 32 Gbps Design Class

Lee Ritchey was one of the instructors for last year’s inaugural AltiumLive event, which drew hundreds of PCB designers. Now, Lee is back, teaching a high-speed design class at next week’s AltiumLive in San Diego. That class is sold-out, but you can catch Lee teaching the same class at the January AltiumLive event in Germany. I asked Lee to explain what he plans to cover in this course, and why PCB designers and design engineers should consider attending one of the events.

Judy Warner: AltiumLive’s Second Year to Be Even Better Than First

Last year, Altium launched its AltiumLive event with shows in San Diego and Munich, Germany. This year, the event has expanded to include an extra day of classes. Altium is gearing up for the San Diego event in early October and the German show in January 2019. I recent spoke with Judy Warner, director of community engagement for Altium, about what designers should expect at both shows, and how the company can build on the success of the 2017 events going into the future.

PCB Design Challenges: A Package Designer’s Perspective

The challenges faced by the PCB designers of today are significant. If we examine the breadth of designs, we find ever-increasing data rates and more high-speed signal routing that drive additional challenges meeting signal-quality requirements, including reflection signal loss and crosstalk issues. At the same time, designers are being asked to complete designs in shorter cycle times and in smaller form factors. They must come up with new and more complex routing strategies to better control impedance and crosstalk. Manual implementation is often time-consuming and prone to layout errors.


Managing the Challenges of Flex and Rigid-Flex Design

PCB designers working with flex or rigid-flex technology face many potential risks that can derail a project and cause costly design failures. As the name implies, flex and rigid-flex designs comprise a combination of rigid and flexible board technologies made up of multiple layers of flexible circuit substrates, attached internally and/or externally to one or more rigid boards. These combinations provide flexibility for the PCB designer working on dense designs that require a specific form factor. Rigid-flex allows the PCB design team to cost-efficiently apply greater functionality to a smaller volume of space, while providing the mechanical stability required by most applications.

Chuck Bauer Discusses the Future of Packaging

When we decided to cover the future of PCB packaging, we knew we would have to interview Charles Bauer, Ph.D., owner of TechLead Corporation. Chuck recently spoke with Happy Holden, Andy Shaughnessy and Barry Matties about current trends in packaging, the need for product designers and manufacturers to communicate, and why no matter how cool the technology is, cost is still king.

The Impact of PCB Dielectric Thickness on Signal Crosstalk

Crosstalk is an unintentional electromagnetic (EM) field coupling between transmission lines on a PCB. This phenomenon becomes a major culprit in signal integrity (SI), contributing to the rise of bit error occurrence in data communications and electromagnetic interference (EMI). With the existence of mutual inductance and capacitance between two adjacent transmission lines on a PCB, crosstalk has become more severe due to the shorter signal rise/fall times at today’s higher data speed rates.

Mentor Preparing for Next-Gen PCB Designers

Millennials are the future of our industry. What does this mean for the PCB design community? How do we attract more of these smart young people to the world of PCB design? I asked Paul Musto, director of marketing for Mentor’s Board Systems Division, to explain the company’s initiatives aimed at drawing more young people into PCB design

In With the New at Cadence

The next generation of PCB designers is coming—slowly, but surely. What will this new group of designers mean for EDA vendors like Cadence Design Systems? Andy Shaughnessy recently interviewed Dan Fernsebner, product marketing group director and a veteran EDA guy, and Bryan LaPointe, lead product engineer and representative of the younger generation. They discussed the next generation of PCB designers, some of the best ways to draw smart young people into this industry, and why the PCB designers of the future may need to have a college degree just to get an interview.

Help Wanted: PCB Design Layout Specialist

I was told recently that the designer, aka the PCB layout specialist, is a dying breed soon to be extinct. I wish to reassure my fellow designers that, in my opinion, you are in the catbird seat. You are in hot demand and you should have great opportunities for the remainder of your career. By the way, after reading this article, you may feel empowered to go ask for a raise. Please don’t tell your manager that I sent you!

Multi-board Design with Altium’s Ben Jordan

Not too long ago, historically speaking, most electronic products contained only one PCB. But multi-board designs have become almost ubiquitous over the past decade, and EDA software companies are working to improve and simplify the multi-board design process. Editors Andy Shaughnessy and Stephen Las Marias spoke with Ben Jordan, director of product and persona marketing for Altium, about the company’s multi-board design tools, the challenges that customers face, and the numerous trade-offs that designers must contend with while performing multi-board design.

CPCA 2018 Seminar Overview

I had the good fortune to speak at a seminar sponsored by the CPCA and organized by the China Team of I-Connect007 in Shanghai. This full-day seminar was on one of today’s hot topics, “Automation in PCB Manufacturing.”

3D Convergence of Multiboard PCB and IC Packaging Design

A new generation of 3D multiboard product-level design tools offer major improvements by managing multiboard placement in both 2D and 3D, and enabling co-design of the chip, package and board in a single environment. Multiboard design makes it possible to create and validate a design with any combination of system-on-chips (SOCs), packages, and PCBs as a complete system.

Achieving Optimum Signal Integrity During Layer Transition on High-Speed PCBs

In electronic systems, signal transmission exists in a closed-loop form. The forward current propagates from transmitter to receiver through the signal trace. Meanwhile, the return current travels backward from receiver to transmitter through the power or ground plane directly underneath the signal trace that serves as the reference or return path. The path of forward current and return current forms a loop inductance. It is important to route the high-speed signal on a continuous reference plane so that the return current can propagate on the desired path beneath the signal trace.


Sensible Design: Protecting PCBs from Harsh, Challenging Environments

Think very carefully about the sort of environment your PCB is likely to encounter. It is easy to over-engineer a product so that it will survive the very worst of conditions, but worst conditions may only be fleeting or transient. Therefore, a resin solution with a lower temperature performance specification will often cope. Take temperature extremes, for example. Your application may experience occasional temperature spikes of up to 180°C, which you might feel deserves treatment with a special resin.

Paving the Way for 400Gb Ethernet and 5G

This article briefly introduces the 4-level pulse amplitude modulation (PAM-4) and its application in 400 Gigabit Ethernet (400GbE), to support the booming data traffic volume in conjunction with the deployment of 5G mobile communications. Furthermore, this article also highlights the essential pre-layout effort from signal integrity perspective for physical (PHY) link design on a PCB, including material selection, transmission line design and channel simulation to support 56Gbps data rate that paves the way for seamless communication in 400GbE.

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.

Faster Board Speeds Demand Constraint-Driven Design

Using powerful constraint techniques can be a double-edged sword. While the design process is made much safer by including constraints, it is all too easy to over-constrain the design and make it impossible to complete routing and placement. Even paper design guidelines can make products uneconomic to produce unless a great deal of engineering knowledge is applied during the design.

Field Trip: CID Class Sees How Flex is Made at Streamline Circuits

While I was teaching my CID class for EPTAC in Santa Clara, I learned that we were only a block away from Streamline Circuits. Streamline does a lot of military and aerospace work, as well as communications and industrial electronics. The company manufactures quite a bit of multilayer flex and rigid-flex circuits, in addition to rigid boards. This would make a great field trip for my CID class!

Design and Manufacturing Perspectives from DISH Technology’s Les Beller

I recently interviewed Les Beller, a long-time PCB designer who is now a manufacturing engineer for DISH Technology. We discussed his company’s business shift towards 5G and streaming, and the stresses that puts on a design team. He also explains the greatest challenges that he’s facing with HDI and higher frequencies, and the added importance for designers to understand the manufacturing process and DFM tools.

ITEQ Ready for Autonomous and Electric Vehicles of the Future

During DesignCon 2018, I spoke with Tarun Amla, the executive vice president and CTO of ITEQ. We discussed ITEQ’s future plans, including the development of materials for cutting-edge technology needs, such as autonomous and electric vehicles, as well as 5G technology.

Geeking Out at Geek-A-Palooza MSP 2018

Kiersten Rohde, I-Connect007 editor, covers Geek-A-Palooza MSP 2018. Geek-A-Palooza "is a different kind of gathering that combines networking with a fun, relaxing atmosphere." This event provided an opportunity for local electronics geeks from every industry segment to gather for a professional social event that included great music, food, drinks, games, raffle prizes, and booths.

American Standard Circuits Discusses New RF/Microwave eBook

During DesignCon 2018, I met with Anaya Vardya and John Bushie of American Standard Circuits. Anaya and John recently co-wrote an eBook, published by I-Connect007, titled "The Printed Circuit Designer’s Guide to Fundamentals of RF/Microwave PCBs." We discussed their goals and the scope of this handy microbook, which features plenty of information that even high-speed digital designers can benefit from.

Interview: Incoming and Outgoing Presidents of Polar Instruments

Polar Instruments has hired some talented technologists recently, including a new president, Dorine Gurney. At DesignCon, I had the opportunity to sit down for an interview with Dorine and Ken Taylor, Polar’s outgoing president. We talked about Dorine’s objectives for the company and Ken’s plans for life after Polar.


Porsche Engineering…by Design

Thomas Wischnack of Porsche Engineering is currently designing the high-power charging infrastructure that will go inside the next generation of automobiles. Thomas was a keynote speaker at AltiumLive 2017 in Munich, Germany. Barry Matties met with him to learn more about Porsche’s hardware and circuit development and what Porsche does to continually bring new designers into the fold.

Estonia a Hot Spot for New Technology

Most Westerners know very little about Estonia. A former Soviet Bloc country, Estonia has come a long way since restoring its independence in 1991. Electronics companies are thriving in this tiny EU member country, and capital city Tallinn has been called “Silicon Valley on the Baltic Sea.” During productronica, I met with Arno Kolk, general manager of the Estonian Electronics Industries Association, and we discussed the explosion of new technology in this “Baltic Tiger” country?

Fadi Deek Discusses Mentor’s New Power Integrity eBook

At DesignCon 2018, I ran into Mentor’s Fadi Deek, the author of both of Mentor’s I-Connect007 eBooks: the newest, "The Printed Circuit Designer’s Guide to Power Integrity by Example," and their first book, "The Printed Circuit Designer’s Guide to Signal Integrity by Example." We sat down and discussed how the idea for the books came about, as well as some of the power integrity challenges facing PCB designers and engineers.

Martin Cotton Discusses Ventec’s New Book and Low-Loss Materials

During DesignCon 2018, Andy Shaughnessy sat down for an interview with Martin Cotton, director of OEM projects for Ventec. Martin was a PCB designer for years, so he has experience on both sides of the desk. They discussed Ventec’s reasons for coming to DesignCon, their expansion into low-loss materials, and Ventec’s new I-Connect007 book, The Printed Circuit Designer’s Guide to Thermal Management with Insulated Metal Substrates.

Mentor’s HyperLynx Automates SERDES Channel Design

Mentor recently released the newest version of its HyperLynx signal integrity software. This version may be the first SI tool in the industry to fully automate SERDES design channel validation. I spoke recently with Chuck Ferry, product marketing manager with Mentor, about the new HyperLynx and some of the new serial link design capabilities that customers have been demanding.

Julie Ellis: TTM’s Interface Between Designer and Fabricator

As a field application engineer for TTM, Julie Ellis sees the problems that can occur between circuit board designers and manufacturers. Barry Matties spoke with Julie at the AltiumLive event in Munich about the age-old problem of throwing designs “over the wall,” the trend towards HDI, and what advice she would give new designers.

Cadence’s Sigrity Automates Power Integrity Simulation Earlier in Design Cycle

DesignCon is always a great place to check out the latest PCB layout and simulation software tools. During DesignCon 2018, Guest Editor Kelly Dack met with Sam Chitwood, a product engineer with Cadence. Sam explained how the Cadence Sigrity simulation software now allows users to make decisions early in the design process, and how this can help optimize the design of the power delivery network and ensure signal integrity in complex PCBs.

Worldwide Systems Consulting: Tools, Process, People

In Munich for productronica, Editor Andy Shaughnessy and Publisher Barry Matties sat down with Mentor’s Jay Gorajia, director of worldwide systems consulting. Gorajia discussed Mentor’s systems consulting business, their focus on the “digital twin,” and how their acquisition by Siemens is benefitting Mentor and their customers.

Bridging the Customer-Supplier Gap

For the February issue of Design007 Magazine, we interviewed Nolan Johnson of Sunstone Circuits, and Dan Beaulieu of DB Management—our regular columnist—on the topics of knowing your customers, the challenges in dealing with customers, and providing excellent customer satisfaction.

MakeHarvard 2018: The Super Bowl of Makeathons

The inaugural MakeHarvard event was everything one would expect from the title, and more. Sunstone Circuits’ Nolan Johnson and Dustin Jablonski served as both mentors and competition judges. Sunstone sponsored a prize for the best feats of reverse engineering and documentation. Sunstone’s reverse engineering competition was one of the most hotly contested. Judging was based on creativity, depth, technical difficulty, usability, scalability, and value to society.


Still Using 1980s Formats for Design Data Handoff?

The IPC-2581 format was created in the early 2000s with the merger of two competing formats: ODB++ and GENCAM. The new format, the brainchild of the late Dieter Bergman, languished with no adoption until 2011, when a small group of companies created the IPC-2581 Consortium with the goal of getting this open, neutral and intelligent format adopted. The consortium has been growing steadily in recent years. Its membership now includes more than 100 associate members in addition to its more than 90 corporate members.

RTW IPC APEX EXPO: Valor Tool Benefits from Merging Mentor, Siemens Technologies

Oren Manor, director of business development, discusses the convergence of the electrical and mechanical discplines made possible through Mentor's merger with Siemens. Manor also explains how Mentor's Valor platform now utilizes Siemens' "digital twin" concept.

Barry Katz Discusses SiSoft's DesignCon Papers and Plans for 2018

SiSoft President and CTO Barry Katz sat down with Editor Andy Shaughnessy to share his thoughts on the company's papers presented during DesignCon 2018, as well as SiSoft's latest products and plans for 2018.

Frontline's InStack Viewer Helps Designers and Fabricators

Ben Quarles, software solultions business manager at Frontline, and Editor Andy Shaughnessy discuss the new InStack Viewer, which allows PCB designers and fabricators to investigate impedances, material properties, and other attributes of the correct stackup.

Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1

We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.

Real Time with... DesignCon: Mentor Partners with Sintecs on EU Project

During DesignCon 2018, Guest Editor Kelly Dack interviewed Sintecs' CEO Evert Pap and system architect Hans Klos in the Mentor booth. Sintecs used Mentor's software tools to design the dReDBox, a virtual prototype project funded by the European Union.

Entering—and Enjoying—the Industry

I was recently given the opportunity to write an article for our publication. Being somewhat new to this industry, I figured it would be a good idea to write an introduction on how I got into electronics—specifically the part most people my age don’t give thought to.

Who Really Owns the PCB Layout? Part 2

In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.

EMA Cloud Lined with Capability

Editor Kelly Dack speaks with EMA Design Automation Marketing Manager Chris Banton about the company's new free cloud-based OrCAD schematic capture tool, OrCAD's design constraint manager, and the Sigrity electrical rule checker.

Rogers Continues Expansion into High-Speed Digital Materials

Mahyar Vahabzadeh discusses a paper presented by his colleague Dr. Allen Horn at DesignCon. He also explains some of the different characteristics Rogers has discovered as they move from RF into high-speed digital materials.


APCT’s Cartel Acquisition Adds Capacity, Technology and Certifications

APCT recently acquired Cartel Electronics and its affiliate, flex and rigid-flex maker Cirtech. During DesignCon 2018, I spoke with APCT President and CEO Steve Robinson about what this acquisition means for the San Jose-based fabricator.

Mentor Focusing on Power and Signal Integrity

Chuck Ferry is a product marketing manager at Mentor, and SI/PI product architect for HyperLynx tools. I spoke with Chuck recently during DesignCon 2018, and he shared some of his thoughts on the industry and Mentor’s plans for this year and beyond.

A Conversation with Dorine Gurney, New President of Polar Instruments

Dorine Gurney has recently been named president of Polar Instruments. With a 30-year resume that includes management positions at Mentor Graphics, Lattice Semiconductor and Tektronix, she takes the reins as Ken Taylor heads into retirement. I recently caught up with Dorine at DesignCon 2018 in Santa Clara, California.

Fully Automated Schematic Verification

Schematic verification is a part of the hardware engineer’s responsibility just as PCB layout verification is an accepted part of the PCB designer’s responsibility. However, with today’s circuit designs becoming more and more complex, time-consuming manual schematic verification is no longer an option. Manual verification of a complex circuit introduces significant risk by not identifying schematic design errors that are, in turn, passed to the downstream processes and ultimately to the fabricated board.

What’s New in EDA: The Experts Discussion

We wanted to find out what’s new in the world of EDA. Joining us on our experts conference call were Polar Instruments Managing Director Martyn Gaudion, DownStream Technologies founder Rick Almeida, and Director of Product Management Mark Hepburn and Product Management Group Director of Allegro Enterprise Products Hemant Shah, both with Cadence Design Systems. The group discussed the challenges and opportunities they see in our industry, as well as the need to bring new blood into the PCB design community.

Thermal Management Update with Doug Brooks

I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.

Mike Jouppi Discusses his Drive for Better Thermal Data

If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.

Streamlining Thermal Design of PCBs

When designing a PCB, thermal issues are often locked in at the point of selecting and laying out the chip package for the board. After that, only remedial actions are possible if the components are running too hot. Assumptions made about the uniformity of the airflow in these early design stages can mean a disaster for the commercial viability of a PCB if those assumptions are incorrect. A different approach is needed to improve reliability and to optimize board performance. Dr. John Parry of Mentor explains.

IEEE’s Romanian SIITME Show a Success

The 23rd annual IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) was held in Constanta, Romania, in October 2017. It attracted more than 190 participants from Romania, and 13 other counties. While there might be some who question the suitability of Romania as a venue for such a conference, the country has a long technological history and has produced some top innovators and pioneers in aviation including Aurel Vlaicu, Traian Vuia, Henri Coanda, who prototyped an early jet aircraft in 1910.

Mentor White Paper: Characteristic vs. Instantaneous Impedance

Successful signal integrity analysis depends on a fundamental concept: impedance. Without a thorough understanding of the impedance values that a signal encounters along the way, designers cannot maintain good signal quality from source to receiver.


The Impact of HDI on PCB Power Distribution

A key aspect of HDI technology is the use of microvias. For reference, the IPC HDI Design Committee has identified microvias as any hole equal to or less than 150 microns. Multiple types of HDI stack-ups associated with blind and buried microvias can be used to meet the density and cost requirements for today’s products. Design teams should develop stack-ups in conjunction with the fabricator to minimize cost and meet signal integrity requirements.

Heat Transfer and Thermal Conductivity: The Facts

In my first two columns, I presented a broad introduction to the subject of thermal management of electronic circuits. This month I’m taking a closer look at thermal interface materials—how they can be applied to achieve efficient heat transfer, and the significance of bulk thermal conductivity in relation to heat transfer and thermal resistance.

HDI PCBs: Make the Right Choice from Design to Volume

Modern electronic products are expected to offer evermore advanced functions, while the products themselves are becoming increasingly smaller. There are two key factors for the successful production of HDI PCBs: first, making the right choices at the design stage, and then carefully choosing the factory that can support the specific technical demands of the project. NCAB Group COO Chris Nutall explains.

Three Perspectives for HDI Design and Manufacturing Success

Mike Creeden has been in the PCB design industry for more than 40 years now. In June 2003, he founded San Diego PCB Inc., a design bureau serving a variety of industries, including industrial, automotive electronics, medical diagnostics, internet of things (IoT), defense, aerospace, and communications markets. So, we asked Creeden to share his insights about HDI, and how designers and manufacturers can address those issues.

Who Really Owns the PCB Layout?

In order to understand the current climate, we have to look at the division of labor that took place in electronic design about 40 years ago. The labor was divided into two processes, with the first being the design itself. This process was (and still is) owned by the electrical engineers. Though circuit design has changed, the methods for representing the circuit have not. Paul Taubman of Nine Dot Connects explains.

Lee Ritchey On the Future of PCB Design

I spoke with long-time PCB design instructor and Right the First Time author Lee Ritchey during the recent AltiumLive event in Germany. Lee and I discussed everything from the advice he offers to young PCB designers to his thoughts on where the industry is going and what’s missing from today’s electrical engineering curriculum.

Cannonballs, eBooks, and Signal Integrity

I-Connect007 editors Andy Shaughnessy and Pete Starkey recently met with Polar Instruments Managing Director Martyn Gaudion at productronica. They discussed the success of "The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs," the ongoing challenge of facilitating communication between designers and fabricators, and the influence of chemical bond-enhancement processes on insertion loss.

Bay Area Circuits Updates InstantDFM Tool

Bay Area Circuits is on a quest to help PCB designers and design engineers. For the past few years, the company has been holding facility tours and open house events to help designers understand more about the fabrication process. Now, Bay Area Circuits has upgraded its free design tool, InstantDFM.com, which allows customers and non-customers alike to check manufacturability and request pricing of their jobs. At PCB West, Andy Shaughnessy spoke with President Stephen Garcia and COO Brian Paper about the new tool update, and some of the other services they offer for PCB designers.

Zuken Teams With Nano Dimension for 3D Printing Design Flow

At PCB West, Zuken shared a booth with Nano Dimension. Zuken has been working with Nano Dimension for some time, and adding support for 3D printing and nanotechnology to its design tool platforms. I sat down with Zuken’s Humair Mandavia and Nano Dimension’s Simon Fried to learn more about this alliance, and to find out more about this odd-looking box being demonstrated in Zuken’s booth.

Video from productronica 2017: Karel Tavernier on Ucamco's New Communic8tor

European Editor Pete Starkey and Ucamco Managing Director Karel Tavernier discuss Ucamco’s cloud-based Communic8tor platform which facilitates two-way communication between the CAM engineer and the PCB designer, or any other party involved in the manufacturing process. This gives real-time access to image data and annotations, enabling queries to be resolved, changes to be approved, and a full communications history to be maintained.


Signal Integrity: The Experts Weigh In

When we began planning the October issue on signal integrity, we arranged a conference call with a variety of industry experts. Mike Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries joined editors Andy Shaughnessy, Patty Goldman, Happy Holden and Publisher Barry Matties on the call for a spirited discussion about the challenges related to signal integrity and some of the tricks of the trade for helping ensure SI.

Happy Holden and Charles Pfeil Discuss the Past and Future of PCB Design, Part 2

In Part 2 of this feature interview, I continue my conversation with industry icons Happy Holden and Charles Pfeil at the recent AltiumLive 2017 event in San Diego. In this half of the interview, we discuss the potential for artificial intelligence in EDA software tools, the graying of the designer pool, and what can be done to draw more young people to PCB design.

AltiumLive Summit—Munich, Germany, Part 2

Pete Starkey continues with his review of the AltiumLive PCB Design Summit held recently in Munich, Germany. The second day commenced with a new product launch. “Working together is hard” it read on the screen. Statistics indicated that 33% of new products were late getting to market, of which 28% were late due to insufficient collaboration, and up to 50% of potential revenue could be lost through being late to market. Then the screen read “NEXUS makes it easy!”

Nine Dot Connects: Good Design Instruction is a True Value-Add

Nine Dot Connects has certainly blazed an interesting trail. The company started out as an Altium reseller, but in less than a decade, Nine Dot Connects has also become a design service bureau and a provider of PCB design instruction, training, and consulting services. I recently interviewed Paul Taubman, technical services director for Nine Dot Connects. We discussed the company’s expansion from VAR to service bureau and content provider, and the changing landscape of PCB design instruction.

AltiumLive Summit—Munich, Germany, Part 1

Altium held a very successful AltiumLive PCB Design Summit in San Diego, California at the beginning of October for the benefit of their North American design community, and followed it three weeks later with a counterpart European event in Munich. And what an eye-opener it proved to be—literally hundreds of delegates, a superbly organised and managed programme, billed as a completely immersive two-day interactive design experience on a theme of learning, connecting and getting inspired.

Happy Holden and Charles Pfeil Discuss the Past and Future of PCB Design, Part 1

When it comes to the PCB design community and the challenges facing it, as well as where design has been and where it’s heading, there aren’t many people as qualified to speak on the topic as long-time industry veterans Happy Holden and Charles Pfeil. Joined by I-Connect007’s Barry Matties at the recent AltiumLive 2017 event in San Diego, the three sat down for a discussion about the current state of PCB design, what the future holds, and what it means to be a designer.

Insulectro Teams with Isola to Address Signal Integrity Needs

Insulectro and Isola recently shared a combined booth during PCB West 2017. Insulectro has distributed Isola materials for years, and the companies wanted to focus on Isola’s line-up of high-speed, low-loss material sets. Insulectro’s Chris Hunrath, VP of Technology, and Norm Berry, Director of Laminates and OEM Marketing, sat down with me to discuss the challenges facing signal integrity engineers today, and some of the Isola low-loss, low-Dk materials that can help with their signal integrity requirements. You might find Chris and Norm speaking to a group of PCB designers near you.

The History of Predictive Engineering

It all started in 1983, at HP, when I complained to our group's vice president that our W. Edwards Deming and Total Quality Management (TQM) Six Sigma training was being concentrated in PCB manufacturing. We had eliminated final inspection and instead placed quality in the hands of the operators with a final electrical test. The electrical test was governed by what we learned from Deming.

Carl Schattke: I Started Designing Boards When I Was 12

Growing up with a father who owned a PCB design bureau, Carl Schattke, CID+, may have been predestined to design circuit boards for a living. In fact, he’s been designing boards for nearly his entire life. Carl gave a keynote speech at the recent AltiumLive event in San Diego, where I caught up with him to discuss a lifetime spent in PCB design, as well as the graying of the PCB design community and what might be done to inspire a youth movement in PCB design.

GCSI's James Kozich Discusses Industry Hiring Trends

James Kozich of Gilbert Consulting Services has been matching qualified technologists with the right jobs for decades, from the shop floor to C suite positions. During SMTA International, he sat down with Andy Shaughnessy to discuss the recent hiring trends he's seeing in electronics manufacturing.


Meet One of the Industry’s Newest PCB Designers

Molly Knewtson is a recent graduate now working for a pharmaceutical company as a mechanical engineer. She was asked if she would consider learning PCB design and taking on some design projects. She agreed, though she had never considered circuit design as a career path. I sat down with Molly at PCB West to learn how she came to this position and what might be done to inspire more people from her generation to join the industry.

Polar Instruments’ Martyn Gaudion Discusses Tools and Books

Polar Instruments has pretty been busy lately. In the last year, Managing Director Martyn Gaudion has written two books for I-Connect007, and the company has been working to upgrade its tools, especially library functionality. I met with Martyn at PCB West. We discussed Polar’s newest tool updates, Martyn’s new side job as an author of technical books, and the continuing growth of the EDA segment, including among young people.

Dan Beeker’s AltiumLive Keynote: It's All about the Space

Dan Beeker of NXP Semiconductors was a keynote speaker at the recent AltiumLive 2017 event in San Diego. His presentation focused primarily on the design of three-dimensional structures and how it’s all about space. I caught up with Dan, and we discussed his presentation, his background and career, and what kind of advice he would give to young PCB designers.

PCB Signal Integrity Optimization Using X-ray Metrology

It happens again. A new backbone router/switch build or a line card upgrade is approaching completion when something goes wrong. The system won’t operate at the targeted data rate. Deadlines are looming and the root cause of the problem is buried somewhere in a big rack of electronic components.

Full Coverage of AltiumLive 2017

Altium recently conducted its first-ever users conference, AltiumLive 2017: Annual PCB Design Summit, at the Hilton Resort and Spa in San Diego. Speakers included Dan Beeker of NXP Semiconductors, Max Seeley of 3M Corporate R&D, Tara Dunn of OMNI PCB, Susy Webb of Fairfield Nodal, Charles Pfeil of Altium, and our own Happy Holden. This conference drew hundreds of PCB designers, and included a robot design challenge and battle. If you couldn’t make it, don’t worry. We shot a variety of video and still photos.

Predictive Engineering: Happy Holden Discusses True DFM

Happy Holden has been involved in DFM for over 45 years, since he first started working at HP and optimized their PCB design and manufacturing processes. Naturally, for this issue, Barry Matties and Andy Shaughnessy made it a priority to get Happy’s thoughts on DFM, and what true DFM entails.

It’s Not Your Father’s DFM Anymore

What does DFM look like today? Well, for one, it’s become more than DFM. We now expect our software tools to serve us more completely to take new designs to market. DFM has evolved to become an integral part of new product introductions (NPI). Today’s NPI software spans design and manufacturing to accelerate the optimization of a PCB for manufacturing. It looks at the entire design-to-manufacturing release process and deliverables, then streamlines them.

Sensible Design: Thermal Management—The Heat is On

Thermal management materials are designed to prolong equipment life and reduce incidences of failure. They also maintain equipment performance parameters and reduce energy consumption by reducing operating temperatures, and minimising the risk of damage to surrounding components. Indirectly, they maintain brand reputation, as the reliability of the equipment will be very dependent upon the effectiveness of the thermal management technique used.

Fault-Finding: It’s All About Prevention, not Blame

There are thousands of things that can go wrong during the design and manufacture of a PCB assembly. One might say that it is an absolute miracle when a PCB goes through all of its phases—design, fabrication and assembly—and operates successfully. But there are some management and customer cultures who naively attempt to resolve problems by seeking out the culprits and shouting “Off with their heads!”

The International Paris Air Show with ASC’s Anaya Vardya

The International Paris Air show is the crème de la crème of the world’s trade shows. This is the big one, where all the aircraft, airline and defense aerospace companies meet to introduce new products, discuss the future of aviation, and make deals. This year I decided to talk to my friend Anaya Vardya, ASC’s president and CEO, about the show, why he goes and what it’s like.


Resins: Cutting Through the Technical Jargon

This month, I’m going to cut through some of the more heavy-going tech-speak, taking a few of my customers’ more frequently asked questions about resins to try to help you refine your selection process. There’s a lot of ground to cover, but for the purposes of this column, let’s concentrate on the PCB’s operating environment, caring for the components that are to be encapsulated, and the special needs of applications like LED lighting and RF systems.

New Challenges Facing Mil/Aero Segment

For this month's issue, we invited a sampling of professionals whose experience centers on the electronics industry in the military and aerospace world, including experts from design, PCB manufacturing, and the assembly arena to sit down with us for a frank discussion. Our discussion centered on the challenges associated with military work, including the new regulatory requirements for cybersecurity, dealing with leaded vs. lead-free components, and the differences and similarities with the commercial world.

Stephen V. Chavez Talks Mil/Aero PCB Design

Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.

Orange Co. Designers Council Meeting Focuses on Embedded Passives

On July 19, the Orange County Chapter of the IPC Designer’s Council hosted a lunch-and-learn meeting in Tustin to discuss the benefits of embedded passives. Approximately 40 people were in attendance, which was lighter turnout than usual, most likely because of summer vacations. But the crowd was an enthusiastic one, as usual. The first speaker was Bruce Mahler of Ohmega Technologies, followed by Jin Hyun-Hwang of Dupont.

Trilogy Circuits: Mil/Aero Demands Technological, Regulatory Expertise

In the 16 years since its founding, Trilogy Circuits has become one of the go-to companies for mil/aero PCB design and manufacturing. I spoke with Charlie Capers, president and founder of the Richardson, Texas firm, about how he keeps ahead of the game. As he explains, succeeding with mil/aero PCB work requires not only mastery of the technological side, but of the regulations and certifications as well.

Using Vibration and Acceleration Analysis to Improve Reliability

Deriving the physical constraints and fatigue issues for a design prior to manufacturing is essential to reducing board failure and thereby improving product quality. In harsh environments, fatigue can be responsible for up to 20% of failures. Customers have come to expect reliability across the industry spectrum no matter where actual production occurs. Reliable products have less risk of failure, less field returns and less warranty claims, all of which contribute to higher profitability. It is a given that every product is expected to fail at some point, however premature failures can be mitigated through proper design with attention to potential issues due to vibration and acceleration.

PCB Designers Notebook: Embedding Components, Part 2

Technology and processes for embedding capacitor and inductor elements rely on several unique methodologies. Regarding providing capacitor functions, IPC-4821 defines two methodologies for forming capacitor elements within the PCB structure: laminate-based (copper-dielectric-copper) or planar process and non-laminate process using deposited dielectric materials.

Embedded Technology: A Useful Tool in Freedom CAD’s Toolbox

Freedom CAD has been designing and fabricating boards with embedded technology for years, and doing some pretty innovative work along the way. I asked Scott McCurdy, Freedom CAD’s director of sales and marketing, to share some details about their embedded processes, as well as the challenges and opportunities that embedded technology offers.

A Deep Look Into Embedded Technology

In preparation for this month’s magazine, we set up a conference call with the goal of uncovering the challenges and opportunities related to embedded technology. Invited were a handful of the industry’s heavy hitters in the embedded world: Retired technologist and I-Connect007 Contributing Editor Happy Holden, and Ohmega’s Technical Director Daniel Brandler and Design & Test Engineer Manuel Herrera.

Launching a New PCB Design Curriculum in Serbia

Let me share with you an experience that I remember from my college days. When I was a student, I had a professor who was too proud of the fact that she was an academic. “You don’t need to know how to manually solder electrical parts or how to design printed circuit boards,” she lectured. “It is important that you understand the formula for charge carrier currents in a p-n junction.” I started working as an R&D engineer for a Swiss company that developed and manufactured instruments for measuring magnetic fields and electrical currents. And nobody ever asked me about charge carriers in p-n junctions.


Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

Must Work Well on a Team; CID a Bonus

Throughout my decades-long career in PCB design, I have been fortunate. I’ve only had to search for a job out of desperation once. I had no idea my IPC Certified Interconnect Designer credentials would come in handy when I hit the pavement. It also helped that I am known to "work well on a team." It turns out that being able to play well with others is a real plus in the PCB design community.

Sensible Design: Casting a Spotlight on Resin Applications

Over the last few columns, I’ve given readers pointers on virtually every aspect of potting and encapsulation resins, ranging from their formulations and special properties to their applications, benefits and limitations. It’s probably high time, therefore, to take a step back from the do's and don’ts and focus instead on how these resins are bringing very real benefits to practical electronic and electrical engineering applications. A good starting point is to look at the special requirements of an industry that is enjoying explosive growth: LED lighting.

TTM Shines a Light on Optical Interconnect

Are embedded optics on PCBs set to make a breakthrough in the upcoming years? According to Dr. Craig Davidson, VP of Corporate Technology at TTM, it might be closer than you’d expect. In a recent interview with the I-Connect007 team, Craig outlines TTM’s current pursuit of high-volume manufacturing lines able to deliver embedded optical interconnect, what that would mean for the PCB industry, and why he thinks there will be manufacturing production capability by 2020.

'Flexdude' Tom Woznicki Celebrates Company’s 25th Anniversary

Twenty-five years ago, Tom “Flexdude” Woznicki got laid off. A lot of people did, back during the mini-recession that helped bring Bill Clinton into the White House. So, he launched his own flex circuit design bureau and never looked back. Since then, he’s designed flex circuitry for everything under the sun, including the Mars Rover; the flex circuits he designed are visible in many of the Rover photos. I ran into Tom at DesignCon 2017 and we discussed the benefits of flex circuits, the expansion of the flex market, and his company’s first quarter-century in operation.

China High-Speed PCB Market Update with Polar's Simon Chan

During the recent CPCA Show in Shanghai, Editor Stephen Las Marias and Polar Instruments (China) Assistant Manager Simon Chan discussed the opportunities and challenges for Polar's customers in the Asia-Pacific region, as well as the current state of the high-speed PCB market in China.

Perpetual or Subscription EDA Tool Licenses? That is the Question

After I began working at Altium, I started learning all I could about PCB design software licensing. I wondered about the pros and cons of perpetual vs. subscription licenses. I wanted to learn firsthand from PCB designers what kind of benefits they received and challenges they faced as a result of how EDA companies offered design tools. I reached out to a variety of sources to get a broad slice of insight into this evolving issue, and thus began my trip down the EDA licensing software rabbit hole.

Mentor Graphics Takes Best Paper Award at DesignCon

At DesignCon, I met with Dave Kohlmeier, senior product line director for Mentor Graphics. We discussed their Best Paper award and DesignCon sessions such as the Signal Integrity Boot Camp, as well as the new rigid-flex capabilities found in the HypeLynx suite.

A New Power Design Methodology for PCB Designs

Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.


Tom Hausherr Discusses PCB Libraries’ BOM Builder Service

PCB Libraries CEO Tom Hausherr and Editor Kelly Dack discuss PCB Libraries’ new BOM Builder service during IPC APEX EXPO. Equipped with the new LEAP technology, the BOM Builder can potentially save PCB designers days or weeks of time normally spent turning a BOM into a CAD library.

Catching up with Polar Instruments' Geoffrey Hazelett

Product specialist Geoffrey Hazelett discusses some of the latest developments at Polar Instruments, including a new tool that will allow fabricators to determine how copper roughness will affect the end-product. He also talks about Polar's upcoming eBook on signal integrity, soon to be published by I-Connect007. Talented young technologists like Geoffrey are the future of our industry.

Cadence’s Zhen Mu Discusses Her Power-Aware Analysis Solution White Paper

At DesignCon, I met with Zhen Mu, senior principal product engineer with Cadence Design Systems, and Brad Griffin, product marketing director for Cadence. We discussed Zhen’s new white paper, “Power-Aware Analysis Solution.”

Real Time with...IPC: Jim Fuller Offers HDPUG Update

Sanmina's Jim Fuller gives his insight on how the High-Density Packaging User Group (HDPUG) shares the experience and resources of member companies to tackle projects and get results. Also, he reviews the study of the effect of copper bonding treatment on signal integrity

Help Wanted! Our 2017 Industry Hiring Survey

This month we conducted an industry survey on plans for hiring during the year. Included here is a summary of the results. We started by simply asking, “Do you plan to hire additional people this year?” More than half of the respondents answered yes while about a third said no—which we take as an optimistic sign that our industry plans to expand in 2017.

True DFM: Taking Control of Your EDA Tool

We PCB designers are doing some truly great things with our layout tools. But we must remember that these tools are so powerful that they will sometimes allow us to design things that can’t be manufactured! We must collaborate with our fabricator and assembly brethren and embrace the best DFM practices, or face the consequences downstream.

A Handy Compilation of Our Top 10 DFM Articles

When we started working on this DFM issue, I searched through our files and found that we’ve published some great DFM articles over the past year or so. While topics like signal integrity tend to get most of the limelight, in the end it all comes down to solid DFM practices. So, without further ado, we present this compilation of our Top 10 DFM articles and columns.

Flex and Rigid Sales and Marketing with Al Wasserzug

After decades in the PCB industry, Al Wasserzug of Cirexx International has seen marketing and sales trends come and go. I recently caught up with Al and interviewed him via email about the latest sales and marketing techniques, the value of traditional methods such as trade shows and conferences, and the particular characteristics of marketing flex circuits.

Altium’s Sales Plan: Deal Directly with Designers

Altium has been shaking up the EDA world for quite some time. The Australian company once slashed the cost of Altium Designer by 75% to grow market share, and who could forget their famous (or infamous) “Bunny” ad campaign? In this email interview with Lawrence Romine, Altium’s global head of field marketing, he shares his views on sales and marketing in the EDA world, as well as Altium’s philosophy on selling EDA tools.

Sales and Marketing with DownStream Technologies

From its inception, DownStream Technologies has been a new kind of software tool company. DownStream’s post-processing tools address one of the most unpopular parts of the design process: documentation. DownStream's CEO Rick Almeida discusses some of his firm’s marketing and sales methods, the trends that he sees, and the influence of the Internet on marketing.


SiSoft Discusses Signal Integrity Drivers and Challenges

In the last few years, SiSoft has launched a variety of innovative SI tools that help automate tasks that used to take weeks or months to complete. I recently interviewed CEO Barry Katz via email, and he detailed their customers’ challenges, and some of the market drivers in the world of signal integrity.

Sunstone Circuits Makes Shift in Strategy, Offerings

Sunstone Circuits, the Oregon-based online vendor of quickturn circuit boards, has recently made a shift in capabilities that will enable a move into the RF and microwave space. At PCB West, Publisher Barry Matties caught up with Sunstone’s David Warren, and they discussed details of this change and how they plan to approach such a competitive marketplace.

Sensible Design: Why are Resin Properties So Important?

Last month, I started this series of columns on resins by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions. I hope readers found this useful. Of course, when it comes to the choice and applications of resins, there’s a great deal more to discuss.

What’s the Difference Between a Manager and a True Leader?

The role of the manager is complex; it means balancing business needs with creative opportunity and flexibility, building trust and providing inspiration with a team. With the recruitment of Generation X, and now the millennials, the expectations of employees are changing, accompanied by an unprecedented growth of technology. How can today’s manager maintain an effective and motivated team?

DownStream Technologies: Building the Interface Between Designers and Fabricators

DownStream Technologies founder Rick Almeida speaks with Editor Pete Starkey about building the interface between the PCB designers and fabricators. He gives details on their design software and where most of the design community resides.

Lightning Speed Laminates: The Blending of High-Speed Digital and High-Frequency RF

When the terms high-speed and high-frequency are mentioned, people think they describe the same issue. But in reality, they can be two very different matters. The term high-speed generally refers to digital technology which transfers data at very high rates. But the term high-frequency is typically related to radio frequency (RF), which involves analog signals moving energy at high frequencies.

Mentor Graphics’ PADS Platform Bridges Design and Manufacturing

At PCB West, Barry Matties spoke with Paul Musto about Mentor’s PADS environment and their introduction of scalable software tools to help design better boards, from the enterprise level down to the entry level and hobbyists. They also discussed the evolution of the design process infrastructure in North America vs. Asia, and what design engineers should focus on to increase their value.

The Shaughnessy Report: Leadership vs. Management

Is your manager one of the great ones, a true leader? Many of your colleagues would probably answer with a pointed “No.” In our reader surveys, we ask, “What is your biggest challenge?” Every time we've posed that question, we received replies along the lines of, “Management doesn’t know what the hell they’re doing.” Some replies are too salty to print.

Freedom CAD: Navigating the Unpredictable Design Marketplace

As COO of the design service bureau Freedom CAD, Scott Miller has a front-row seat to the challenges currently plaguing designers and the design community as a whole. He shared his views with me recently, offering insights on the importance of picking the right partners and customer relationships in an unforgiving and sometimes unpredictable design marketplace.

Ventec Europe Celebrates 10 Years as 'Not Just Another Laminate Merchant'

Incorporated in November 2006 as a joint venture known as Global Ventec Laminates, Ventec Europe imported its first container-full of material in May 2007. Now, here we are 10 years on, a bit older and not a lot wiser, in Ventec Europe’s immaculate headquarters facility, still in Leamington Spa, but in smart new premises.


Altium ActiveRoute Debuts at PCB West: Routes Under One Second Per Connection

While at PCB West, Judy Warner had the chance to sit down with Charles Pfeil of Altium and learn more about their exciting new tool, ActiveRoute, that was introduced and demonstrated during PCB West 2016. She also learned a bit of background about Pfeil, who is a living history lesson in PCB design.

SnapEDA: Inspiring Millennials in the PCB Design Community

Natasha Baker, founder of SnapEDA, is part of the new breed of entrepreneurs. She manages a group of millennials who are not much younger than she is. Natasha discusses what it means to be a manager vs. a leader, what motivates millennial engineers, and some of the changes in the world of EDA that managers have to contend with to succeed.

Beyond Design: How to Handle the Dreaded Danglers, Part 2

In Part 1, I deliberated on how dangling via stubs distort signals passing through an interconnect and also decrease the usable bandwidth of the signal. This is due to the via stub acting as a transmission line antenna, which has a resonant frequency determined by the quarter wavelength of the structure. The conventional solution to this problem is to back-drill (or control depth drill) the vias to bore out the via stub barrels, so that the via stubs are reduced in length if not completely removed. This month I will look into all the possible solutions.

Space: Still the Final Frontier

If this doesn’t make you feel like a “seasoned citizen,” I don’t know what will: "Star Trek" first aired 50 years ago, on Sept. 8, 1966. No one—not even the actors—thought the show would last, and it only ran for three seasons, drawing average ratings. But Captain Kirk and company are more popular than ever on their Golden Anniversary.

Flexdude Abides: PCB Design for Satellites

Tom Woznicki, aka “Flexdude,” has focused primarily on flex circuit design since he founded Flex Circuit Design Co. in the 1990s, and he designed flex circuits for the Mars rover. But recently, Tom designed rigid PCBs for the TESS satellite. I asked Tom to discuss his work with TESS, and what it’s like switching between flexible and rigid PCBs.

The Fundamentals of Improving PCB Thermal Design

Continental's automobile engineers have years of experience building critical parts and systems for automobiles. Making sure that automotive electronics are reliable, safe, and properly designed begins at the component level. Heat must be addressed early in the design process for these goals to be achieved. The most important thermal resistance for heat, outside the IC package, is the PCB.

Quiet Power: Evaluating Evaluation Boards

Evaluation boards are very helpful. Manufacturers of complex circuits such as DC-DC converters provide boards with those circuits ready to try out, saving us time and effort to design the printed circuit board around them. Evaluation boards are supposed to help us to understand the capabilities of the device. But with the many potential user applications, what should a particular user expect and look for in an evaluation board? We need to know how to properly evaluate an evaluation board.

John Cardone on Designing Flex for Spacecraft

If you watched footage of the Mars rover driving all over the red planet, you’re familiar with some of John Cardone’s handiwork. He’s been designing rigid, flex, and rigid-flex circuitry for spacecraft since he joined JPL in the early ‘80s, and he’s worked on some of the more ground-breaking flex circuits along the way. Now John runs his own design service bureau, JMC Design Services, and he continues to design circuitry for things that blast off. I caught up with John recently and asked him to give us the straight scoop on designing boards for spacecraft.

Mike Creeden: Care and Training of Your Designers

The I-Connect007 team recently visited San Diego PCB Inc. and received a warm welcome from CEO Mike Creeden and his youthful-looking (relatively speaking) team of designers. Creeden spoke with Barry Matties and Judy Warner about what it takes to run a successful design service center, how to properly care for the PCB designers of today and tomorrow, and why IPC’s design training is paramount when training a new designer.

Sensible Design: Conformal Coatings - Beware the Boards that ‘Bare’ All!

This month, Phil Kinner departs from his usual format of providing five essential facts about conformal coatings. Instead, he provides an account of a customer’s problem—no company names mentioned, of course—that brought into question the adhesion performance of a coating that they had been using successfully for some time.


Beyond Design: How to Handle the Dreaded Danglers, Part 1

Dangling via stubs can distort signals and decrease the usable bandwidth of the signal. A via stub acts as a transmission line antenna, and has a resonant frequency determined by the quarter wavelength of the structure. At this frequency, the transmitted signal is greatly attenuated, by up to 3dB. For low-frequency signals, this is not much of an issue, but for higher-frequency signals, this issue becomes a problem.

The Evolution of Altium: Road to a Record-Breaking Year

Chris Donato, VP of sales for Altium Americas, sat down with Judy Warner recently to discuss what he and Altium have been doing lately, where they came from (Australia) and what the future holds for Altium. This company has evolved from flying well under the radar during the acquisition frenzy of the ‘80s, to achieving a record $100 million in sales for fiscal year 2016.

Orange Co. Designers Council Meeting Draws A Packed House

Speaker John Stine, VP of operations at Summit Interconnect’s Anaheim facility, gave a presentation on flex and rigid-flex design and fabrication. At least 75 electronics professionals listened as Stine, an expert in flex and rigid-flex technologies, discussed proper trace geometries, grounding, cover lay, adhesives, signal integrity, impedance control, book-bindings and much more in his 80-minute presentation.

The Shaughnessy Report: Voices of the Industry

We asked readers like you to share your thoughts about PCB design. Your replies were all over the map. Of course, as journalists, we are drawn to your complaints and challenges—our publications exist to help you address these challenges. And you were not shy about sharing your complaints! Designers’ complaints haven’t changed much since I've been covering this segment.

The Many Voices Over the Past Year

In line with our "Voices of the Industry" theme this month, we're publishing this handy index of all of the interviews we've conducted over the past year with the movers and shakers, managers, entrepreneurs, and and rank-and-file designers and design engineers. In case you missed them, here's another bite of the apple, alphabetized by interviewee's last name. Enjoy!

Lightning Speed Laminates: Smaller Circuits--Material Properties and Thermal Issues

Coefficient of thermal expansion (CTE) is typically considered for PCB reliability, but it can also have an impact on circuit performance for applications exposed to varying temperatures. Due to CTE, a circuit will change physical dimensions when the temperature changes. If the circuit has small features or tightly coupled features, the physical change of the circuit dimensions can cause a shift in electrical performance.

Brooks' Bits: Your Traces Have Hot Spots!

The reasons for the temperature variation at high temperatures are not too hard to understand. There may be minor contamination under the trace or in the copper that accounts for it. Certainly, at higher temperatures (say above about 300°C) the board may begin to delaminate, severely disrupting its cooling characteristics. There may be small variations in trace width or thickness that help account for the delam, and these effects would be randomly distributed along the length of the trace.

Beyond Design: The Rise of the Independent Engineer

With the changing demographics, the old-timers in our industry—the master PCB designers—are about to retire and hand over the exacting job of PCB design to the Gen-X and Ys. These generations, shaped by technology, will tackle the most demanding designs without possessing the experience that we veterans benefit from. And to top it off, these up-and-coming designers will be degreed engineers who have to cope with both design and layout tasks as the specialized PCB designer’s positions are phased out.

New SI Techniques for Large System Performance Tuning

In this DesignCon paper, Donald Telian of SiGuys and Michael Steinberger and Barry Katz of SiSoft describe newly-developed techniques for equalization tuning and discontinuity reduction, offering additional design margin. Cost reductions are also achieved as new signal integrity techniques demonstrate performance parity, removing non-essential re-timers and PCBs layers.

The Gerber Guide, Chapters 15 and 16

Before sending your Gerber files off to your fabricator, you are often advised to check them using a reputable Gerber viewer such as GC-Prevue. This is excellent advice. Note that this involves more than just verifying that the viewer displays your intended image: It is important that you check too that the file is valid.


Software Bytes: Having Fun With Impedance

About a year ago, I was assigned a new project: become an expert in impedance, more or less. I had no idea how much this research would bring out the nerd in me. Even if you don’t typically design controlled-impedance circuit boards, you probably will eventually. Read on!

Mentor Video: Impact of Power Integrity on Temperature

One of the most common outputs from a DC Drop simulation is a current density plot. But how much is too much current density? The answer depends on temperature rise, and requires a PI-thermal co-simulation to properly characterize.

Designing for Profitability: Don’t Over-Materialize

John Bushie, applications engineering manager at American Standard Circuits, spoke with Barry Matties recently about how designers can avoid over-materializing. He also outlined the benefits of designing for profitability.

Getting Signal Integrity Right by Design

As clock frequencies increase and active devices and interconnect traces shrink and are placed ever closer together, signal integrity becomes an increasing challenge. Today, SI is typically addressed late in the design process after the PCB layout has been completed by performing complex and time-consuming 3D extractions and simulations for high-speed lines. But with little attention being paid to SI during the layout process, simulation frequently identifies numerous SI problems.

Beyond Design: Mastering “Black Magic” with Howard Johnson’s Seminars

Dr. Howard Johnson, the world’s foremost authority on signal integrity, has recently released his High-Speed Digital Design (HSDD) Collection. I recently reviewed all three of the seminars in this collection, a total of 36 hours of viewing time. If you want to gain some of Dr. Johnson's enthusiasm and master the art of high-speed design, then the collection is a must-have.

Making Digital and Analog “Play Nice” at Peavey

Most guitarists have owned a Peavey Electronics amplifier or instrument at some point in their lives. Peavey originally drew accolades for their line-up of high-quality, budget-friendly products. Now the company also develops high-end instruments, amps, and live sound equipment. Peavey was also the last major American musical equipment maker to have product manufactured overseas. I met with Tom Stuckman, an electrical engineer at Peavey, during NAMM and asked him about the technical challenges he faces and what it’s like working at Peavey.

Designing With Tighter Tolerances

David Ledger-Thomas is a PCB design engineer with Honeywell Aerospace. He’s spent decades designing PCBs for a variety of applications, including defense, aerospace, computers, and high-performance audio. I asked David to share some of his thoughts on designing high-tech boards with increasingly finer spaces, traces and pitch.

Lightning Speed Laminates: The Dilemma--Soldermask for High-Frequency PCBs

Typically, PCBs with RF traces on the outer layers have minimal or no soldermask in the RF circuitry areas. Many times the soldermask is applied in areas where components are soldered to the PCB but the soldermask is developed away in the areas where conductors have critical RF performance. There are many reasons to avoid soldermask coverage on RF conductors, due to inherent soldermask properties.

Designing with Fine Lines and Features

Albert Gaines is the owner and senior PCB designer at HiGain Design Services in Norcross, Georgia. He’s been a PCB designer since 1981; he's designed a variety of boards in that time. I asked Albert to talk about some of the finer lines and features that come through his shop, as well as some design techniques for boards with tight tolerances.

Taylor Guitars Protected with Analog, RF Circuitry

Trenton Blizzard is an electrical engineer at Taylor Guitars and part of the team that developed the TaylorSense shock and climate change protection system. At the NAMM show, Trenton spoke with me, along with Editors Dick Crowe and Dan Feinberg, about this new device, and what it’s like being an electrical engineer for a “woodworking shop.”


From the CAM Shop: Tight Tolerance Design Tips

After you finish your design, it winds up in the hands of people like Mark Thompson, the man who runs the CAM department at Prototron Circuits in Redmond, Washington. He sees CAD data firsthand, and often has to address errors and inconsistencies in PCB designs. For this issue, we asked Mark to discuss the today’s tight tolerances, some of the problems they can cause PCB designers, and what designers can do when dealing with shrinking features.

The State of the Electronic Design Automation Nation

We are the automation nation. We are the high-speed demons, the low-frequency artists, the mixed-signal designers that make up the electronic design automation industry. We spend most of our working lives behind software, delivered to our fingertips with the promise of making things easier, faster, better, and getting us to our deadlines ever faster.

Sensible Design: Coatings—Five Essentials for Designers

In an ideal world, PCB designs would not have an inherent weak point for corrosion; unfortunately, in the real world, they do. When a weak point is revealed, you are better equipped to deal with it. Often the spacing of components, board finish and distance to ground planes can be optimised for corrosion resistance.

Beyond Design: The Case for Artificial Intelligence in EDA Tools

There has been a lot of activity in the field of artificial intelligence recently, with such developments as voice recognition, unmanned autonomous vehicles and data mining to list a few. But how could AI possibly influence the PCB design process? This month, Barry Olney will take a look at the endless possibilities.

Rogers’ John Coonrod on Insertion Loss

John Coonrod of Rogers Corporation gave a keynote presentation at the recent Geek-A-Palooza trade show, concentrating on printed circuit board fabrication’s influences on insertion loss. I sat down with John to learn more about his presentation and what OEMs and designers need to be aware of to avoid insertion loss.

Tim’s Takeaways: The Basics of Hybrid Design, Part 3

The world of hybrid design is growing, and we have lots of hybrid-specific functionality built into our software that helps designers meet and conquer the unique hybrid design requirements that they are faced with. And yet many designers out there (and I used to be one of them) have no idea what is meant when people start talking about hybrid design.

EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry

Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.

Romanian Electronics Industry Celebrates 25th Anniversary of TIE

The high point of the Romanian TIE event was a competition among the students to design and layout a circuit for a specific product meeting to the maximum extent possible a long list of design and product requirements. The students had four hours to deliver a design which was then evaluated by a team comprised of a university instructor and a seasoned industry engineer.

EDA Tools: Automation vs. Control

Stephen V. Chavez, CID+, is currently the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS). He's also a frequent speaker at the IPC APEX EXPO Design Forum. I caught up with Stephen and asked for his thoughts on the EDA tools of today, and whether he’d prefer to have more control vs. more automation.

The Shaughnessy Report: The Designer Roundtable Roundup

Every year, I attend SMTA Atlanta, just across town. You have to love a local trade show. No airlines, no jet lag, and no hotels. It’s a small show; it would fit in a school gymnasium. But for me, the highpoint of SMTA Atlanta is the Designers Roundtable. This year the roundtable had 15 attendees, up from 12 last year. Two of the new attendees were under 35, which surprised all of us "graybeards."


PADS Paper: 10 Things to Know about Thermal Design

As designs get smaller, power densities at all packaging levels increase dramatically. Removing heat is critical to the operation and long-term reliability of electronics, and component temperatures within specification are the universal criteria used to determine the acceptability of a design. This PADS paper discusses 10 things designers need to know about thermal design.

Design Automation Tools, Today and in the Future

Kelly Dack has been designing PCBs for over three decades, at OEMs of all kinds. Now a PCB designer with a Washington state contract manufacturer, Kelly enjoys waxing philosophic about PCB design and design automation in general. I asked Kelly about the direction EDA tools are headed, and whether he’d like to see more control, or more automation in his PCB design tools.

Beyond Design: DDR3/4 Fly-by vs. T-topology Routing

JEDEC introduced fly-by topology in the DDR3 specification for the differential clock, address, command and control signals. The advantage of fly-by topology is that it supports higher-frequency operation, reduces the quantity and length of stubs and consequently improves signal integrity and timing on heavily loaded signals. Fly-by topology also reduces simultaneous switching noise (SSN) by deliberately causing flight-time skew.

Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 6

The designer is generally under pressure to release the documentation and get the flexible circuit into production. There is, however, a great deal at risk. Setting up for medium-to-high volume manufacturing requires significant physical and monetary resources. To avoid potential heat from management, the designer must insist on prototyping the product and a thorough design review prior to release.

Cadence Paper: Automating Inter-Layer In-Design Checks in Rigid-Flex PCBs

Flexible PCBs make it possible to create a variety of products that require small, lightweight form factors. As flexible PCB fabrication technology has matured, new design challenges have emerged. This paper discusses some of the key challenges and introduces a new PCB design approach that enhances productivity through in-design inter-layer checks.

SiSoft: Optimizing the State of the Art

In the 20 years since its founding, SiSoft has been at the forefront of signal integrity analysis tool development. Now, the company is leading the way with a new technology called OptimEye and tools for creating accurate IBIS-AMI models. Todd Westerhoff, VP of semiconductor relations, gives us an update on the company’s newest technologies.

Behind the Scenes: Adcom’s TLA Award-Winning Design

Adcom’s design team placed first in this year’s TLA program, taking the top spot for the category of “Computers, Blade & Servers, Memory Systems.” This board, like most PCBs today, is a complex system designed by a multi-disciplinary team of designers, striving to bring an operational product to the market on schedule.

EMA is Bullish on Data Management

EMA Design Automation has evolved over the years, from a typical Cadence Design Systems VAR to a distributor that functions more like a part of Cadence. During DesignCon, I met with Greg Roberts, director of marketing for EMA, and asked him to discuss the company’s focus on data management tools, and why he’s giving away certain OrCAD tools.

Design Strategies for Success—and Profit

In today’s economic environment, making money on a project is getting more and more challenging. Those years when businesses like mine were practically printing money are long gone. If you are under 30 years old, you probably do not have this point of reference; it’s been one downturn after another for your entire adult life. But for us older folks, times were really good back then. So, what happened? You happened, as well as a million others like you. In other words, the market is a little cramped now and much more competitive, which dilutes our profit per project.

Sunstone Circuits R&D: 3D Printing Great for Prototyping

We’ve been hearing a lot about 3D printing for the past few years. But where does 3D printing fit in with traditional rigid circuit board development? Sunstone Circuits recently completed a project that focused on that very question. Sunstone Product Manager Nolan Johnson explains why 3D printing is a viable option when it comes to jigs and parts of the support infrastructure that are needed when prototyping today’s emerging technologies.


Brooks' Bits: How Many Vias Does It Take To…?

During 2015, I enjoyed a very productive collaboration with Dr. Johannes Adam, from Leimen, Germany. This resulted in several papers, but one in particular is relevant for this column, “Via Currents and Temperatures.” In that paper, we used a simulation tool, thermal risk management, developed by Dr. Adam, to simulate current flowing through a via and then determine the temperature of the via. Read on to find out how our results contradicted conventional wisdom.

Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1

In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.

Beyond Design: The Need for Speed—Strategies for Design Efficiency

Years of experience with one EDA tool obviously develops efficiency, whether the tool be high-end feature-packed or basic entry-level. And one becomes accustomed to the intricacies of all the good and bad features of their PCB design tool. However, there comes a time when one should really consider a change for the better to incorporate the latest methodologies. This month, I will look at productivity issues that impede the PCB design process.

Tim's Takeaways: The Principles of Hybrid Design, Part 1

What exactly is a hybrid design? We are seeing more and more of our customers exploring the world of hybrid design, and we are getting new customers for whom hybrid design is their sole focus. The world of hybrid design is growing and we have lots of hybrid-specific functionality built into our software that helps designers conquer the unique hybrid design requirements.

Wild River: Simplifying SI so Engineers Can Focus on Design

Al Neves is founder and chief technologist of Wild River Technology, and he’s a signal integrity engineer who likes to tell it like it is. So when I bumped into Al during DesignCon, I asked him to sit down for an interview. We discussed the paper he co-wrote for DesignCon and the challenges SI engineers are facing, as well as Wild River’s efforts to take the black magic out of signal integrity.

RTW IPC APEX EXPO: HDP Users Group Update with Jack Fisher

Jack Fisher, technical director for the High-Density Packaging Group, discusses the latest projects that the consortium is focusing on. He explains that member companies have full access to all of the R&D data that is developed. One of the group's most interesting current efforts involves optoelectronics.

RTW IPC APEX EXPO: Geek-A-Palooza Coming to S. California May 12

Steve Williams sits down with Geek-A-Palooza founders Tara Dunn and Judy Warner to discuss their upcoming event in Irvine, California on May 12. The Geek-A-Palooza held in Minneapolis last year drew over 300 PCB designers, fabricators, assemblers and suppliers. Tara and Judy explain why this is not just another boring technical talk, and attendees will definitely enjoy themselves.

Steinberger Talks PAM4, the Next Generation of Modulation

I recently interviewed our old friend Michael Steinberger, SiSoft’s lead architect for serial channel products. Steinberger is always a great interview; he breaks down complex signal integrity simulation technology in ways that are simple and often humorous. Steinberger sat down and discussed a paper he presented at DesignCon, and some of the challenges his customers are facing.

What’s New at Cadence?

Cadence Design Systems has released a variety of PCB design tools lately, and we wanted to find out a little more about what’s new at Cadence. I tracked down Product Marketing Director Brad Griffin and asked him to discuss some of the newest technology coming out of Cadence.

IPC APEX EXPO: New Arlon Materials Address Design and Fab Challenges

Brad Foster, VP and general manager of Arlon, discusses some new laminates and pre-pregs that help designers and fabricators address a variety of challenges. He explains how Arlon works with customers to help them with stack-ups and other issues.


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