Article Highlights
Just Ask Happy: Resin-Filled Vias, Without Voids
07/09/2020 | I-Connect007 Editorial Team
Just Ask Happy: Integrating Design Processes With IEEE HIR
07/08/2020 | I-Connect007 Editorial Team
Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps
07/07/2020 | Andy Shaughnessy, Design007 Magazine
Just Ask Happy: Calculating Trace Temps in a Vacuum
07/07/2020 | I-Connect007 Editorial Team
Just Ask Happy: Mechanically Drilled Blind and Buried Vias
07/06/2020 | I-Connect007 Editorial Team
Design :: Associations

Latest Articles

I-Connect007 Leadership Survey: Valuable Lessons From Grandma

The I-Connect007 research team has been surveying readers on the topic of leadership as part of our ongoing planning for upcoming issues. As this response illustrates, great examples of leadership can be found everywhere—provided we're paying attention.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The common theme in this week’s Top 5 editor’s picks is “change.” We’re talking change in the form of forwarding process, achieving milestones, evolving, and improving metrics. This week’s picks are not only newsworthy but also captured reader attention based on metrics. If you haven’t read any other news items from the industry this week, I propose these five must-reads.

Just Ask Happy: Resin-Filled Vias, Without Voids

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

This Month in Design007 Magazine: When Working Remotely, Cybersecurity Is a Necessity

When we started planning this issue on working remotely, we knew we’d have to speak with Stephen V. Chavez, chairman of the Printed Circuit Engineering Association (PCEA). We recently asked Steph to discuss some of the security measures that his company employs and what his experience has been like since he began working out of his Arizona home office full-time several months ago.

Just Ask Happy: Integrating Design Processes With IEEE HIR

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Understanding MIL-PRF-31032, Part 1

Over the course of this series, Anaya Vardya will discuss topics such as MIL-PRF-31032 requirements, the quality plan, responsibilities of the Technical Review Board (TRB), and the testing and reporting requirements for the certified shop into the DLA.

Chris Hanson: New Ventec IMS Dielectrics Rated for Higher Temps

Andy Shaughnessy recently spoke with Chris Hanson, global head of IMS Technology for Ventec International Group. During their conversation, Chris discusses his group’s recent efforts to create new IMS materials, with a focus on dielectrics. As Chris explains, Ventec has developed several new dielectrics that can withstand much higher operating temperatures, one of which is UL-rated for a maximum operating temp of 155°C, which may be the highest for an IMS dielectric.

Just Ask Happy: Calculating Trace Temps in a Vacuum

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: Mechanically Drilled Blind and Buried Vias

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The USMCA trade agreement was just the tip of the iceberg in news affecting our industry this week. We also saw more young people getting involved in the industry, an HDP User Group webinar on automotive thermal issues, and more questions for our own Happy Holden—this time, on stacked microvia reliability, or the lack thereof.


Just Ask Happy: Two-Layer Low-Speed PCBs

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Catching Up With Fane Friberg: Supply Chain Management Expert

Dan Beaulieu recently spoke with Fane Friberg, principal at CEPHAS and a supply chain management expert, about how he started his company, as well as current market challenges he sees and what he thinks the future holds for companies—especially post-pandemic.

Materials for Automotive Applications: Thermal Management Issues

For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.

IPC: Shawn DuBravac and Chris Mitchell on USMCA

On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.

Just Ask Happy: PCB Design For EE Undergrads?

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 3

The following is an excerpt from Chapter 3 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Just Ask Happy: Stacked Microvia Reliability Issues

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: The Future of 3D Printing

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

App Notes: What Are They Good For?

There are several schools of thought regarding IC manufacturers’ app notes. We wanted to find out more about this, so we spoke with Geof Lipman, director of operations for part data at Octopart.com, a component data platform acquired by Altium in 2015. Geof shared his thoughts on app notes, datasheets, and the need for due diligence when utilizing any unfamiliar data.

Just Ask Happy: Ground Reference Planes

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Updates on trade shows, conferences, and associations dominated industry news this past week. Some events are returning to a physical venue; others are opting for a virtual version in 2020. Add to that a spate of cross-association cooperative agreements and new programs for career development coming from multiple associations, and you’ve delivered four of my top five picks.

Just Ask Happy: The Future of Mechanical Blind, Buried Vias

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: Routing BGAs With High-Speed Diff Pairs

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Just Ask Happy: The Proper Order of Design Techniques to Improve Connectivity

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between.

Ex Officio: Advice From Designers Who Recently Began Telecommuting

Most PCB designers are now working from home as a result of the COVID-19 lockdown. In a recent Design007 Magazine survey, we asked the following question: What lessons have you learned since you began designing PCBs from home? Here are just a few of the comments, edited slightly for clarity.

Happy Holden Is Taking Your Questions Now

Happy Holden, the industry icon and “Father of HDI,” is ready to answer your questions! What have you always wanted to ask Happy, but never thought you'd have the chance? Now is your chance! Please take a few minutes to jot down your questions for Happy. A select group of answers will be published in upcoming editions of I-Connect007 magazines and newsletters.

Elmatica’s Didrik Bech Accepts Role as IPC Cybersecurity Task Group Vice-Chair

On June 18, Nolan Johnson spoke with Didrik Bech, Elmatica CEO and I-Connect007 columnist, who was recently selected as vice-chair for IPC’s Cybersecurity Task Group. During their conversation, Didrik outlined the task group’s mission statement and the target audience for its work. He also shared specific examples where cybersecurity is increasingly important to the electronics manufacturing industry globally.

Book Excerpt: Producing the Perfect Data Package, Part 2

The following is an excerpt from Chapter 2 of Mark Thompson's I-Connect007 eBook The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package. Mark is in engineering support at Prototron Circuits and a Design007 Magazine columnist.

DownStream Technologies Update With Joe Clark

On June 15, Andy Shaughnessy spoke with Joe Clark, co-founder of DownStream Technologies, about the company’s drive to take care of its customers and employees throughout the pandemic and beyond. As the U.S. slowly starts reopening, Joe discusses some of his customers’ current challenges, especially those working from home for the first time, and how DownStream’s forecast has helped the company prepare for the uncertainties in the industry right now.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 2

The following is an excerpt from the second half of Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.


Letter to the Editor: Rick Hartley Offers Addendum on App Notes

In the June 2020 issue of Design007 Magazine, the I-Connect007 editorial team interviewed design instructors Rick Hartley and Dan Beeker regarding their belief that designers should not trust app notes until they've been proven to be accurate. After the issue was published this week, Rick emailed us with a few more points that he wished to contribute to the ongoing app note conversation.

Walt Custer’s EIPC Business Outlook Webinar: ‘You Can’t Sugarcoat This Stuff!’

In normal circumstances, it would have been the time of year for the EIPC Summer Conference, and Walt Custer would have opened the proceedings with his business outlook for the global electronics industry. However, circumstances were far from normal. Pete Starkey discusses some of the takeaways from Custer's global business outlook webinar, organized by EIPC.

Dan Beaulieu, Part 2: Marketing in Uncertain Times

Dan Beaulieu, president of D.B. Management and an I-Connect007 columnist, and Nolan Johnson return for a second conversation on sales and marketing in the current business environment. In this conversation, Nolan asked Dan about the “wait and see” attitude some industry professionals have been leaning on during the second quarter of 2020.

The iNEMI 2019 Roadmap: Optoelectronics

Continuing the series of webinars highlighting recently-published chapters of iNEMI’s 2019 Roadmap—the comprehensive guidebook to the future goals and needs of the electronics manufacturing industry—the installment on optoelectronics examined and discussed data transmission by optical technology. Pete Starkey provides an overview.

The Survey Said: Designers' Tips for Working Remotely

Most PCB designers are now working from home as a result of the COVID-19 lockdown. In a recent Design007 Magazine survey, we asked the following question: What tips do you have for working remotely more successfully?

Where The Jobs Are: The I-Connect007 Help Wanted Pages

If you’re looking for a career in the PCB industry—design, fabrication, or assembly—the I-Connect007 Career Opportunities section, jobconnect007.com, is the first place you should look. Right now, there are job openings for positions that span the entire circuit board supply chain, and you can submit your resume directly to the hiring managers by clicking on the ad.

PCB Builder from Digi-Key Lets Customers Order Directly From Board Shops

On June 2, components distributor Digi-Key Electronics announced the release of PCB Builder, a tool that lets customers have PCBs shipped directly from the fabricator. PCB Builder also allows customers to perform file layer checks and receive instant quotes from multiple fabricators. Andy Shaughnessy spoke with Josh Mickolio, supplier business development manager for Digi-Key, about the development of PCB Builder and what this tool means to PCB designers and design engineers.

Design007 Survey: Show Us Your Workspaces!

Since the COVID-19 lockdown began, more and more PCB designers and design engineers have moved into home offices. In this survey, we ask our designer and design engineer readers to share their thoughts on working from a home office: the dogs, the crying kids, everything. Best of all, we want to see photos of your workspaces!

Book Excerpt: Producing the Perfect Data Package

The following is an excerpt from Chapter 1 of Mark Thompson's I-Connect007 eBook "The Printed Circuit Designer’s Guide to... Producing the Perfect Data Package." Mark is in engineering support at Prototron Circuits and a Design007 columnist.

Joe O’Neil: Green Circuits Running Strong Under Current Social Restrictions

On May 28, Joe O’Neil, CEO of Green Circuits, updated Nolan Johnson on how the company continues to operate during the COVID-19 restrictions. O’Neil reflects on the rapid chain of events this past March when lockdowns were instituted in the San Francisco Bay area. After a brief but rapid shutdown, Green Circuits was back up and in production.


3D Additive Electronics Manufacturing: Are We Nearing an Inflection Point?

Recently, Dan Feinberg was invited to attend a detailed and broadly informative webinar by nScrypt titled “The Strength of 3D-Printed Electronics," which covered the status and advances in the use of 3D printing for electronic device design and manufacture. nScrypt is an Orlando-based company founded in 2002 that focuses on 3D printing. Here’s what Dan learned from each of the speakers.

One Fish, Two Fish, Red Fish, Blue Fish: Same Industry, New Look

Learning a lesson from challenges is one thing, but implementing changes based on those lessons is quite another. I-Connect007 regularly surveys leaders in the electronics industry to bring you important and relevant information that helps you make better decisions. What lessons have you learned during the COVID-19 crisis, and what changes have you made?

A Design Economics Primer

When you start a new design, do you begin tracking costs right away, or do you wait until you have a functioning product before you start looking at the dollars and cents? Chris Young begins cost-aware design before the design cycle has even begun. Andy Shaughnessy and Nolan Johnson recently interviewed Chris, an engineer with The Goebel Company and founder of Young Engineering Services, and asked him to explain his approach to design economics.

IPC’s Shawn Dubravac: COVID-19 Outbreak Accelerates Industry Shifts Already Under Way

On May 19, Barry Matties spoke with Shawn Dubravac, chief economist for IPC. While discussing other topics, Matties asked for Dubravac’s perspective on shifts in the market, who observed that the recessionary trend might be behind us; the markets are already showing recovery. Still, it could take a year or so to fully recover.

IPC's Dr. John Mitchell: Leadership in Times of Crisis

On May 13, Dr. John Mitchell, IPC president and CEO, spoke with Barry Matties and Nolan Johnson in another installment in our series of industry updates. In this interview, Mitchell discussed the challenges of leadership in crisis situations.

Meet Patrick Crawford, I-Connect007 Columnist

Meet Patrick Crawford, one of our newest I-Connect007 columnists! Patrick’s columns will provide updates on IPC Design activities. He is currently the liaison to the Design Community Leadership, the industry leadership group of IPC Design. Patrick and the Design Community Leadership work to develop the IPC Design program as IPC redoubles its efforts to serve the printed board design engineering industry.

The Cost of Inefficient Production of PCB Documentation

The following article is an excerpt from Chapter 5 of the I-Connect007 eBook The Printed Circuit Designer’s Guide to… Documentation, written by Mark Gallant of DownStream Technologies.

Happy Holden's Essential Skills: Online Instruction and Distance Learning

Online courses have become increasingly available and popular. For this to be effective, specific requirements must be met for courses taken or produced over the internet in order to provide the user with a positive experience. Read Happy Holden's updated article from his series on 25 essential skills for engineers.

Freedom CAD’s Expert PCB Design Tips, Part 1

When you’re designing complex PCBs, knowledge truly is power. The more PCB design tips, tricks, and techniques you know, the better your cutting-edge designs will be. With that in mind, we’re bringing you a series of PCB design tips, courtesy of Freedom CAD Services.

Happy’s Smart Factory Protocol Primer

The smart factory concept is built upon data interchange as the foundation. There has been much development in the area of industrial and manufacturing data protocols over the years, stretching back into the 1960s. This article by Happy Holden surveys what are considered the most common protocols in use in the electronics manufacturing industry today, including IPC-CFX/ Hermes, OML, SECS/GEM, and MAPS.


Aurora Circuits’ Chris Kalmus Offers PCBs for Ventilators at No Charge

Electronics manufacturers continue to step up to the plate during these uncertain times. In this interview, Dan Beaulieu speaks with Chris Kalmus, owner of Aurora Circuits in Aurora, Illinois, who announced on April 24 that his company would be offering PCBs for ventilators free of charge.

I-Connect007 Survey Details Concerns About Future of Industry

I-Connect007 continues to monitor the current worldwide economic situation by seeking input from our market leaders. Here’s what we discovered: If you’re feeling the pressure, you’re not alone. In a recent survey, we asked about your primary concerns for the future of our industry. The number one concern (26%) indicated a belief that sales will be affected negatively in the coming months.

MFLEX Increases Growth

Happy Holden recently spoke with Jay Desai of MFLEX about the latest flex work the company has been doing and its aim to transition toward more automation and a smart factory approach.

IPC Europe Shares Technical Education and Standards Awareness

Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.

Koh Young Update With Quintin Armstrong

In this video interview from the show, Quintin Armstrong, Americas service and applications senior manager for Koh Young, updates Guest Editor Dick Crowe on Koh Young America's Technical Services Team, where the focus is on AOI of components and materials on the stuffed board, as well as demonstrations and training at their new facility in Duluth, Georgia.

Flexible Circuit Technologies: ‘We Do it All’

During IPC APEX EXPO 2020 in San Diego, Carey Burkett, VP of Flexible Circuit Technologies, sat down for an interview with Dan Beaulieu. The two discussed the company’s expansive growth, the current flex and rigid-flex landscape, and FCT’s drive to provide complete solutions from rigid and flex circuits through box build.

Dr. John Mitchell: IPC’s Ongoing Efforts Related to COVID-19

On April 14, IPC president and CEO, Dr. John Mitchell, described IPC’s ongoing efforts related to COVID-19 with I-Connect007 Publisher Barry Matties. From a standpoint approximately 30 days into the U.S. shutdown, Mitchell reported that 94% of the executives attending the executive forum are expressing concern. He also outlined many of the chaotic drivers and influences in the industry, including shifting over to different, mandated products; supply shortages; potential declining demand for normal products; and increased shipping costs. Worker and staffing shortages have also become an emerging concern.

Ucamco Harnesses Power of Artificial Intelligence

In this video interview from the show, Luc Maesen, Ucamco director, and Technical Editor Pete Starkey discuss how AI has been applied to help automate the CAM/CAD process, resulting in the company's IamCam system. This platform enables intelligence-aided manufacturing designed to lower costs while achieving fewer errors and faster delivery.

SMTA Europe’s Electronics in Harsh Environments Conference and Exhibition: A Taste of Things to Come

SMTA Europe’s Electronics in Harsh Environments Conference has become a must-attend annual event; unfortunately, it also became another casualty of the COVID-19 lockdown. Scheduled to take place in Amsterdam, the Netherlands, from April 21–23, 2020, it has now been postponed until December 1–3. Pete Starkey reports on a preview seminar presented by SMTA Europe.

Sheldahl: No Plans to Rest on Its Laurels

In this video interview from the show, Enid Kivuti, director of innovation and technology for Sheldahl, and Dan Beaulieu discuss the company's long history as industry pioneers, as well as how they're on the forefront of expanding and pushing the boundaries of flex technology.


This Month in Design007 Magazine: Design Economics With Kelly Dack

Andy Shaughnessy recently spoke with Kelly Dack—CID, CID+, and a PCB designer and instructor who has worked in the design and manufacturing segments over the years. Thanks to his background, Kelly provides an intriguing viewpoint on cost-aware design and the philosophy of design economics in general.

Jan Pedersen Updates on Automotive and Design Standards Progress

In this video interview from the show, IPC Task Group Chair Jan Pedersen comments on some recent successes in the development of the IPC-6012 automotive addendum and progress with its medical counterpart. Pete Starkey and Jan also discuss ways in which digital specification information could be abstracted from IPC-2581 in a readable form for quotation and sales office purposes.

Stencil Cleaning Update With Tom Forsythe

In this video interview from the show, Pete Starkey and Tom Forsythe, executive VP of KYZEN, which celebrated its 30th anniversary, discuss the practicalities of stencil cleaning and describe the characteristics and capabilities of KYZEN's newest versatile stencil cleaning product.

IPC Education Foundation: STEM and Online Learning Resources

Nolan Johnson recently caught up with Charlene Gunter du Plessis, senior director of the IPC Education Foundation, about how the COVID-19 outbreak is affecting the IPCEF, including how they are continuing to connect with IPC Student Chapter members and seek industry support. Charlene also discussed the increased usage of IPCEF’s online educational modules and shares STEM resources.

Panasonic: From Hardware to Solutions and Data

In this video interview from the show, Managing Editor Nolan Johnson speaks with Sean Murray—director of sales, service, operations, and logistics process automation at Panasonic—about the company's focus on software and information management on top of their long history in hardware and equipment.

IPC Standards Work Continues to Move Forward

On April 3, 2020, Teresa Rowe, IPC’s director of assembly and standards technology, and David Bergman, vice president, spoke with Barry Matties about ongoing standards activities during the global COVID-19 outbreak. Rowe and Bergman reported that, where one might think that standards committees would be negatively affected, standards work seems to be going stronger than ever.

Gene Weiner: Lessons Learned From COVID-19

Barry Matties speaks with Gene Weiner, president and CEO of Weiner International Associates, about the electronics industry’s continued operation under COVID-19 restrictions and some of the lessons learned during this pandemic. One such lesson: Companies and nations must do a better job of sharing information to help prevent this from happening again.

Averatek’s A-SAP Semi-additive Process Enables HDI

In this video interview from the show, columnist Tara Dunn spoke with Mike Vinson, president and COO of Averatek, who described the company's semi-additive process, A-SAP, with 25-micron features sizes and below, which enables high-density interconnections. Vinson also discusses the papers Averatek presented at IPC APEX EXPO 2020.

This Month in SMT007 Magazine: Exclusive Interview With Burt Rutan, Aerospace Legend

If you follow advancements in aerospace technologies and expeditions, then you know the name Burt Rutan. Described by Newsweek as “the man responsible for more innovations in modern aviation than any living engineer,” Rutan is a bold visionary with a passion for the advancement of technology, who has designed 46 aircraft throughout his career. Following his IPC APEX EXPO keynote presentation, Rutan stopped by the I-Connect007 booth and shared his thoughts on a wide variety of topics.

'Coatings Uncoated!' Webinar Series and Automotive Industry Trends

Phil Kinner, global business/technical director of Electrolube’s coatings division, tells Pete Starkey about the positive impact of the “Coatings Uncoated!” webinar series and comments on how the company has responded to the changes in the focus of the automotive industry.


Arlon Takes on High-Power Failure

In this video interview from IPC APEX EXPO, Pete Starkey and Dave Nelson, director of business development at Arlon Electronic Materials, explore causes of failure in high-power PCBs and explain how resin cracking during drilling can be overcoming using thermally conductive filled resin.

The Formation of the Printed Circuit Engineering Association

Patty Goldman spoke with Gary Ferrari, FTG Corporation, at IPC APEX EXPO 2020 about the formation of the Printed Circuit Engineering Association, which—having been started two months ago—has attained lots of interest from the industry. The PCEA hopes to bring together designers, engineers, fabricators, assemblers through local chapters to focus mainly on education and learning.

Siemens and Valor: Two Complementary DFM Technologies

Before IPC APEX EXPO kicked off, Andy Shaughnessy attended a Siemens seminar in San Diego on smart manufacturing for electronics and the integration of technologies from Siemens’ digital industry software and Valor. Afterward, Andy spoke with Andy Farrington, director of portfolio development for the Americas, about the event, as well as some of the hot topics and solutions that the speakers addressed.

IPC’s Dr. John Mitchell Commends U.S. Manufacturers and Governors

On March 31, Dr. John Mitchell, IPC president and CEO, gave Barry Matties an update on the industry response to COVID-19 since their conversation on March 20. Mitchell provides an overall update on the industry, commending U.S. manufacturers for their proactive responses.

Industry Outlook With Siemens’ Fram Akiki

In this video interview from the show, Editor Dan Feinberg speaks with Fram Akiki, VP of electronic and semiconductor industries for Siemens, about the biggest challenges in the electronics industry. They also discuss major industry trends, including smart connected devices used in autonomous transportation and robotics, increased complexity, and a reduced time to market.

BGA Standard Update With Ray Prasad

In this video interview from the show, Ray Prasad, president of Ray Prasad Consultancy Group, updates Guest Editor Joe Fjelstad on the ongoing work with the BGA standard and the latest revision that is going to ballot.

EPTAC Preparing Young People for Future in Industry

In this video interview from the show, Guest Editor Kelly Dack and Leo Lambert, VP/technical director of EPTAC Corporation, describe the impact of internships and apprenticeships, the importance of IPC specifications, the effectiveness of certification.

This Month in PCB007 Magazine: A Scorecard for Suppliers

Al Block and Naji Norder from National Instruments talk about the PCQR2 tool, what that entails, and how companies can use the data-driven analysis to validate the quality of suppliers and potentially save millions.

InduBond Gets Hot With Induction Heating Lamination

In this video interview from the show, Editor Nolan Johnson sat down to speak with Víctor Lázaro, InduBond’s R&D director and technical manager, about InduBond's latest technology for panel lamination utilizing induction heating. InduBond demonstrates a lamination oven on the IPC APEX EXPO show floor, as well as the advantages of the technology.

What It Takes to Be a Milaero Supplier, Part 2

The decision to pursue military and aerospace (milaero) certification impacts every facet of the organization, and not every shop is prepared to make this transformation. In Part 2, Anaya Vardya focuses on what it takes to be a milaero supplier in the areas of engineering and CAM.


IPC APEX EXPO 2020 Attendees Speak: Heston Singh

"We have been coming here for many years, and we had another good experience this year," said Unitron's Heston Singh. "If it wasn’t good, we wouldn’t be coming back. They have products that are needed for this market, so we’ll be back every year."

IPC Chief Economist Dr. Shawn DuBravac Shares Industry's Financial Outlook

On March 23, IPC Chief Economist Shawn DuBravac, Ph.D., CFA, spoke with I-Connect007 publisher Barry Matties in an exclusive phone interview immediately following DuBravac’s online briefing to IPC member attendees.

IPC President and CEO Dr. John Mitchell: COVID-19 Global Industry Update

On March 20, Dr. John Mitchell, IPC president and CEO, spoke with I-Connect007 publisher Barry Matties in an exclusive phone interview with updates on COVID-19-related current events in the manufacturing industry. In this information-packed 14-minute audio interview, Dr. Mitchell shared key takeaways from Friday’s IPC Executive Forum conference call.

Best Practices Highlighted at the 2020 IPC EMS Management Meeting

The key challenge at the top of EMS leaders’ minds during roundtable discussions was the lack of skilled workers. Leaders brainstormed solutions like creative identification and sourcing of talent outside of the manufacturing sphere, leveraging the flexibility of smaller businesses to make changes attractive to potential employees as well as cooperation with IPC and other talent development programs. John Mitchell updated the group on the IPC Education Foundation (IPCEF) and workforce initiatives to build and support workforce needs. The group welcomed Andy Marris of MRA, who discussed motivating and engaging an existing workforce to create a competitive advantage.

DownStream: Smoothing out the Post-Processing Bumps

In this video interview from the show, Joe Clark, co-founder of DownStream Technologies, gives Guest Editor Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.

Trends From the Show: Solder and Software

In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.

Are Trade Shows at a Crossroads?

With the cancellation of this year’s E3 show, the biggest gamer conference, the event’s format is shifting to a more fluid, online communication method. This may be the wave of the future. Can you imagine if the COVID-19 outbreak had occurred just three months earlier? Would there have been a Consumer Electronics Show, DesignCon, or IPC APEX EXPO? If the coronavirus is still in play in six months, will these shows take place in 2021?

IPC APEX EXPO 2020 Attendees Speak: Travis Smith and Mindy Sanchez

"I’m seeing a lot of great manufacturers and different equipment that’s available in the market, as well as new, emerging technologies," said Travis Smith of Ball Aerospace. "I’m learning a lot more about some of IPC’s standards and committees as well. It has been a fantastic week of educating ourselves for manufacturing processes going forward. And the IPC booth has a wealth of information."

IPC APEX EXPO 2020 Attendees Speak: Camille Sybert

"There’s a need for flexible solutions, so people are trying to make the most of the equipment that they buy, and they want to have the equipment that’s able to be flexible in scale with what it is that they’re looking for," said Camille Sybert of Nordson Electronics Solutions. "We have customers asking about future capabilities that they might not be ready for right now, but they want to know that it’s something that can be easily integrated into their processes in the future, as they’re in a position to better be able to do so."

Show & Tell Feature: New Developments and Opportunities

“Elevate the Excellence of Electronics” was the theme for this year’s IPC APEX EXPO. As expected, the show set the bar high with technical sessions, professional development sessions, committee meetings, numerous networking opportunities, and an exhibitor list that included all aspects of the electronics supply chain. Columnist Tara Dunn explains how she repeatedly found herself interested in multiple sessions being hosted at the same time, and having to pick and choose which session to attend.


Show & Tell Feature: Happy’s Highlights

Happy Holden traveled to San Diego for IPC APEX EXPO 2020. He was happy to get out of Grand Rapids, where the temperature had dropped to 28 degrees. In this article, he describes some of the highlights of the show, from beginning to end.

IPC APEX EXPO 2020 Attendees Speak: Gerry Padnos

"Overall, it has been a successful show for us," said Gerry Padnos. "We have mainly seen serious shoppers, not just window shoppers. We have done a lot of good work here, and we have a lot of interest in our products."

2020 EIPC Winter Conference, Day 1

Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

IPC APEX EXPO 2020 Attendees Speak: Caleb Buck

"I am a PCB designer and an electrical engineer," said Caleb Buck of EaglePicher Technologies. "I’m not involved in the manufacturing, but I tell manufacturers what to do via my drawings. I had an interest in learning more about the IPC standards, my manufacturer’s capabilities, and some of the tools they use."

IPC APEX EXPO 2020 Attendees Speak: Scott Pohlmann

"As a salesman, my job is to make sure I stay on the cutting edge of technology," said Scott Pohlmann of Milwaukee Electronics. "When our customers ask for certain features that they need on their equipment or performance, I need to know what the state-of-the-art equipment, profiles, and procedures are out there.

Inspiring Next-Generation Engineers Through STEM

Through the STEM Student Outreach Program, IPC invites high school students to visit IPC APEX EXPO for a day. Last year, they had about 100 participating students, and this year, it doubled. The program is designed to introduce students to our industry at a younger age. During one event planned for them, the students had a chance to participate in a hands-on soldering track, creating wearable buttons to take home with them.

Joe Fjelstad Breaks Down His Occam Process

Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

NCAB: A ‘Hub’ That Works With Designers From Start to Finish

In this video interview from the show, Guest Editor Kelly Dack meets with Ruben Contreras, field applications engineer at NCAB Group, and Shaun Salas, key account manager. They discuss a variety of ways to overcome challenges with tariffs and broker relationships, as well as emphasizing upstream expertise and how the company operates as a "hub." Part of NCAB’s objective is to work with designers and design engineers to make the board more manufacturable.

Burt Rutan’s Keynote: SpaceShipOne

In this video clip from his presentation, Burt Rutan discusses some of his aircraft’s revolutionary flights that drew the most public attention, including SpaceShipOne, which flew three of the five manned space flights launched by man in 2004. He also explains the benefits of working with Microsoft’s Paul Allen, who agreed to fund SpaceShipOne based on a simple handshake.

David Bergman: CFX a Key Ingredient of Smart Factories

In this video interview from the show, Jennie Hwang and David Bergman, IPC's VP of standards and training, address the use of CFX to facilitate plug-and-play smart factories. IPC APEX EXPO 2020 offered a variety of demonstrations of CFX, IPC’s Connected Factory Exchange.


Rogers Continues to Grow and Adapt

In this video interview from the show, Guest Editor Judy Warner and Tony Mattingly, senior product manager at Rogers Corporation, discuss the state of materials at the company, as well as the Rogers innovation centers the company has opened recently.

Insulectro: Educating Designers About High-Speed Materials

In this video interview from the show, Ken Parent, Insulectro's VP of sales and product manager, speaks with Guest Editor Kelly Dack about the company's efforts to educate engineers and designers about materials and their options and availability. Insulectro has held a series of PCB design classes and plans to keep educating designers about these high-speed materials.

Randy Cherry: IPC Validation Services Continues to Expand

In this video interview from the show, Randy Cherry, IPC's director of validation services, gives Guest Editor Judy Warner his annual update on IPC's Validation Services, which is growing along with ever-increasing IoT and connectivity.

The Success of IPC’s STEM Student Outreach Program

The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.

Joe Clark Says DownStream Is Ready for More Growth in 2020

Joe Clark, co-founder of DownStream Technologies, gives Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.

IPC APEX EXPO 2020 Attendees Speak: Katie Carl

"We have a wide range of kids. All of them have some sort of interest in technology, which is why they wanted to come in general," said Katie Carl, a high school teacher escorting a group of kids at IPC APEX EXPO. "It’s neat when they start seeing how these technologies are created because a lot of them have seen robotics or have done a tiny bit of soldering with little circuits, but when they can see how those things are built and created in the industry, it makes it more applicable for them."

Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee

With over 32 years spent working with IPC, Steve Pudles was elected to the IPC’s Hall of Fame this year. Patty Goldman spoke with Steve about how he first became involved as well as his time in the organization, including his work with the EMS Management Council.

Solder Paste Printing From the Stencil’s Perspective

Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

IPC Government Relations: Focus on Supply Chain Resiliency

During IPC APEX EXPO, Editor Nolan Johnson sat down with Chris Mitchell, VP of global government affairs, to discuss IPC’s latest initiative with industry intelligence programs. As Chris explains, some of these efforts are focused on improving the DoD’s supply chain. This includes moving the DoD from leaded to lead-free components to help avoid millions of dollars in rework. He also discusses the team’s drive to unite with partners around the world and create a truly global organization.

IPC APEX EXPO 2020 Attendees Speak: Sheryl Long

"It’s a great place to see our customers and other friendly faces," said Sheryl Long, global marketing communications manager for Rogers Corporation. "The traffic has been a little slow this year, but it’s a great place to meet everybody at one spot and to get together and talk about what’s going on in the industry.


Catching up With Flexible Circuit Technologies

Dan Beaulieu catches up with Troy Koopman, president and co-founder of Flexible Circuit Technologies (FCT), and Carey Burkett, the company’s VP of business development. FCT is a full-service flex and rigid-flex supplier.

IPC: Automotive Electronics Segment Exploding

Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.

IPC APEX EXPO 2020: The I-Connect007 Photo Gallery

If you couldn’t make it to IPC APEX EXPO 2020 in San Diego, don’t worry. I-Connect007 was there to cover it all. From “A Night of Happy-ness” through tear-down, our reporters were on hand to document the entire week.

American Standard Circuits: Strong Focus on Military and Aerospace

During IPC APEX EXPO 2020, Joe Fjelstad speaks with Anaya Vardya, president and CEO of American Standard Circuits. In this interview, Anaya shares a variety of recent business updates. He also highlights the company's flex technology and I-Connect007 eBooks on flex and rigid-flex fundamentals, as well as RF and microwave PCBs.

IPC Designers Council Has a New Name: IPC Design

Yes, you read that right. The IPC Designers Council is now known as IPC Design. Many of you have heard secondhand stories about what this change will entail, so I asked IPC to shed some light on this subject. I recently spoke with IPC’s Teresa Rowe and Patrick Crawford about what’s changing, what’s not, and IPC’s plans to provide improved infrastructure for PCB design content and curriculum.

iNEMI: Emerging Technologies Driving Rapid Industry Development

During IPC APEX EXPO, Editor Joe Fjelstad spoke with Grace O'Malley, iNEMI's VP of technical and project operations, about the well-attended roadmap sessions and other iNEMI meetings taking place at the show. Topics covered included emerging applications and how these technologies are driving industry development across the board, and at a fast pace.

RTW IPC APEX EXPO: John Mitchell Discusses the Show's Evolution

During IPC APEX EXPO, Technology Editor Dan Feinberg spoke with John Mitchell, CEO and president of IPC, about the event’s evolution from a strictly PCB show into a miniature Consumer Electronics Show, including new ideas and prototypes. They also discussed several new IPC initiatives, including IPC Design.

IPC APEX EXPO 2020 Show Week Time-lapse Video

It was a busy week at IPC APEX EXPO in San Diego, and I-Connect007 was there to cover it all. From set-up to tear down, I-Connect007 captured a four-day time-lapse video of the show floor. We’d like to thank our good friends at MacDermid Alpha for letting us set up our camera in their booth.

IPC APEX EXPO Reflections

The sun may have risen and set on the 2020 edition of IPC APEX EXPO, but the developments from the week in San Diego certainly will linger with us for some time. Editor Nolan Johnson provides a summary of the events at IPC APEX EXPO 2020 in San Diego, California.

Phil Carmichael: IPC Asia Continues Solid Growth

Phil Carmichael, IPC president of Asia Pacific, talks with Barry Matties at the HKPCA show during the first week of December 2019 about the continued growth and increased engagement by Asian member companies with IPC, with over 320 members in standards committees now working on the development of the next-generation standards.


True or False: CFX Edition

Since the release of IPC-2591—Connected Factory Exchange (CFX), Version 1.0—there has been a lot of buzz regarding CFX within the industry from all segments. Still, with all of the buzz, there are also some misconceptions floating around the industry regarding CFX. David Bergman takes some of those statements, using feedback from Subcommittee members, and plays a little game of “True or False: CFX Edition.”

IPC APEX EXPO 2020: Day 2 Review

Wednesday at IPC APEX EXPO drew a fairly steady stream of attendees to the show floor. Exhibitors we spoke with said the visitors were ready to spend some money. Almost everyone said their company was having a good quarter and experiencing slow but consistent growth year over year.

AT&S: Working With Designers on a Global Level

Barry Matties recently took a tour of AT&S’s Austrian factory, which is developing new circuit design strategies surrounding embedded and active components. Gerald Weis discusses the company’s focus on serving and educating PCB designers around the world, as well as their plans to embrace the latest technology and Industry 4.0 processes going forward.

IPC APEX EXPO 2020: Day 1 Review

2020 was a special anniversary year for IPC APEX EXPO: “Celebrating 20 years of excellence in electronics” was the tagline. Pete Starkey provides a review of the Day 1 activities on the show floor and beyond.

IPC APEX EXPO 2020 Dawns on San Diego

IPC APEX EXPO 2020 launched on Tuesday, February 4, and I-Connect007 started its exclusive coverage.

Upcoming IPC APEX EXPO Offers Sessions on 5G

Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.

IPC Solder Stencil Task Group—Inviting OEM Input to IPC APEX EXPO Meeting

Jeff Schake of ASM Assembly Systems is chairman of IPC’s Solder Stencil Task Group. In this conversation with Nolan Johnson and Barry Matties, Jeff discusses what they will be meeting about at the upcoming IPC APEX EXPO.

Residual/Free TBBPA in FR-4

Sergei Levchik describes how testing has shown that FR-4 printed circuit boards do not contain free or residual tetrabromobisohenol-A (TBBPA).

DesignCon Kicks Off Its 25th Anniversary Show

DesignCon’s 25th anniversary show got underway yesterday, and the I-Connect007 Editorial Team was there, meeting with some of the industry’s top electronics engineers, technologists and managers

CES: The Main Halls

CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.


Fresh Thinking on the Logistics of Laminate Distribution

Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.

IPC APEX EXPO Technical Session Preview

Brook Sandy-Smith, IPC technical conference program manager, previews the technical side of IPC APEX EXPO 2020, which includes the customary technical sessions, but also some new wrinkles like the fundamentals program and “sessions @ the intersection” to encourage more interaction.

The IPC Education Foundation’s New Column

The IPC Education Foundation’s new column with I-Connect007 will feature Charlene Gunter du Plessis, Aaron Birney, and Corey Lynn. These IPC Education Foundation members will share updates on programs and activities here. Find out more about the authors below and read "Foundations of the Future" in the SMT007 Week Newsletter.

IPC Validation Services: What to Expect at IPC APEX EXPO 2020

IPC’s Randy Cherry previews what to expect from IPC APEX EXPO 2020, including a full line on display demonstrating CFX/Hermes, further development of the Validation Services program, as well as testimonials from member companies that have been participating in IPC’s new trusted supplier program to the Department of Defense (DoD).

IPC APEX EXPO Technical Conference, Featuring Fundamentals and the Intersection

IPC's Brook Sandy-Smith brings us a preview of the Technical Conference at IPC APEX EXPO 2020. In addition to the Sessions @ the Intersection and the Technical Conference, the Fundamentals Program is new at IPC APEX EXPO 2020. The program provides curated content for industry newcomers and anyone interested in a broader view through the many facets of electronics manufacturing. Attendees will learn important concepts, terminology, and background as preparation for the detailed content on new studies and technologies presented at the technical conference.

Foundations of the Future: Get More Engaged in 2020

Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.

IPC APEX EXPO: Sessions @ the Intersection

In this short video, Brook Sandy-Smith, IPC’s technical conference program manager, explains how “the lntersection” will be a new meeting place In between this year's IPC APEX EXPO show floor and the technical conference available to attendees and the free sessions that are open to any registration type.

Visit the Newcomers’ Lounge at IPC APEX EXPO

The Newcomers’ Lounge will open on February 2, will remain open through February 6, and is conveniently located near the technical conference and meetings area, where it will serve as a dedicated resource center for newcomers to get their questions answered and meet other newcomers. Use the lounge to take a break from the hustle and bustle of a busy day, catch up on emails, or grab a quick snack or refreshment.

Tamara Jovanovic Checks in After First Year as a Designer

What a difference a year makes. The I-Connect007 Editorial Team caught up with Tamara Jovanovic, a PCB designer they met last year at AltiumLive in San Diego as a newly minted engineering graduate. She discusses her first year in the industry and explains how education and training events can help shape the careers of new designers.

Meet Two New CID Grads: Kalen Brown and Michael Steffen

At PCB West, I spoke with two newly minted Certified Interconnect Designers: Kalen Brown of EaglePicher and Michael Steffen of Crystal Group. After passing the CID exam, they attended the IPC Designers Council Executive Board Meeting, where the more “seasoned” veterans were very happy to meet them.


CFX Preview at IPC APEX EXPO 2020

The I-Connect007 Editorial Team chats with IPC’s Chris Jorgensen about the advances CFX has made in the past year and where the standard is in the standardization process. Chris also previews the CFX line that will be on display at the upcoming IPC APEX EXPO and shares IPC’s plans on educating and providing support solutions to potential users of CFX to implement it more easily.

Updates on Cleaning Standards and Committees

Graham Naisbitt of Gen3 discusses the changes he's seeing in cleaning, including how the WP-019 white paper has caused a closer look at electrochemical reliability. As a long-time head of committees, Graham also breaks down many of the topics he hopes are addressed at this year’s IPC APEX EXPO.

How to Become a Certified IPC Trainer

The Blackfox Certified IPC Trainer (CIT) programs are best suited for experienced and skilled electronics technicians, engineers, and supervisors who have the will and passion to teach and train colleagues about the quality standards of IPC. They also provide successful candidates with a credential that confirms their knowledge and understanding of IPC quality systems.

Top 10 Most-Read Design News Stories of 2019

As we move into 2020, we took a look back at the most popular Design007 news stories of the past year. Here for your enjoyment are the Top 10 most-read Design007 news items of 2019.

Top 10 Most-Read Design Articles of 2019

As we move into 2020, we took a look back at the most popular Design007 articles of the past year. Here for your enjoyment are the Top 10 most-read Design007 articles of 2019.

Top 10 Most-Read Design Columns of 2019

As we move into 2020, we took a look back at the most popular Design007 columns of the past year. Here for your enjoyment are the Top 10 most-read Design007 columns of 2019.

Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation

The latest book in I-Connect007’s "The Printed Circuit Assembler’s Guide to…" series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.

Utilizing AI in CAD Library Development

Nolan Johnson speaks with Chico Wu of Footprintku, a company using artificial intelligence (AI) to help fill gaps in CAD library development by partnering with design teams on things like addressing resource shortages and automating custom design rulesets while also eliminating other manual steps in the process.

The Future of the World Is Truly in the Hands of Our Youth

At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.

AltiumLive Frankfurt 2019: Happy Holden Keynote

Nobody left early! Altium had wisely kept Happy Holden’s keynote presentation on “PCB Trends that Will Impact Your Future” until the end of the final day of the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany. Pete Starkey presents the highlights of Happy's presentation.


LA/Orange County SMTA Expo and Tech Forum Review

Dan Feinberg recently attended the LA/Orange County SMTA Expo and Tech Forum, which was held in Long Beach, California. He provides an overview of the activities, from the show floor to the presentations.

AltiumLive Frankfurt 2019: Carl Schattke Keynote

“How many here can remember manually taped artworks?” No more than three hands were raised in an audience of over 230 at the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany, as IPC Advanced Certified Interconnect Designer Carl Schattke introduced his keynote, entitled “Making and Breaking the Rules.” Schattke had learned PCB layout as his father’s apprentice, hand-taping several hundred PCB designs in the 1970s.

Flex Standards Update With Nick Koop

This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.

Words of Advice: The OEM Systems Designer

In a recent survey, we asked the following question: What advice would you give an OEM systems designer? Here are a few of the answers, edited slightly for clarity.

Why Does the PCB Industry Still Use Gerber?

Every so often, I hear technologists ask why so many PCB designers still use Gerber. That is a fair question. Ucamco has over 35 years of experience in developing and supporting cutting-edge software and hardware solutions for the global PCB industry. Our customers—small, medium, and large PCB fabricators—include the electronics industry’s leading companies, and many of them have been with us for over 30 years. We are dedicated to our industry and excellence in everything we do, which includes our custodianship of the Gerber format.

Meet Ray Prasad, SMT007 Columnist

Meet Ray Prasad, one of our SMT007 columnists! Prasad’s columns explore DFM, manufacturing processes, yield improvement, quality control, IPC standards, and much more.

Design For Excellence: Karen McConnell on Standards

During the IPC Summer Meetings, I spoke with Karen McConnell, senior staff CAD CAM engineer with Northrop Grumman Mission Systems. Karen is a veteran PCB designer as well as an IPC committee chair and mentor. She offered an update on some of the IPC committees she chairs, the need for more mentor programs in this industry, and why you can call something a ham sandwich if you define it correctly in the standard.

Meet George Milad, I-Connect007 Columnist

Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.

So Many Standards Committees, So Little Time

During the IPC Summer Meetings and Panelpalooza in Raleigh, North Carolina, I met with Leo Lambert, vice president and director of technology at EPTAC. We discussed IPC’s recent efforts to revamp the way standards are developed and interpreted as well as changes to training and education committees and a variety of methods for eliminating errors and duplicated comments when revising standards.

Why Designers Need to Be at the SMTA Additive Electronics Conference

In a recent interview, Kelly Dack and Tara Dunn (Omni PCB president and conference co-chair) discussed why designers need to attend the SMTA Additive Electronics Conference. Tara will also be attending and moderating a panel discussion at the conference.


Happy Holden Previews His AltiumLive Frankfurt Keynote

I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.

Words of Advice: Starting a New Design

In a recent survey, we asked the following question: What do you think is the most important thing a designer should remember when planning a new PCB design? Here are a few of the answers, edited slightly for clarity.

ODB++: Transforming Ideas Into Products

The ODB format originated with the objective of delivering on this need. The format was originally introduced for use by PCB fabricators, eliminating the need for a collection of CAM files in multiple formats—such as Gerber, Excellon, IPC-356, or even IPC-350, which was an early attempt to simplify this process. The key to the success of ODB was that it obtained industry acceptance.

Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure

Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss.

John Michael Pierobon Discusses His Flex Design Class

If you’re new to flex design, you might want to check out an online course offered by All Flex, a flex fabricator. The course, Designing Flexible Circuits, was created by John Michael Pierobon. I asked John Michael to discuss his flexible circuit design course, and whether online curriculum can ever replace good old-fashioned live instruction.

Words of Advice: First Steps in the Design Process

In a recent survey, we asked the following question: What are the first steps you take in the PCB design process? Here are some of the answers, edited slightly for clarity.

Leo Lambert on Training the Next Generation of Technologists

I sat down for an interview with Leo Lambert, VP of technical director for EPTAC Corporation, during the IPC Summer Meetings in Raleigh, North Carolina. We discussed the company’s growth, including plans to have training centers across different regions of the country to help cut down on students’ travel times, and why training methods must constantly evolve to remain effective.

Insulectro and DuPont Experts Talk Flex Design

I recently spoke with Insulectro’s Chris Hunrath and DuPont’s Steven Bowles at the DuPont Technology and Innovation Center in Sunnyvale, California. We discussed a variety of topics related to flex design, including the support structure that’s needed in flex design, the everchanging world of flex materials, and the need for working with a flex fabricator as early as possible in the flex design cycle.

EIPC Summer Conference 2019, Day 1

The beautiful city of Leoben in central Austria provided the setting for the EIPC 2019 Summer Conference. In this article, EIPC Chairman Alun Morgan provides the highlights of the first day of the event, including a recap of the technical presentations.

PCB Design Training: More Critical Than Ever

I interviewed Gary Ferrari of FTG at the IPC High-Reliability Forum and Microvia Summit in Baltimore. Gary is a co-founder of the IPC Designers Council and a longtime advocate for PCB design and PCB designers. We discussed the crucial role that PCB designers play in the entire electronics development process, and how IPC and the Designers Council are helping to educate and inform the next generation of designers.


Bill Brooks on Teaching PCB Design at Palomar College

Bill Brooks of Nordson ASYMTEK is a long-time PCB designer and one of the first people to teach PCB design courses in a college setting. He recently spoke with the I-Connect007 editorial team about his history in design and his time as a PCB design instructor, the curriculum he developed and taught, and various techniques that might be enacted today to better educate the designers of tomorrow.

Words of Advice: Drawbacks to Your PCB Data Format?

In a recent survey, we asked the following question: What is the biggest drawback to your current PCB data format? Here are a few of the answers, edited slightly for clarity.

IPC Reliability Forum Wrap-up With Brook Sandy-Smith

I attended the recent IPC High-Reliability Forum and Microvia Summit in Baltimore, Maryland. The speakers and panelists focused on a variety of topics, but one issue that kept popping up was the failure of some microvias on military and aerospace PCBs. Fortunately, some smart technologists are focusing on determining the cause of these via failures. I asked Brook Sandy-Smith, IPC’s technical education program manager, to give us a quick wrap-up of this event.

Altium Designer 19.0 Features Printed Electronics Design Functions

The newest version of Altium Designer—revision 19.0—includes functionality for designing printed electronic circuits. We wanted to get the scoop on Altium’s PEC tools, so we asked Nikolay Ponomarenko, Altium’s director of product management, to give us a tour of the new functions.

IPC High-reliability Forum and Microvia Summit Review, Part II

The Microvia Summit on May 16 was a special feature of the 2019 event in Baltimore, since microvia challenges and reliability issues have become of great concern to the PCB manufacturing industry. It provided updates on the work of members of the IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee and opportunities to learn about latest developments in methods to reveal and explain the presence of latent defects, identify causes and cures, and be able to consistently and confidently supply reliable products.

Denny Fritz: The Difference Between Quality and Reliability

I recently spoke with industry veteran (and I-Connect007 columnist) Denny Fritz about the relationship between quality and reliability—two terms that are unequal but often used interchangeably. We also discuss the current state of lead-free solders in the U.S. military and defense market as well as the microvia reliability issues Denny focused on at IPC’s High-Reliability Forum and Microvia Summit in Baltimore, Maryland.

26 Meters of Flex!

Barry Matties spoke with Philip Johnston, managing director of Trackwise Designs, about the company’s patented length-unlimited multilayer printed circuits aimed at replacing conventional wire harnesses. Originally created for the aerospace industry, Trackwise has since seen growing interest from a number of different industries. Jake Kelly, managing director and chairman of Viking Test Ltd., also joined the conversation to discuss the importance of having a flexible equipment supplier when dealing with such a unique technology.

IPC High-reliability Forum and Microvia Summit Review, Part I

The IPC High-Reliability Forum and Microvia Summit covered a broad range of topics related to reliability and provided interactive opportunities to share expert knowledge and experience in determining and understanding the causes of failure and selecting the best design rules, materials, processes, and test methods to maximise product reliability.

Design Is a Pivotal Piece of the Puzzle

As a field applications engineer at TTM Technologies, which has fabrication and manufacturing locations around the world, Julie Ellis sees a wide variety of customer design requirements. In this interview with the I-Connect007 Editorial Team, Julie explains how PCB designers can influence the development of the PCB. She shares a variety of tips and tricks that designers can implement early in the design process to help optimize fabrication and assembly later on and keep small issues from becoming big problems downstream.

Albert Gaines: Design All Comes Down to Documentation

During SMTA Atlanta, I spoke with Albert Gaines of HiGain Design. We discussed Albert’s belief that everything starts with design and that too many engineers and designers focus solely on the final board at the expense of the documentation, which is a designer’s most important product. Do you consider your documentation to be a critical product?


Words of Advice: Making Life Easier for Fabrication and Assembly

In a recent survey, we asked the following question: What steps do you take to make the job easier for your fabrication and assembly providers? Here are a few of the answers, edited slightly for clarity.

Pulsonix 10.5 Development Driven by Customer Demand

I recently spoke with Bob Williams, the managing director of Pulsonix, about the release of the EDA tool’s version 10.5. Bob explained how the company had made the tool more intuitive based on user input, and he discussed some of the more cutting-edge functionality not normally found in competitively priced tools.

Design for the Unknown

Our industry loves DFx, also known as the “Design Fors.” As PCB designers, we not only design for manufacturability (DFM) but we design for assembly, reliability, cost, test, and many more factors which we like to lump together as DFx. But now, I think it’s time we embrace a new DFx: Design for the Unknown, or DFU.

Libraries: A Must-have for Design

I-Connect007 was invited to attend a session of the Orange County Chapter of the IPC Designers Council (DC). Even though I have been an IPC member for over half a century (yes, almost since vacuum tubes dominated design), this was my first DC event.

Words of Advice: What Feature Would You Like to See in Your CAD Tool?

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

IMPACT Washington, D.C. 2019 Recap: Leaders Call for Action on USMCA Trade Deal

Top executives from electronics companies across the United States were in Washington, D.C., last week to call on the Trump administration and Congress to support policies that will drive the electronics industry’s future growth in North America and worldwide.

XNC Format: Gerber Takes Data Into the Future

The problem is that so many NC files are of deplorable quality because the NC format was never designed as a data transfer format. It has always been a machine driver and contains all sorts of information that a drilling machine needs, but that is irrelevant and confusing for data exchange.

Technically Appropriate Material Choices are Key to Design Success

Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. I-Connect007’s Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.

Words of Advice: Your Company’s Design Process

In a recent survey, we asked PCB designers to describe their company’s design process: Is it a rigid workflow they follow to the letter, or a process that allows for their individual techniques? Of course, the comments were illustrative. Only one respondent said, "We just wing it."

Smart Design Data Is Essential for Industry 4.0 Manufacturing

Almost all of the conversation regarding Industry 4.0 is centered on the manufacturing floor, which is where the effect of the initiative is most felt initially. Little attention is given to the starting data for manufacturing—the data that comes from design. However, you can’t have smart manufacturing if your process begins with dumb data. As Pink Floyd said, “You can’t have your pudding if you don’t eat your meat!”


Words of Advice for New PCB Designers

In a recent survey, we asked the following question: What do you think is the most important thing a designer should remember when planning a new PCB design? Here are a few answers, edited slightly for clarity. One favorite: "Have a good music selection."

IPC Asia President Phil Carmichael on China Trends

At the productronica China 2019 show in Shanghai, Barry Matties joined Phil Carmichael, president of IPC Asia, to discuss the continued growth of IPC in Asia, including the increasing emphasis on training. IPC China has grown from hosting two technical conferences five years ago to 32 in the past year. Phil also addresses current trends he’s seeing as well as trade tensions between China and the U.S.

Youth in the Industry Putting Training to Work

At a job fair on campus at George Fox University, Nolan Johnson sat down with Jake Whipple, a computer engineering senior, to discuss the GFU engineering program. This is one of the few engineering programs in the U.S. that gives students experience designing PCBs before they enter the work force.

PCB Designer Survey: Everything Starts With Design

Recently, a variety of technologists who fabricate and assembly PCBs have made the following statement: “Everything starts with design.” We want to get your thoughts on this. What are some of the steps you take early in the design process that can affect your downstream partners? Let us know!

George Fox University: Teaching PCB Design to EE Students

Gary Spivey is director of engineering projects at George Fox University, a Christian college in the Pacific Northwest, and his students learn to design and fabricate a PCB while also giving back to the community. Not surprisingly, these graduates get snapped up quickly. In this wide-ranging interview, Spivey discusses GFU’s engineering curriculum, their cutting-edge lab facilities, and the need to teach students to think critically.

Project MARCH Students’ Exoskeleton Helps Paraplegics Walk Again

Project MARCH student volunteers design and build futuristic exoskeletons that can help paraplegics walk. The students do most of the work themselves, including designing the various PCBs. I saw their latest exoskeleton up close at AltiumLive in Munich, and I had to find out more about this program. Delft Students Martijn van der Marel and Roy Arriens sat down with me to discuss their work on the exoskeleton, including their PCB design experience, and whether they plan to pursue PCB design as a career.

Sunstone's Terry Heilman Discusses the Evolving Industry

For the last 14 years, CEO Terry Heilman has been one of the key leaders in driving the expansive growth at Mulino, Oregon-based Sunstone Circuits, growing from a traditional PCB manufacturer to a PCB solutions provider with online ordering and a free PCB design tool. At IPC APEX EXPO 2019, Terry discusses the importance of serving the customer, how customers are shaping companies today, and the impact this will have on companies in the future.

Words of Advice: Obstacles to Getting Designs to Fab

In a recent survey, we asked, "What are the biggest obstacles you face in getting your design to the fabricator?" Here are a few of the responses, edited slightly for clarity.

Andy Johnson: EDA a Great Field for Young People

At the AltiumLive event in Munich, Germany, I sat down for an interview with Altium’s Andy Johnson. Andy is 25 and just a few years out of college, so I asked for his thoughts on working in this industry and what we can do to draw more young people into the PCB design community.

Kelly Dack at IPC APEX EXPO: The Attendees Speak!

During IPC APEX EXPO, Guest Editor Kelly Dack and the I-Connect team roamed the show floor, recorders in hand. They asked various attendees for their impressions of the show, and any new tools and technology that may have caught their attention. These are their stories.


Electromagnetic Analysis Design Insight: Effects of Meshed Reference Planes on Interconnects

Most of the transmission lines in PCB or packaging interconnects have so-called quasi-TEM waves with the electric and magnetic fields mostly perpendicular or transverse to the propagation direction. Parameters of such transmission lines can be accurately approximated with the analysis of a single cross-section in a 2D field solver. With the cutouts in the reference plane, the waves become non-TEM and not even quasi-TEM due to the presence of the longitudinal components in the electric and magnetic fields.

Accelerating and Disrupting Innovation: The Tesla Story

The time was right for Tesla to bring new thinking into the concept of electric transportation when the company observed the quantum shift in battery technology from lead-acid to lithium-ion that had been driven by developments in portable consumer electronics.

RTW IPC APEX EXPO 2019: Judy Warner on Altium's Transformative Vision

During IPC APEX EXPO, Guest Editor Kelly Dack sat down for an interview with Judy Warner, Altium's director of community engagement. They discussed Altium's efforts to educate PCB designers, regardless of their CAD tools, and the company's plan to transform the industry by bringing together PCB design and manufacturing.

Carl Schattke on Stackup Design and Managing the Component Shortage

At AltiumLive, I met Carl Schattke, CID+, a lead PCB designer with an American automaker. Carl and TTM’s Julie Ellis taught a packed class on good stackup practices complete with plenty of slides showing examples of all kinds of stackups. After class, Carl explained why the stackup is often the root of manufacturing problems downstream, and why today’s discrete component shortages are likely to be around for quite some time.

Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program

At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.

Natasha Baker: Supply Chain Transparency Inside the CAD Tool

Natasha Baker, CEO and founder of SnapEDA, an online parts library, discusses the benefits of transparency in online libraries to designers, and discusses strategies on how to solve supply chain challenges, and more.

A Drone's-eye View of the IPC APEX EXPO Show Floor

If you couldn't make it to IPC APEX EXPO in San Diego, don't worry. We have full coverage of this annual must-attend event, from the opening ceremony to the close of the final day. To get a sense of the size of this year's show, check out our drone's-eye view of the show floor. Can we name our drone Air007?

Words of Advice: Flex Design and Manufacturing Training

In a recent survey, we asked the following question: Where do your technologists acquire training or expertise regarding flexible circuits? Here are just a few of the answers, edited slightly for clarity.

Joe Clark Discusses DownStream’s Updated Tool Lineup and IPC-2581

DownStream Technologies recently revamped their entire product line, from CAM350 through BluePrint-PCB. DownStream co-founder Joseph Clark and Guest Editor Kelly Dack discuss some of these updates, including a new GUI and capabilities such as 3D analysis, as well as news about IPC-2581.

IPC APEX EXPO 2019 Show Week Time-lapse Video

From set up to tear down, I-Connect007 captured a 4-day time-lapse video of the show floor from our Real Time with... IPC APEX EXPO booth. In addition, this video includes overhead shots of each of our generous premium sponsor's booths.


IPC APEX EXPO 2019: It's a Wrap!

The IPC APEX EXPO 2019 show floor closed yesterday with applause. After three days of meetings, networking, and tire kicking, if you will, exhibitors head back to their offices with a list of leads, to-do lists, and stories to share. Meanwhile, attendees now head home with important decisions to make about what they learned and who they want to do business with.

RTW IPC APEX EXPO 2019: Oren Manor Details New Camstar Electronics Suite

In this video interview, Nolan Johnson meets with Oren Manor—director of business development for Mentor, a Siemens Business—to discuss the introduction of their new Camstar Electronics Suite software, an innovative manufacturing execution system (MES) for electronics.

RTW IPC APEX EXPO 2019: For Elmatica, the Future is All About Data

At this year's IPC APEX EXPO, guest editor Judy Warner sits down with Elmatica CEO Didrik Bech to discuss the company's business model and CircuitData, their award-winning open-source PCB design data language.

The Designers Council: A Chapter Primer From the Ground Up

Thinking it might be a way to make new contacts with PCB designers in Orange County, I attended a couple of Designers Council meetings. The chapter president at that time was Paul Fleming, who asked me to be part of his steering committee because he learned that I had spent decades in fabrication. Within a few months, he had gotten a job transfer to Arizona, so he twisted my arm to take over as the chapter president. I agreed, but little did I know that this would become a major turning point in my PCB career.

The Sun Rises on IPC APEX EXPO 2019

It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.

In the Studio: Real Time with…IPC

It's almost time for IPC APEX EXPO 2019 at the San Diego Convention Center, and that means another Real Time with…IPC video program bringing you interviews with the electronics industry's top movers and shakers, engineers, and managers.

AltiumLive Munich Draws Designers from Around Europe

I’m finally unpacked after last week’s AltiumLive PCB design summit in Munich. Much like the AltiumLive event I attended in San Diego last October, the conference drew hundreds of PCB designers. This marked the second AltiumLive PCB design summit held in Munich, and Altium seems to have it down to a science. I spoke with designers from Germany, Austria, the Netherlands, and Belgium, just to name a few countries. Many of them were involved in the automotive segment but some were in medical and industrial controls as well. It’s great to be at an event that is full of PCB designers, because designers are few and far between at most PCB industry events.

STEM: The Future of Our Industry

Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.

The Quest for Perfect Design Data Packages

There’s an ongoing problem in the PCB industry: fabrication shops are receiving incomplete or inadequate design data packages, leaving manufacturers scrambling to fill in the blanks. For a quick-turn prototype shop like Washington-based Prototron, with over 5,000 customers and up to 60% of orders coming from new customers each month, that can add up to a lot of wasted time and effort just in the quoting stage. Dave Ryder, Prototron president, and Mark Thompson, engineering support, delve into this continuing issue and more.

Alun Morgan Discusses AltiumLive Munich Keynote

EIPC Chairman Alun Morgan will deliver a keynote speech at this week’s AltiumLive event in Munich, Germany. He gave us a quick preview of his keynote, and explained what his new job entails as technology ambassador with Ventec International Group.


Birds of a Feather: PCB Carolina and the RTP Designers Council

At PCB Carolina 2018, I met with show founders Tony Cosentino, Randy Faucette, and Lance Olive, who are all employees at the Better Boards service bureau in nearby Cary. I asked the trio to discuss the show’s history, its relationship to the Research Triangle Park (RTP) North Carolina Chapter of the IPC Designers Council, as well as the show’s tremendous growth over the past few years.

Top 10 Most-Read PCB Design Articles of 2018

Every year, we like to take a look back at the most popular PCB design news, articles, interviews, and columns. Without further ado, here are the top 10 most-read PCB design articles from the past year. Check them out.

Susy Webb: The History and Future of the Designers Council

When we started planning this issue on the IPC Designers Council, I knew I’d have to speak with design instructor Susy Webb, a longtime DC member and currently an executive board officer. I asked Susy to discuss how she first got involved with the DC, why designers should join their local chapter, and what the future holds for this group.

In Medical PCB Design, Innovation Never Stops

Medical electronics is an exciting field to be working in right now with new ideas coming online almost daily. We last interviewed medical PCB designer Kenneth MacCallum in 2015. Recently, I asked him to give us an update on trends he sees in medical electronics, and some of the challenges in adapting the latest technology to this segment of the industry.

Rick Almeida Discusses DownStream's Latest News

At the 2018 electronica exhibition in Munich, Rick Almeida, founder of DownStream Technologies, brings Editor Pete Starkey up to speed with the company’s latest news.

New Designers Council Column: The Digital Layout

The IPC Designers Council is launching a new column in Design007 Magazine: “The Digital Layout.” I recently asked two IPC Designers Council (DC) Executive Board members, Mike Creeden and Stephen Chavez, to discuss the content and objective of their new column, and how this all ties in with the DC.

Stephen Chavez: Breaking the Design Data Bottleneck

When we started planning this issue on design data, I knew we’d have to speak with PCB designer and EPTAC design instructor Steph Chavez. In this interview, he explains some of the biggest issues related to good design data handoff, and he offers some ways forward.

PCB Carolina 2018 Draws a Crowd of Technologists

PCB Carolina 2018, the one-day tabletop show based in Raleigh, North Carolina, drew quite a crowd to the McKimmon Conference and Training Center at NC State University on November 7. Show managers Tony Cosentino, Randy Faucette, and Lance Olive (all employees of the Better Boards service bureau) said that this year’s event showed signs of growth compared to the 2017 show, which was also larger than the previous year. They estimated that about 1,000 people attended this year, and they expect another increase in attendance in 2019.

Strategies to Manage Your China Business Through Turbulence

While the United States may be the world’s most open market, China remains the most competitive, and is still viewed by most U.S. and EU companies as the "last great opportunity for growth.” Many companies want to gain entry to the Chinese market share for their products or services. Thus, the competition for sales of products or services is correspondingly intense. Here's how to succeed in the world's second largest economy.

Cadence Presents New Software System and Technical Papers at PCB West 2018

During PCB West 2018, I spoke with Dan Fernsebner, product marketing group director, and Hemant Shah, product management group director for enterprise PCB products, both with Cadence Design Systems, about their new software launch—DesignTrue DFM Ecosystem. Fernsebner and Shah also address recent technical papers from Cadence on Industry 4.0, IPC-2581, system-level design, and return-path analysis and management.


Catching up With Scott McCurdy and Freedom CAD

During PCB West, Scott McCurdy of Freedom CAD Services sat down with Technical Editor Tim Haag for an interview. We discussed Freedom CAD’s latest news, some trends in PCB design software tools, and the continuing need to draw more young people into a career in PCB design.

Rick Hartley is Bullish on PCB Design, 3D Printing

At the recent PCB West in Silicon Valley, Consulting Technical Editor Tim Haag met with long-time design industry veteran Rick Hartley to discuss the changing landscape of circuit board design, the layout designers of the future, and how designers can benefit from 3D printing of circuit boards.

Leo Lambert Discusses IPC Training Program Updates

During SMTA International, EPTAC Technical Director Leo Lambert and Managing Editor Nolan Johnson discuss a variety of recent IPC educational program updates, many of which are designed to smooth out the training process. Lambert also explains how these changes will allow EPTAC instructors to optimize the way they present IPC classes, which include the CID and CID+.

Institute of Circuit Technology Hayling Island Seminar

After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.

Lee Ritchey Returns to AltiumLive with 32 Gbps Design Class

Lee Ritchey was one of the instructors for last year’s inaugural AltiumLive event, which drew hundreds of PCB designers. Now, Lee is back, teaching a high-speed design class at next week’s AltiumLive in San Diego. That class is sold-out, but you can catch Lee teaching the same class at the January AltiumLive event in Germany. I asked Lee to explain what he plans to cover in this course, and why PCB designers and design engineers should consider attending one of the events.

Moving From 28 Gbps NRZ to 56 Gbps PAM-4: Is it a Free Lunch?

The usual way of signaling through PCB interconnects is a two-level pulse, an encoding of 1s and 0s or bits, named NRZ (non-return-to-zero) or PAM-2 line code type. Increasing the data rate with the NRZ code type presents some obstacles. For a 28 Gbps NRZ signal, the bit time is about 35.7 ps with the main spectral lobe below 28 GHz. For a 56 Gbps NRZ signal, the bit time is about 17. 86 ps, with the main spectral lobe below 56 GHz. One can feel the problem already: Getting PCB interconnect analysis and measurements up to 56 GHz and beyond is very challenging, to say the least.

Judy Warner: AltiumLive’s Second Year to Be Even Better Than First

Last year, Altium launched its AltiumLive event with shows in San Diego and Munich, Germany. This year, the event has expanded to include an extra day of classes. Altium is gearing up for the San Diego event in early October and the German show in January 2019. I recent spoke with Judy Warner, director of community engagement for Altium, about what designers should expect at both shows, and how the company can build on the success of the 2017 events going into the future.

BGA Fanout Routing Overview

PCB developers are deluged with new challenges caused by increasing density and smaller components. Ball grid arrays (BGAs) create particular challenges during layout, with hundreds of connections in just a few square centimeters. Fortunately, designers now have options for addressing these issues.

3D Convergence of Multiboard PCB and IC Packaging Design

A new generation of 3D multiboard product-level design tools offer major improvements by managing multiboard placement in both 2D and 3D, and enabling co-design of the chip, package and board in a single environment. Multiboard design makes it possible to create and validate a design with any combination of system-on-chips (SOCs), packages, and PCBs as a complete system.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2

Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.


Sensible Design: Protecting PCBs from Harsh, Challenging Environments

Think very carefully about the sort of environment your PCB is likely to encounter. It is easy to over-engineer a product so that it will survive the very worst of conditions, but worst conditions may only be fleeting or transient. Therefore, a resin solution with a lower temperature performance specification will often cope. Take temperature extremes, for example. Your application may experience occasional temperature spikes of up to 180°C, which you might feel deserves treatment with a special resin.

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.

APCT Moves into Rigid-Flex with Cartel, Cirtech Acquisition

When I spoke with APCT President Steve Robinson a year ago, he said he was interested in adding flex and rigid-flex capabilities, and working closely with designers and engineers. With the recent acquisition of Cartel and their subsidiary Cirtech, APCT now has a flex and rigidflex facility, along with military and aerospace certifications. At DesignCon 2018, I asked Steve to discuss these acquisitions and what they mean for APCT and their customers.

Field Trip: CID Class Sees How Flex is Made at Streamline Circuits

While I was teaching my CID class for EPTAC in Santa Clara, I learned that we were only a block away from Streamline Circuits. Streamline does a lot of military and aerospace work, as well as communications and industrial electronics. The company manufactures quite a bit of multilayer flex and rigid-flex circuits, in addition to rigid boards. This would make a great field trip for my CID class!

Geeking Out at Geek-A-Palooza MSP 2018

Kiersten Rohde, I-Connect007 editor, covers Geek-A-Palooza MSP 2018. Geek-A-Palooza "is a different kind of gathering that combines networking with a fun, relaxing atmosphere." This event provided an opportunity for local electronics geeks from every industry segment to gather for a professional social event that included great music, food, drinks, games, raffle prizes, and booths.

American Standard Circuits Discusses New RF/Microwave eBook

During DesignCon 2018, I met with Anaya Vardya and John Bushie of American Standard Circuits. Anaya and John recently co-wrote an eBook, published by I-Connect007, titled "The Printed Circuit Designer’s Guide to Fundamentals of RF/Microwave PCBs." We discussed their goals and the scope of this handy microbook, which features plenty of information that even high-speed digital designers can benefit from.

Show & Tell: IPC APEX EXPO 2018 is on the Books!

I-Connect007's Happy Holden reviewed the recently concluded IPC APEX EXPO 2018. Among the highlights: Less than 10% of all new orders arrive at the PCB fabricator’s facility with complete, accurate design data. Most have missing or incorrect data.

Estonia a Hot Spot for New Technology

Most Westerners know very little about Estonia. A former Soviet Bloc country, Estonia has come a long way since restoring its independence in 1991. Electronics companies are thriving in this tiny EU member country, and capital city Tallinn has been called “Silicon Valley on the Baltic Sea.” During productronica, I met with Arno Kolk, general manager of the Estonian Electronics Industries Association, and we discussed the explosion of new technology in this “Baltic Tiger” country?

Succeeding at the Velocity of Technology: An IPC APEX EXPO 2018 Wrap-Up

After many months of planning, IPC APEX EXPO 2018 proved to be a success. From revolutionary advancements displayed on the show floor to expert insights conveyed in technical conference sessions and professional development courses, IPC APEX EXPO provided the learning and connections that helped 4,574 attendees from 43 countries prepare for the future.

Jan Pedersen: CircuitData Enhances Current Data Formats

During the Design Forum at IPC APEX EXPO 2018, Jan Pedersen, senior technical advisor for the PCB broker Elmatica, gave a presentation on CircuitData. The language is designed to help facilitate other design data transfer formats such as Gerber, ODB++, and IPC-2581. Jan spoke with Managing Editor Andy Shaughnessy and Contributing Technical Editor Happy Holden about how this open language works with the existing data formats, as well as the need to eliminate paper documents from design process, and how the industry can help shape this open-source language.


Martin Cotton Discusses Ventec’s New Book and Low-Loss Materials

During DesignCon 2018, Andy Shaughnessy sat down for an interview with Martin Cotton, director of OEM projects for Ventec. Martin was a PCB designer for years, so he has experience on both sides of the desk. They discussed Ventec’s reasons for coming to DesignCon, their expansion into low-loss materials, and Ventec’s new I-Connect007 book, The Printed Circuit Designer’s Guide to Thermal Management with Insulated Metal Substrates.

IPC-2581 Demo Draws a Crowd at IPC APEX EXPO

During IPC APEX EXPO 2018, the IPC-2581 Consortium held a demo of this open-source data transfer standard, attracting numerous designers, fabricators and assembly providers. Jim Pierce of Axiom Electronics and Bob Miklosey of Aegis Software sat down to discuss the demo and their involvement with the consortium. Axiom now charges more for designs submitted in the Gerber format.

Still Using 1980s Formats for Design Data Handoff?

The IPC-2581 format was created in the early 2000s with the merger of two competing formats: ODB++ and GENCAM. The new format, the brainchild of the late Dieter Bergman, languished with no adoption until 2011, when a small group of companies created the IPC-2581 Consortium with the goal of getting this open, neutral and intelligent format adopted. The consortium has been growing steadily in recent years. Its membership now includes more than 100 associate members in addition to its more than 90 corporate members.

RTW IPC APEX EXPO: Polar Instruments Discusses New Engineer, SpeedStack Upgrades

During IPC APEX EXPO 2018, Polar Instruments' Lupita Maurer and Geoffrey Hazelett sat down with Editor Andy Shaughnessy to discuss upgrades to their SpeedStack tool and Lupita's new position with the company.

Start Your IPC APEX EXPO Show Experience Here

As many prepare to travel to California from February 24 to March 1, IPC APEX EXPO 2018 will offer a collection of exciting events for both newcomers and industry veterans, including educational opportunities and showcase exhibitions. Want a sneak peek into the upcoming events at IPC APEX EXPO 2018? This exclusive pre-show coverage publication from I-Connect007 is all about San Diego or bust!

Who Really Owns the PCB Layout? Part 2

In Part 1 of this series, Paul Taubman made the bold statement that the PCB layout is just as much a mechanical effort as it is an electrical one. In Part 2, he threads the needle, explaining why he believes that a PCB truly a mechatronic design, and why mechanical engineers may be more prepared to take on the PCB layout.

Thermal Management Update with Doug Brooks

I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.

Mike Jouppi Discusses his Drive for Better Thermal Data

If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.

That’s Hot: Ventec’s Goodwin on Thermal Management

IPC’s fall committee meetings were held in conjunction with SMTA International, as has been the case for several years now. Patty Goldman sat in on some subcommittee meetings, including one on laminates, where she met up with Ventec COO Mark Goodwin for a discussion on thermal management from a laminate supplier’s perspective.

The Impact of HDI on PCB Power Distribution

A key aspect of HDI technology is the use of microvias. For reference, the IPC HDI Design Committee has identified microvias as any hole equal to or less than 150 microns. Multiple types of HDI stack-ups associated with blind and buried microvias can be used to meet the density and cost requirements for today’s products. Design teams should develop stack-ups in conjunction with the fabricator to minimize cost and meet signal integrity requirements.


Nancy Jaster Brings Manufacturing, Design Background to Designers Council

Nancy Jaster was recently named the head of the IPC Designers Council. At the recent AltiumLive 2017 event, I spoke with Nancy about her unique background in both design and manufacturing, and how she hopes to use that experience and mindset to revitalize the Designers Council going forward, particularly with the International and student chapters. We also discussed her plans to bring more young people, particularly women, into the industry.

Zuken Teams With Nano Dimension for 3D Printing Design Flow

At PCB West, Zuken shared a booth with Nano Dimension. Zuken has been working with Nano Dimension for some time, and adding support for 3D printing and nanotechnology to its design tool platforms. I sat down with Zuken’s Humair Mandavia and Nano Dimension’s Simon Fried to learn more about this alliance, and to find out more about this odd-looking box being demonstrated in Zuken’s booth.

AltiumLive Summit—Munich, Germany, Part 1

Altium held a very successful AltiumLive PCB Design Summit in San Diego, California at the beginning of October for the benefit of their North American design community, and followed it three weeks later with a counterpart European event in Munich. And what an eye-opener it proved to be—literally hundreds of delegates, a superbly organised and managed programme, billed as a completely immersive two-day interactive design experience on a theme of learning, connecting and getting inspired.

Insulectro Teams with Isola to Address Signal Integrity Needs

Insulectro and Isola recently shared a combined booth during PCB West 2017. Insulectro has distributed Isola materials for years, and the companies wanted to focus on Isola’s line-up of high-speed, low-loss material sets. Insulectro’s Chris Hunrath, VP of Technology, and Norm Berry, Director of Laminates and OEM Marketing, sat down with me to discuss the challenges facing signal integrity engineers today, and some of the Isola low-loss, low-Dk materials that can help with their signal integrity requirements. You might find Chris and Norm speaking to a group of PCB designers near you.

GCSI's James Kozich Discusses Industry Hiring Trends

James Kozich of Gilbert Consulting Services has been matching qualified technologists with the right jobs for decades, from the shop floor to C suite positions. During SMTA International, he sat down with Andy Shaughnessy to discuss the recent hiring trends he's seeing in electronics manufacturing.

A Guide to IPC Survey and Report Season

IPC Director of Market Research Sharon Starr found time to discuss the recently conducted and published surveys and research reports and a few others still in the works. These reports are free to survey participants, which is certainly a great incentive for taking the time to complete them. (Hint: That’s a call to action for those of you sitting on the sidelines.)

PCB Signal Integrity Optimization Using X-ray Metrology

It happens again. A new backbone router/switch build or a line card upgrade is approaching completion when something goes wrong. The system won’t operate at the targeted data rate. Deadlines are looming and the root cause of the problem is buried somewhere in a big rack of electronic components.

Enough Blame to Go Around

The idea for this article began a few months ago when The PCB Design Magazine conducted a reader survey regarding the topic “Whose Fault is that Bad Board?” After some thought, I submitted my answers. After all, I must have some kind of input after over 25 years of PCB design. But still, whose fault is that bad board? OK, I know what you’re thinking: Don’t go there. We designers make mistakes too.

Stephen V. Chavez Talks Mil/Aero PCB Design

Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.

Orange Co. Designers Council Meeting Focuses on Embedded Passives

On July 19, the Orange County Chapter of the IPC Designer’s Council hosted a lunch-and-learn meeting in Tustin to discuss the benefits of embedded passives. Approximately 40 people were in attendance, which was lighter turnout than usual, most likely because of summer vacations. But the crowd was an enthusiastic one, as usual. The first speaker was Bruce Mahler of Ohmega Technologies, followed by Jin Hyun-Hwang of Dupont.


IMPACT Interview: Fern Abrams, IPC

At the recent IMPACT Washington D.C. 2017 event, I-Connect007's Patty Goldman speaks with IPC's Fern Abrams to get the inside story on the meeting with EPA.

PCB Designers Notebook: Embedding Components, Part 2

Technology and processes for embedding capacitor and inductor elements rely on several unique methodologies. Regarding providing capacitor functions, IPC-4821 defines two methodologies for forming capacitor elements within the PCB structure: laminate-based (copper-dielectric-copper) or planar process and non-laminate process using deposited dielectric materials.

Review of the 2017 IPC Reliability Forum

IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.

A Deep Look Into Embedded Technology

In preparation for this month’s magazine, we set up a conference call with the goal of uncovering the challenges and opportunities related to embedded technology. Invited were a handful of the industry’s heavy hitters in the embedded world: Retired technologist and I-Connect007 Contributing Editor Happy Holden, and Ohmega’s Technical Director Daniel Brandler and Design & Test Engineer Manuel Herrera.

Better Together: How HDP User Group Showcases the Industry’s Best Side

HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1

Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.

Must Work Well on a Team; CID a Bonus

Throughout my decades-long career in PCB design, I have been fortunate. I’ve only had to search for a job out of desperation once. I had no idea my IPC Certified Interconnect Designer credentials would come in handy when I hit the pavement. It also helped that I am known to "work well on a team." It turns out that being able to play well with others is a real plus in the PCB design community.

HDP User Group 2017 European Meeting Highlights Technology Progress

The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.

San Diego IPC Designers Council Meeting Held at Del Mar Show

The Del Mar Electronics and Manufacturing Show is a long-time favorite among PCB professionals. What better place to hold a meeting of the San Diego Chapter of the IPC Designers Council? Each year, the San Diego Chapter of the Designers Council hosts their largest meeting of the year at the Del Mar show. This year, approximately 50 PCB designers and electronics professionals attended the lunch-and-learn meeting.


IMPACT Washington 2017 Just Around the Corner

IPC's Government Relations team has worked around-the-clock to ensure that IMPACT Washington D.C. 2017 is the best yet. During this two-and-a-half day event, executives from IPC-member companies will have the opportunity to speak with leaders in Congress and the Administration in support of our common priorities.

Capitol Connection: IMPACT Update—To CEOs on Why You Should Attend IMPACT Washington, D.C. 2017

Here at IPC, we place a high priority on making our presence known in the halls of government, because so many policy debates have a direct effect on the electronics manufacturing industry. IMPACT Washington, D.C. 2017 is a chance to join with fellow industry executives in advocating for better public policies for a stronger, more advanced manufacturing economy.

Perpetual or Subscription EDA Tool Licenses? That is the Question

After I began working at Altium, I started learning all I could about PCB design software licensing. I wondered about the pros and cons of perpetual vs. subscription licenses. I wanted to learn firsthand from PCB designers what kind of benefits they received and challenges they faced as a result of how EDA companies offered design tools. I reached out to a variety of sources to get a broad slice of insight into this evolving issue, and thus began my trip down the EDA licensing software rabbit hole.

Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017

When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.

Capitol Connection: Direct Legislative Action—IMPACT Washington, D.C. 2017

This ties in to why IPC–Association Connecting Electronics Industries invests so much into our government relations efforts. We place a high priority on government relations because so many public policy debates have large impacts on our industry. Our members continue to value our advocacy efforts on issues such as taxes, regulations, immigration and the environment.

A New Power Design Methodology for PCB Designs

Advanced PCB design is an iterative process of analysis-fix-analysis. Historically, this process is very time-consuming, requiring analysis experts and PCB designers to work together to find and fix layout problems. This article describes a new PCB design methodology that allows a PCB designer to perform the power design without having to run expert-level analysis tools. This methodology provides the setup automation for advanced analysis without the need to understand every minute parameter, and can be completed in a few steps.

Tom Hausherr Discusses PCB Libraries’ BOM Builder Service

PCB Libraries CEO Tom Hausherr and Editor Kelly Dack discuss PCB Libraries’ new BOM Builder service during IPC APEX EXPO. Equipped with the new LEAP technology, the BOM Builder can potentially save PCB designers days or weeks of time normally spent turning a BOM into a CAD library.

Exciting New Technology: Thermal Risk Management

Two years ago I entered into a collaboration with Dr. Johannes Adam, from Leimen Germany. Johannes has written a software simulation tool called Thermal Risk Management (TRM). We used it to look at the thermal characteristics of PCB traces under a variety of conditions, and it is hard for me to contain my excitement and enthusiasm for what it does and what we learned about traces using it. Our collaboration resulted in the publication of numerous articles and a book. In this article, I’ll talk about some of the capabilities of TRM that really caught my attention.

RTW IPC APEX EXPO: APEX EXPO Wrap-up Roundtable

Publisher Barry Matties and Managing Editor Andy Shaughnessy join Bob Neves of Microtek Labs for a review of IPC APEX EXPO 2017 and a look at the state of the PCB industry.

Kelly Dack and Mike Creeden: Are We in a PCB Design Renaissance?

Technical Editor Kelly Dack and San Diego PCB founder Mike Creeden discuss some of the trends they're seeing in the PCB design community, including greater numbers of young people becoming designers and more EEs doing design work. They also focus on IPC's training and designer certification efforts, and the need for designers to get out of the office and visit a board shop once in a while.


Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!

During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.

Real Time with...IPC 2017 Videos Now Available for Viewing

Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.

EIPC 2017 Winter Conference Review of Day 2

Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!

In Deep: The Art and Science of DFM with Gary Ferrari

When the topic of DFM techniques came up, I knew I had to talk with Gary Ferrari of FTG Corp. Gary has been involved with designing and manufacturing PCBs for decades, and he’s the past co-founder and executive director of the IPC Designers Council. I caught up with Gary between Thanksgiving and Christmas, and we conducted the following interview.

Help Wanted! Our 2017 Industry Hiring Survey

This month we conducted an industry survey on plans for hiring during the year. Included here is a summary of the results. We started by simply asking, “Do you plan to hire additional people this year?” More than half of the respondents answered yes while about a third said no—which we take as an optimistic sign that our industry plans to expand in 2017.

IPC Designers Council San Diego Chapter Meeting: Flex Focus Fills the House

A report from the January meeting of the San Diego chapter of the IPC Designers Council. The meeting was hosted by the PCB design bureau San Diego PCB, with the featured guest speaker John Stine of Summit Interconnect. Stine’s presentation focused on flex and rigid-flex DFM, and he offered a variety of helpful design tips to the full house of 30-40 designers in attendance.

A Handy Compilation of Our Top 10 DFM Articles

When we started working on this DFM issue, I searched through our files and found that we’ve published some great DFM articles over the past year or so. While topics like signal integrity tend to get most of the limelight, in the end it all comes down to solid DFM practices. So, without further ado, we present this compilation of our Top 10 DFM articles and columns.

Now is the Time for Comprehensive Tax Reform

Tax policy is among the most basic tools of any government to accomplish its objectives. From the private sector perspective, taxes are one of largest expenses of any business. But despite being such an important topic for government and business, there is widespread agreement that the U.S. federal tax code is a mess.

CES 2017: Disruptive Technologies

Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.

Top 10 Most-Read Design Articles of 2016

Every January, I like to go back through the last year and see which articles had the highest number of views. They're usually the articles that bring you PCB design and industry information that's relevant to your job. Check out the most-read PCB design articles from 2016.


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