Article Highlights
Leo Lambert Discusses IPC Training Program Updates
10/17/2018 | Real Time with...SMTAI
Simon Fried: Additive Manufacturing Through Printed Electronics
10/17/2018 | Barry Matties, Publisher, I-Connect007
Cadence: Bullish on AI
10/15/2018 | Andy Shaughnessy, Design007 Magazine
Artificial Intelligence: The Future of EDA?
10/10/2018 | Andy Shaughnessy, Design007 Magazine
One-Question Survey: What Advice Would You Offer a New Designer?
10/10/2018 | Nolan Johnson, I-Connect007
Design :: Interview

Latest Articles

Simon Fried: Additive Manufacturing Through Printed Electronics

Simon Fried, president of Nano Dimension, discusses how the company has taken the additive manufacturing process to the next level through printed electronics. He also shares his thoughts on the growing demand for 3D circuits, as well as how this could potentially be a game-changer for PCB designers.

Cadence: Bullish on AI

David White has been involved with artificial intelligence research for almost 30 years. Now, David is the senior group director of R&D for Cadence Design Systems, and I knew we’d have to speak with him for this issue on AI. In a recent interview, we discussed his decades of work in AI, Cadence’s research into AI and machine learning, and what he believes AI could mean for the EDA tools of the future.

Artificial Intelligence: The Future of EDA?

Artificial intelligence (AI) has been making inroads into a variety of industries in the past decade or so, from automobiles to medical devices. Naturally, EDA tool companies are taking a look at AI. Does AI offer a way forward for PCB design tool developers? I recently interviewed Paul Musto, director of marketing for the Board Systems Division of Mentor. We discussed Mentor’s plans for integrating AI into EDA tools, and why we may be at the very beginning of understanding the pros and cons of this new technology.

Institute of Circuit Technology Hayling Island Seminar

After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.

John R. Watson Returns to AltiumLive in San Diego

When AltiumLive launched last year, John R. Watson, CID, of Legrand signed up as an instructor. He’ll be presenting at this week’s AltiumLive in San Diego as well. I spoke with John recently about his AltiumLive class, and the state of PCB design. He also discussed a few tricks for designing boards with components that are currently on an 80-week lead time, and why this problem is likely to get worse before it gets better.

Front-End Expert Mark Thompson of Prototron Circuits Publishes Book on Producing the Perfect Data Package

Errors and inaccuracies slow the process down because the CAM department has to correct their data package or ask customers to clarify their intent. In the quick-turn prototype business where people pay for time, a slowdown on a three-day turn can be a disaster. I recently sat down with Thompson to find out more about his new book and discuss the quest for the perfect data package.

Artificial Intelligence: More Questions than Answers

I’ve been covering artificial intelligence (AI) and related technologies for years, particularly at events such as the annual Consumer Electronics Show (CES). As I write this, we are in the run-up to CES 2019, and the Artificial Intelligence Conference in San Francisco, so the AI landscape is likely to change—at an ever-accelerating rate. Let’s look at some of the challenges facing AI now, and then after CES 2019 we can take another look.

Chuck Bauer Discusses the Future of Packaging

When we decided to cover the future of PCB packaging, we knew we would have to interview Charles Bauer, Ph.D., owner of TechLead Corporation. Chuck recently spoke with Happy Holden, Andy Shaughnessy and Barry Matties about current trends in packaging, the need for product designers and manufacturers to communicate, and why no matter how cool the technology is, cost is still king.
NEXT
Copyright © 2018 I-Connect007. All rights reserved.