Lost your password?
Not a member?
Resend confirmation instructions
Sort By Category
- New Technology
- New Products
- PCB Industry
- Signal Integrity
- Breaking News
- IPC Standards
- From The Show
Moving From 28 Gbps NRZ to 56 Gbps PAM-4: Is it a Free Lunch?
09/19/2018 | Yuriy Shlepnev, Simberian
Judy Warner: AltiumLive’s Second Year to be Even Better Than First
09/19/2018 | Andy Shaughnessy, Design007
PCB Design Challenges: A Package Designer’s Perspective
09/17/2018 | Bill Acito, Cadence Design Systems
Managing the Challenges of Flex and Rigid-Flex Design
09/12/2018 | Dave Wiens, Mentor, a Siemens Business
Chuck Bauer Discusses the Future of Packaging
09/05/2018 | I-Connect007 Editorial Team
Design :: Twitter
Advanced Stackup Planning with Impedance, Delay and Loss Validation
A typical PCB design usually starts with the material selection and stackup definition—the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget?
Susy Webb: Training the New Generation of Designers
For years, I’ve been running into Susy Webb at PCB West, where one of the classes she teaches is PCB design basics. I always ask Susy about the class, especially the attendees’ backgrounds. Over the years, her class has begun drawing more and more degreed engineers, with fewer “traditional” PCB designers attending. I asked Susy to discuss the next generation of PCB designers, some of the trends she’s seeing among new PCB designers, and the need for designers to take charge of their own design training, whether their management agrees or not.
Thermal Management Materials: Easing the Decision-Making Process
There are many different types of thermally conductive materials, and choosing between them will be dictated by production requirements and application design, as well as critical performance factors that must be achieved.
RTW IPC APEX EXPO: Judy Warner Discusses EDA Market and Altium's Growth
Judy Warner, Altium's director of community engagement, discusses what it's like transitioning to the EDA software side of the business. Warner also highlights Altium's growth after reporting first-half earnings.
Tips & Tricks: Rule-Based PCB Layout
You’ll need to refer to your fab house, both to ensure that they can build what you need, and to get the final say on their design rules. Some fab houses even have downloadable design rules for various CAD packages. That makes setting things up a lot easier.
Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection
A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.
The automotive electronics segment has exploded. Early cars didn’t have much in the way of electronics. Even in 1950, electronics made up only 1% of a car’s cost. But that figure is expected to hit 35% in 2020, and 50% in 2030--and that means a whole lot of PCBs. This issue of The PCB Design Magazine features the impact of increasing electronics content in cars on the PCB design and manufacturing industry.
Polar Talks Impedance and Insertion Loss Testing
Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about controlled impedance and insertion loss testing.
Press Release Tips
Copyright © 2018 I-Connect007. All rights reserved.