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Words of Advice: Making Life Easier for Fabrication and Assembly
10/17/2019 | Andy Shaughnessy, Design007 Magazine
Words of Advice: Starting a New Design
10/14/2019 | Andy Shaughnessy, Design007 Magazine
ODB++: Transforming Ideas Into Products
10/09/2019 | Max Clark, Mentor, a Siemens Business
Bob Martin Brings Maker Attitude to AltiumLive Keynote
10/07/2019 | Andy Shaughnessy, Design007 Magazine
Words of Advice: What Data Format do you Send Your Assembly Provider?
10/03/2019 | I-Connect007 Research Team
Design :: Twitter
Communication, Part 2: Design Data Packages
The first part of this six-part series highlighted ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop. In Part 2, Bob Chandler and Mark Thompson talk about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages.
K&F Electronics Hiring Young People for the Future
At the SMTA show in Atlanta, I spoke with Rick Kincaid, founder of K&F Electronics, about his son Sean taking over the family business as well as the current uncertainty with trade tariffs.
Libraries: A Must-have for Design
I-Connect007 was invited to attend a session of the Orange County Chapter of the IPC Designers Council (DC). Even though I have been an IPC member for over half a century (yes, almost since vacuum tubes dominated design), this was my first DC event.
ESD Alliance Advisory Council to Shape ES Design West at SEMICON West
The Electronic System Design Alliance, a SEMI Strategic Association Partner, today hosted the first meeting of the Advisory Council of ES Design West co-located with SEMICON West 2019 West at San Francisco’s Moscone Center, July 9-11, 2019.
Cadence Presents New Software System and Technical Papers at PCB West 2018
During PCB West 2018, I spoke with Dan Fernsebner, product marketing group director, and Hemant Shah, product management group director for enterprise PCB products, both with Cadence Design Systems, about their new software launch—DesignTrue DFM Ecosystem. Fernsebner and Shah also address recent technical papers from Cadence on Industry 4.0, IPC-2581, system-level design, and return-path analysis and management.
Book Review: The Printed Circuit Board Designer’s Guide to… Producing the Perfect Data Package
Over the course of his career, Mark Thompson, CID+, engineering support at Prototron Circuits, has evaluated thousands of data packages and delivered numerous talks to designers and engineers about how to create the perfect package. In the spirit of “garbage in, garbage out,” data packages must be perfect to create quality boards. Learn all this and more in The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package!
Karl-Heinz Fritz on Cicor’s DenciTec Technology
In a recent interview, Karl-Heinz Fritz, VP of technology at Cicor, discusses the business, DenciTec technology, the impact of tariffs on trade, and applications for 3D printing and additive manufacturing, including potential new opportunities for PCB designers.
Advanced Stackup Planning with Impedance, Delay and Loss Validation
A typical PCB design usually starts with the material selection and stackup definition—the stackup planning or design exploration stage. How reliable are the data provided by the material vendors and PCB manufacturers? Can we use these data to predict trace width and spacing for the target trace impedance or to calculate delays or evaluate the loss budget?
Susy Webb: Training the New Generation of Designers
For years, I’ve been running into Susy Webb at PCB West, where one of the classes she teaches is PCB design basics. I always ask Susy about the class, especially the attendees’ backgrounds. Over the years, her class has begun drawing more and more degreed engineers, with fewer “traditional” PCB designers attending. I asked Susy to discuss the next generation of PCB designers, some of the trends she’s seeing among new PCB designers, and the need for designers to take charge of their own design training, whether their management agrees or not.
Thermal Management Materials: Easing the Decision-Making Process
There are many different types of thermally conductive materials, and choosing between them will be dictated by production requirements and application design, as well as critical performance factors that must be achieved.
RTW IPC APEX EXPO: Judy Warner Discusses EDA Market and Altium's Growth
Judy Warner, Altium's director of community engagement, discusses what it's like transitioning to the EDA software side of the business. Warner also highlights Altium's growth after reporting first-half earnings.
Tips & Tricks: Rule-Based PCB Layout
You’ll need to refer to your fab house, both to ensure that they can build what you need, and to get the final say on their design rules. Some fab houses even have downloadable design rules for various CAD packages. That makes setting things up a lot easier.
Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection
A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.
The automotive electronics segment has exploded. Early cars didn’t have much in the way of electronics. Even in 1950, electronics made up only 1% of a car’s cost. But that figure is expected to hit 35% in 2020, and 50% in 2030--and that means a whole lot of PCBs. This issue of The PCB Design Magazine features the impact of increasing electronics content in cars on the PCB design and manufacturing industry.
Polar Talks Impedance and Insertion Loss Testing
Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about controlled impedance and insertion loss testing.
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