Sensible Design: Thermal Management Materials—Golden Rules for Product Selection

Selecting the right type of thermal management method that will suit a particular electronic assembly and its predicted operating conditions is far from easy. There are a number of stages in the selection process that you should consider taking before you decide upon a particular material or material format, whether paste or pad. In this column on achieving effective thermal management of electronic assemblies, I will revisit our trusted question-and-answer format to bring you some essential pointers, beginning with a few cautionary notes on pain points—the occasional pangs of agony you will have to face during the decision-making process.

1. What key pain points are associated with thermal management products?

Well, where do I begin? There are a host of materials and methods out there to choose from, and they serve a variety of purposes depending upon the physical constraints of the application, its environmental considerations, the severity of duty, component layout, assembly geometry, etc.

When choosing an appropriate product, a first question to ask yourself is, “What data can be relied upon?” Certainly, there are some excellent technical data sheets out there that any self-respecting supplier will have taken great care to produce accurately and in good faith. But do you really know what thermal conductivity you will need, for example? And do you know how much material will be needed in the interface between component and heat sink to achieve a thermally stable assembly?

Think about the practicalities and how you intend to apply the material. Will it be manual or automated? And don’t forget those niggling details that tend to get overlooked such as the conditions of the operating environment, which might cause pump-out, for example); migration of the interface material and its effects on the surrounding components or the materials used in the construction of the assembly, which are likely to include sensitive plastics; and special coatings. For guidance on all of this, read on.

2. How do I avoid these pain points?

To answer this and the questions raised in the previous paragraphs, let me give you two golden rules that should at least get you on the right path to making informed choices.

Rule 1

By all means, read through the technical data sheets, but don’t just compare the values on paper. Get some product samples and see how they behave in a real application. A good supplier will be more than happy to accommodate this type of request, and some may even offer in-house test facilities to help you make the right decision. I cannot stress enough the importance of this test-before-you-buy approach. If a thermal management product is not tested before use, the end performance of your product might be very different to what you expected. If you value your reputation in the market, it is vital to ensure that the desired efficiency of heat transfer can be achieved and retained over the expected lifetime of your product.

To read this entire column, which appeared in the February 2019 issue of Design007 Magazine, click here.

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2019

Sensible Design: Thermal Management Materials—Golden Rules for Product Selection

03-28-2019

Selecting the right type of thermal management method that will suit a particular electronic assembly and its predicted operating conditions is far from easy. There are a number of stages in the selection process that you should consider taking before you decide upon a particular material or material format, whether paste or pad. In this column on achieving effective thermal management of electronic assemblies, I will revisit our trusted question-and-answer format to bring you some essential pointers, beginning with a few cautionary notes on pain points—the occasional pangs of agony you will have to face during the decision-making process.

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Sensible Design: Getting the Best Performance from Encapsulation Resins

03-07-2019

When I last broached the subject of potting and encapsulation resins, I went into some depth on the subject, explaining their chemistries and physical properties, how they behave when being mixed, applied and cured. For this column, I’m going to return to our tried-and-trusted Q&A format to offer four commonly asked questions about resins and their application, together with my responses, which I hope will help you achieve the best outcomes for all your potting and encapsulation jobs. So, setting material choice aside for the moment, let’s start with a key aspect of potting: getting the resin in place.

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Top Five Tips to Protect PCBs from Harsh Environments

01-02-2019

First, think very carefully about the sort of environment your PCB is likely to encounter. It is easy to over-engineer a product so that it will survive the very worst of conditions, but worst conditions may only be fleeting or transient. Therefore, a resin solution with a lower temperature performance specification will often cope. Take temperature extremes as an example; your application may experience occasional temperature spikes of up to 180°C, which you might feel deserves treatment with a special resin. However, such excursions may only be short-lived.

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2018

Sensible Design: Top Tips for Successful Potting

12-19-2018

For effective potting, ideally, the layout of the circuit components should be such that the material can flow smoothly around them without too much turbulence. When possible, it is always good practice to space components in a regular pattern. Irregular spacing—particularly bunching of components in discrete areas of the PCB—causes the formation of eddies in the resin as it is poured, which can lead to voids and air entrapment, which compromise the thermal performance of the resin.

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Do's and Don'ts of Thermal Management Materials

10-18-2018

Selecting a thermal management material that is broadly applicable to a particular electronic assembly and its predicted operating conditions is a good starting point; however, as with many of these things, the devil is very much in the details! Find out the key considerations in choosing your materials.

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Conformal Coatings: An Evolving Science

09-26-2018

One of the trends impacting the electronics assembly industry is the continuing miniaturization of electronics products. This article sheds more light on coating problems posed by this trend, as well as provide key considerations when it comes to coating properties, selections, and applications. Read on to find answers to five of the best coating-related questions that frequently arise during preliminary consultations.

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Thermal Management Materials: Easing the Decision-Making Process

08-02-2018

There are many different types of thermally conductive materials, and choosing between them will be dictated by production requirements and application design, as well as critical performance factors that must be achieved.

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Protecting PCBs from Harsh, Challenging Environments

07-03-2018

Think very carefully about the sort of environment your PCB is likely to encounter. It is easy to over-engineer a product so that it will survive the very worst of conditions, but worst conditions may only be fleeting or transient. Therefore, a resin solution with a lower temperature performance specification will often cope. Take temperature extremes, for example. Your application may experience occasional temperature spikes of up to 180°C, which you might feel deserves treatment with a special resin.

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My Top Coating Queries

04-04-2018

This is my first of many columns for 2018, and I have decided to share some top trending queries that concern many different applications and areas. LEDs are always a hot topic, as are volatile organic compounds (VOCs) and harsh environment concerns.

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2017

Heat Transfer and Thermal Conductivity: The Facts

12-26-2017

In my first two columns, I presented a broad introduction to the subject of thermal management of electronic circuits. This month I’m taking a closer look at thermal interface materials—how they can be applied to achieve efficient heat transfer, and the significance of bulk thermal conductivity in relation to heat transfer and thermal resistance.

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Thermal Management—The Heat is On

09-25-2017

Thermal management materials are designed to prolong equipment life and reduce incidences of failure. They also maintain equipment performance parameters and reduce energy consumption by reducing operating temperatures, and minimising the risk of damage to surrounding components. Indirectly, they maintain brand reputation, as the reliability of the equipment will be very dependent upon the effectiveness of the thermal management technique used.

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Resins: Cutting Through the Technical Jargon

08-21-2017

This month, I’m going to cut through some of the more heavy-going tech-speak, taking a few of my customers’ more frequently asked questions about resins to try to help you refine your selection process. There’s a lot of ground to cover, but for the purposes of this column, let’s concentrate on the PCB’s operating environment, caring for the components that are to be encapsulated, and the special needs of applications like LED lighting and RF systems.

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Casting a Spotlight on Resin Applications

05-03-2017

Over the last few columns, I’ve given readers pointers on virtually every aspect of potting and encapsulation resins, ranging from their formulations and special properties to their applications, benefits and limitations. It’s probably high time, therefore, to take a step back from the do's and don’ts and focus instead on how these resins are bringing very real benefits to practical electronic and electrical engineering applications. A good starting point is to look at the special requirements of an industry that is enjoying explosive growth: LED lighting.

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2016

Resins: Five Essentials to Achieve the Right Cure

12-19-2016

In my previous column, I looked at some of the critical things you need to consider before selecting your resin. Of course, when it comes to the choice and application of resins, there’s a lot of information to take in, and over the following months I hope to distill this and provide some useful tips and design advice that will help you in your quest for reliable circuit protection.

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Why are Resin Properties So Important?

11-21-2016

I started this series of columns on resins by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions. I hope readers found this useful. Of course, when it comes to the choice and applications of resins, there’s a great deal more to discuss.

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The Little Guide to Resins

10-17-2016

I would like to start this series of columns by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions.

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Conformal Coatings - Beware the Boards that ‘Bare’ All!

09-21-2016

This month, Phil Kinner departs from his usual format of providing five essential facts about conformal coatings. Instead, he provides an account of a customer’s problem—no company names mentioned, of course—that brought into question the adhesion performance of a coating that they had been using successfully for some time.

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When Coatings Go Wrong

08-23-2016

This month, I consider some of the more common, and often very frustrating, problems that may be encountered when coating electronic circuit boards and components. I also discuss some practical solutions. As we all know, nothing in life is straightforward.

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Coatings—Five Essentials for Designers

06-28-2016

In an ideal world, PCB designs would not have an inherent weak point for corrosion; unfortunately, in the real world, they do. When a weak point is revealed, you are better equipped to deal with it. Often the spacing of components, board finish and distance to ground planes can be optimised for corrosion resistance.

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