Lightning Speed Laminates: The Dilemma--Soldermask for High-Frequency PCBs


Reading time ( words)

High-frequency and high-speed digital PCBs may not have issues with soldermask. However, depending on their construction, other PCBs can have an issue with soldermask causing degraded electrical performance. PCBs with a stripline structure, in which the signal layer is buried within a multilayer, typically do not have an issue with electrical performance degradation due to soldermask. Soldermask can impact PCBs with RF circuitry on the outer layers, which can lessen high-frequency electrical performance.

Typically, PCBs with RF traces on the outer layers have minimal or no soldermask in the RF circuitry areas. Many times the soldermask is applied in areas where components are soldered to the PCB but the soldermask is developed away in the areas where conductors have critical RF performance. There are many reasons to avoid soldermask coverage on RF conductors, due to inherent soldermask properties. Most soldermask used in the PCB industry is liquid photoimageable (LPI), which is typically high in dissipation factor (Df) and high in moisture absorption, and the thickness can vary due to processing or design.

The typical soldermask has a dissipation factor of about 0.025 when tested at 1 GHz, and moisture absorption is about 1–2% depending on the formulation. For comparison, many high-frequency laminates have a Df value of about 0.005 or better and moisture absorption is typically no worse than 0.3%. The higher Df property of soldermask raises the circuit’s dielectric loss, which causes an increase in insertion loss. The moisture absorption can cause differences in impedance and phase response, but it is typically more problematic for losses where it can cause increased insertion loss.

Another point to consider is that RF circuitry on the outer layer of a PCB will usually be a microstrip or grounded coplanar waveguide (GCPW) structure. Both of these structures can have lower insertion loss and they get some loss benefit due to their fields using air. Air is the lowest-loss medium for electromagnetic waves, and these waves use electric and magnetic fields. When a microstrip or GCPW is covered with soldermask, some of the fields which were using air as the dielectric medium are now using soldermask instead.

To read this entire article, which appeared in the June 2016 issue of The PCB Design Magazine, click here.

Share

Print


Suggested Items

Top 10 Most-Read PCB Design Articles of 2018

01/03/2019 | I-Connect007
Every year, we like to take a look back at the most popular PCB design news, articles, interviews, and columns. Without further ado, here are the top 10 most-read PCB design articles from the past year. Check them out.

Calculation of Frequency-Dependent Effective Roughness Dielectric Parameters for Copper Foil Using Equivalent Capacitance Models

01/02/2019 | Marina Y. Koledintseva, Metamagnetics Inc.*, and Tracey Vincent, CST of America
Knowledge of the correct parameters of laminate PCB dielectrics refined from any copper foil roughness impact and the proper foil roughness characterization are important constituents of modeling high-speed digital electronics designs.

Karl-Heinz Fritz on Cicor’s DenciTec Technology

10/24/2018 | Nolan Johnson, I-Connect007
In a recent interview, Karl-Heinz Fritz, VP of technology at Cicor, discusses the business, DenciTec technology, the impact of tariffs on trade, and applications for 3D printing and additive manufacturing, including potential new opportunities for PCB designers.



Copyright © 2019 I-Connect007. All rights reserved.