Tim’s Takeaways: The Basics of Hybrid Design, Part 3


Reading time ( words)

In the first two parts of this series, we discussed the basics of hybrid design from the PCB designer’s perspective, and this month we will conclude that discussion. 

We are seeing more and more of our customers exploring the world of hybrid design, and we are getting new customers for whom hybrid design is their sole focus. The world of hybrid design is growing, and we have lots of hybrid-specific functionality built into our software that helps designers meet and conquer the unique hybrid design requirements that they are faced with.

And yet many designers out there (and I used to be one of them) have no idea what is meant when people start talking about hybrid design. It is therefore not uncommon for designers to avoid the subject directly while hoping to pick up little cues and pointers from others indirectly so that they are no longer in the dark. If that description sounds uncomfortably close to where you are at, then read on. My hope is that this three-part series will help you by serving as a basic introduction into the world of hybrid design.

If you haven’t had a chance to read the first two parts in this series, please go back to the last two months and take a look at them if you can. To summarize, however, we discussed in the first column the basic structure of hybrid designs and the benefits they offer over standard PCBs. In the second column we discussed some of the similarities and differences in CAD applications for the design of hybrids and how hybrid designs and their layer stackups are setup. We also discussed the routing of conductors (wires), and the creation of area fills and power planes. We continued from there talking about the creation of dielectric layers and their similarities and differences to fills and planes. Next we introduced the concept of cross-over dielectric layers, which is unique to hybrid designs, and how they are used. Finally we finished up with an explanation of how vias are created and managed in hybrids. Now, let’s talk about components.

The selection of components in a hybrid design is influenced by the operating temperature of the working design. Higher operating temperatures will require components that can withstand those extremes while at the same time necessitating a different amalgamation of soldering elements for manufacturing.

Passive components will use packaged parts while active components will use bare dies (no packaging). This is something different for the PCB designer who would rarely see a bare die used on a board design. Packaged active components can be used on a hybrid, but this is dependent upon the operating temperature of the design. And by using bare dies, a hybrid design realizes the benefits of shorter circuit paths, smaller size, and better thermal conditions for the device as it is glued directly to the substrate making for a better heat sink.

To read this entire article, which appeared in the May 2016 issue of The PCB Design Magazine, click here.

Share

Print


Suggested Items

TUM Hyperloop Team Learns PCB Design on Way to Setting World Speed Record

02/14/2019 | Andy Shaughnessy, Design007 Magazine
At AltiumLive Munich, I met with Tobias Bobrzik, a Technical University of Munich student and member of the TUM Hyperloop team. In 2018, the TUM Hyperloop team’s prototype pod set the world speed record of 290 miles per hour, which lead to their meeting with Musk. Tobias designed some of the PCBs used in that vehicle, so I asked him to tell us more about this experience, and what he hopes to do after graduation.

Institute of Circuit Technology Hayling Island Seminar

10/10/2018 | Pete Starkey, I-Connect007
After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

06/25/2018 | Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.



Copyright © 2019 I-Connect007. All rights reserved.