SiSoft to Present, Exhibit at SPI 2016 in Italy May 8-11

Reading time ( words)

Signal Integrity Software (SiSoft) will be presenting and exhibiting at the IEEE Workshop on Signal and Power Integrity (SPI) 2016 in Turin, Italy. For 19 years, the SPI event has brought together developers and researchers from industry and academia in order to encourage cooperation. 

SiSoft’s technologists will be available in the SiSoft booth to discuss attendees’ signal integrity issues during exhibit hours. During the conference, SiSoft will present the following:

Tuesday, May 10, 4:15-4:30 pm
"7 Challenging SI/PI Problems that Have No Existing Solution"
--Donald Telian, SI Guys

Wednesday, May 11, 9:30-9:50 am
"Ripple Analysis: Identify and Quantify Reflective Interference through ISI Decomposition" 
--Richard Allred, SiSoft

SiSoft will also be presenting the following at the European IBIS Summit, which is co-located with the SPI 2016 Conference:

"Understanding IBIS-AMI Simulations"
--Richard Allred, SiSoft

"Using IBIS-AMI Models to Maximize Data Rate Given SerDes EQ and Channel ISI/Loss"
--Donald Telian, SI Guys

Starhotel Majestic
Corso Vittorio Emanuele II, 54
Turin, Italy

Conference registration information may be found by clicking here

About SiSoft
SiSoft provides award-winning EDA simulation software, methodology training and consulting services for system-level high-speed design. Quantum Channel Designer is the industry’s premier channel simulator for the design and analysis of multi-gigabit serial links and a DesignVision Award Winner. Quantum-SI is the leading solution for integrated signal integrity, timing and crosstalk analysis of high-speed parallel interfaces. SiSoft’s software products automate comprehensive pre- and post-route analysis of high-speed interfaces, detailing a design’s operating voltage and timing margins. Visit







Suggested Items

Shrinking Silicon, Growing Signal Integrity Challenges

03/09/2023 | I-Connect007 Editorial Team
What happens when die sizes shrink? As IPC design instructor Kris Moyer explains, quite a bit. Shrinking silicon can mean rising signal speed and rise times, and traditional PCB designers may find themselves dealing with problems formerly only seen by RF engineers. We asked Kris to discuss the pros and cons of silicon shrinkage and some of the techniques and trade-offs that PCB designers and design engineers need to understand as they find themselves entering the RF arena.

Polar Instruments: Simulating PCB Potentialities

12/08/2022 | Nolan Johnson, I-Connect007
Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.

HyperLynx: There’s an App for That

08/05/2022 | I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.