Register Now for the Mentor PCB Systems Forum


Reading time ( words)

Registration is now open for the Mentor PCB Systems Forum, one day of technical sessions for PCB designers. No matter the software tool you use, the Mentor PCB Systems Forums spans the entire design flow.

Presented in cities around the world, this free event delivers design know-how, tips, and tricks that will help your engineering organization become significantly more productive and efficient regardless of which design tools you currently use. Each forum is free of charge, including lunch and refreshments.

For 2016, Mentor Graphics has expanded the agenda to address the demanding design challenges of the Connected World of mobility and the Internet of Things. This includes multi-board system development, advanced PCB design and manufacturing technologies as well as 3D design with complex form factors.

New this year is the SI/PI track showing how pre- and post-layout signal and power integrity analysis can help optimize product performance, cost, and reliability. IPC representatives will also be on hand, sharing ways to make attendees more competitive as engineers and designers.

The first North American session is scheduled for April 27, 2016 at the Santa Clara Marriott in Santa Clara, California.

To register for a Mentor PCB Systems Forum near you, click here

Share

Print


Suggested Items

‘The Trouble with Tribbles’

06/17/2021 | Dana Korf, Korf Consultancy
The original Star Trek series came into my life in 1966 as I was entering sixth grade. I was fascinated by the technology being used, such as communicators and phasers, and the crazy assortment of humans and aliens in each episode. My favorite episode is “The Trouble with Tribbles,” an episode combining cute Tribbles, science, and good/bad guys—sprinkled with sarcastic humor.

IPC-2581 Revision C: Complete Build Intent for Rigid-Flex

04/30/2021 | Ed Acheson, Cadence Design Systems
With the current design transfer formats, rigid-flex designers face a hand-off conundrum. You know the situation: My rigid-flex design is done so now it is time to get this built and into the product. Reviewing the documentation reveals that there are tables to define the different stackup definitions used in the design. The cross-references for the different zones to areas of the design are all there, I think. The last time a zone definition was missed, we caused a costly mistake.

Why We Simulate

04/29/2021 | Bill Hargin, Z-zero
When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.



Copyright © 2021 I-Connect007. All rights reserved.