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Gary Carter, senior manager of CAD engineering for Fujitsu Network Communications, discusses the first board fabricated and assembled using IPC-2581B. This 20-layer board features 21,000 component pins and 15,000 holes, with controlled impedance on all layers. He also gave a presentation on IPC-2581B during the Design Forum.
To watch this interview, click here.
Nolan Johnson, PCB007
During PCB West 2018, I spoke with Dan Fernsebner, product marketing group director, and Hemant Shah, product management group director for enterprise PCB products, both with Cadence Design Systems, about their new software launch—DesignTrue DFM Ecosystem. Fernsebner and Shah also address recent technical papers from Cadence on Industry 4.0, IPC-2581, system-level design, and return-path analysis and management.
Dan Feinberg, Technology Editor, I-Connect007
I’ve been covering artificial intelligence (AI) and related technologies for years, particularly at events such as the annual Consumer Electronics Show (CES). As I write this, we are in the run-up to CES 2019, and the Artificial Intelligence Conference in San Francisco, so the AI landscape is likely to change—at an ever-accelerating rate. Let’s look at some of the challenges facing AI now, and then after CES 2019 we can take another look.
When I spoke with APCT President Steve Robinson a year ago, he said he was interested in adding flex and rigid-flex capabilities, and working closely with designers and engineers. With the recent acquisition of Cartel and their subsidiary Cirtech, APCT now has a flex and rigidflex facility, along with military and aerospace certifications. At DesignCon 2018, I asked Steve to discuss these acquisitions and what they mean for APCT and their customers.