Freedom CAD offers Power Integrity Analysis


Reading time ( words)

As supply voltages continue to decrease and power consumption increases, impedance of power delivery networks at DC and over frequency has become a critical consideration for any electronic package or PCB design.

Using simulation to identify potential power integrity problems such as DC voltage drop and frequency response is essential for today’s high-speed digital designs.  By using Ansys’ SIwave software, Freedom CAD Services has the ability to perform pre-layout power integrity analysis and reduce post–layout power delivery problems.  This includes optimization of copper weights, bulk storage and bypass capacitor selection.

“We are pleased to be able to offer PCB engineering and layout solutions to our customers that can include Power Integrity and Voltage Drop analysis.” says Don Duncan, Chief Technology Officer at Freedom CAD Services.  “It’s becoming increasingly important to understand and predict the potential impact of power integrity and voltage drop in the sensitive electronic products that we frequently design.  I only see this importance growing as the design complexities grow across our projects from wearable devices to terabyte computers.”  

About Freedom CAD

Freedom CAD Services is a multi-disciplined engineering company specializing in design services for complex high-speed and large electronic systems for the computer, telecom, mil-aero, medical, storage, industrial, automotive and consumer electronics markets. Established in 2003, Freedom CAD’s engineering and PCB design team of more than 40 designers have over 1000 years of combined experience using the industry's leading PCB CAD tools to bring extraordinary solutions.  For more information, visit www.freedomcad.com.

Share

Print


Suggested Items

Just Ask Happy: Calculating Trace Temps in a Vacuum

07/07/2020 | I-Connect007 Editorial Team
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 3

07/01/2020 | I-Connect007 Editorial Team
The following is an excerpt from Chapter 3 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 2

06/16/2020 | I-Connect007 Editorial Team
The following is an excerpt from the second half of Chapter 1 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.



Copyright © 2020 I-Connect007. All rights reserved.