ICD Releases 2015 Version of the ICD Stackup and PDN Planner


Reading time ( words)

In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released the 2015 version of their popular software.

Impedance plots have been incorporated into this new release. “The impedance plots are simulated by multiple passes of the field solver (in the background) to create heads-up graphs of how to adjust the particular variables to achieve the target impedance.” said Barry Olney, CEO.

Further, with the addition of Panasonic Megtron 7 E-glass and Low Dk-glass (34MHz) the dielectric materials library has been increased to an impressive 16,700 ready-to-use materials up to 100GHz. There are also over 5,250 capacitors, derived from SPICE models, in the PDN library.

The IPC-2581B format, bi-directional interface has now been thoroughly tested by the IPC-2581 Consortium. “This new feature gives the ICD Stackup Planner the ability to import/export Cadence Allegro 16.6 and OrCAD 16.6 stackups and to import Altium Designer and Zuken CR-8000 & CR-5000 stackups” said Olney.

Existing support customers are advised to contact ICD to obtain download instructions for both the new software and the 2015 license server. Owners of a previous version may upgrade at an affordable price.

About In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd, based in Australia, developed the ICD Stackup and PDN Planner software, is a PCB Design Service Bureau and specialist in board level simulation. For further information or to download a free evaluation of the software, please go to www.icd.com.au   

All trademarks are trademarks of their respective owner. 

Share

Print


Suggested Items

Just Ask Heidi Barnes: The Exclusive Compilation

01/15/2021 | I-Connect007 Editorial Team
We asked for your questions for Keysight Technologies' Heidi Barnes, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple.

TTM’s Approach to Stackup Design: Train the Customer

01/12/2021 | I-Connect007 Editorial Team
In this interview with the I-Connect007 Editorial Team, TTM’s Julie Ellis and Richard Dang drill down into stackup design, detailing some of the common stackup challenges that their customers face when designing for both prototype and volume levels, and offering advice to designers or engineers who are struggling with stackup issues. They also discuss why having too many different prepregs in a stackup can be asking for trouble, and how proper stackup design can optimize both the fabrication and assembly processes.

Cutting Respins: Journey to the Single-spin PCB

01/07/2021 | Chris Young, The Goebel Company
PCB design is more than a short sprint to the finish line; it is a journey best suited for the prepared adventurer. According to a study by Lifecycle Insights, the average PCB design project requires 2.9 respins. These respins can cost anywhere from tens of thousands to millions of dollars—each! As an engineer/business owner, I find respins frustrating because I would rather spend my time and money applying scientific principles inventing, improving technology, and solving problems. I am not an advocate for perfectionism, but rather I focus on becoming a better adventurer. Sometimes I get to taste the sweet wine that is a single spin PCB. As fellow adventurers, let’s discuss some topics that influence unnecessary return trips on our PCB design journey: simulation, technical reviews, and interest in PCB design.



Copyright © 2021 I-Connect007. All rights reserved.