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Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about the company and its products and solutions. They also talked about some of the technologies being enabled by the company, including controlled impedance and insertion loss testing.
Watch the interview here.
I-Connect007 Editorial Team
Any discussion about high-speed PCB design techniques would be incomplete without considering the properties and requirements of the materials. Your material selection drives much of your design strategy when you’re operating at 28 gigabits per second or faster.
We recently spoke with high-speed design expert Lee Ritchey of Speeding Edge, and electronic materials veteran Tarun Amla of Avishtech and Thintronics, about the relationship between advanced PCB materials and high-speed design techniques. They discuss the challenges facing designers and engineers working with materials at speeds that were considered unreachable not long ago, and what designers need to know about material selection as board speeds continue rising toward the stratosphere.
Andy Shaughnessy, Design007 Magazine
In a recent survey, we asked the following question: How do you think 5G will affect the electronics manufacturing industry? Here are a few of the answers, edited slightly for clarity.
Chang Fei Yee, Keysight Technologies
This article briefly introduces the general purposes of copper ground pour on printed circuit boards. Subsequently, the impact of copper ground pour on PCB channel loss in terms of insertion loss and impedance in terms of time domain reflectometry (TDR) is studied with electromagnetic modeling using Mentor HyperLynx.