Zuken Driving Chip-package Co-design
April 9, 2014 |Estimated reading time: Less than a minute
Humair Mandavia, executive director, SOZO Center, and Steve Watt, senior application engineer, both of Zuken, join Editor Andy Shaughnessy to discuss chip-package co-design, a challenge many users face. Zuken is aiming to bridge the gap between the two technologies and leverage its tools to allow easier sharing of information and design a system in a cohesive environment.
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