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Improved Thin-Film Resistor Material
October 23, 2013 |Estimated reading time: Less than a minute
Embedded resistors have been used for many years as replacements for discrete surface devices in order to increase circuit density, improve reliability and enhance electrical performance. For many of those years, circuit designs were able to accommodate embedded resistor footprints that were relatively large, typically with line widths greater than 250 microns.
The evolution to greater I/O densities and routing constrictions made it very difficult, if not impossible, to embed resistors with footprints of these dimensions, especially terminating resistors within the high-density routing area of BGA devices.
This lead to the development of a 10 ohm per square sheet resistivity “resistor built in-trace” technology, OhmegaPly ORBIT, that allowed termination resistors to be built within traces and eliminated the requirement for designing resistor footprints by placing them within the circuit layout. These resistors are typically about 125 microns wide.
With increasing I/O densities, there has been a new need for embedded resistors that could fit within uBGA footprints with pad pitches of less than 500 microns. Resistors with line widths of less than 100 microns are necessary to accommodate these new requirements.Read the full article here.Editor's Note: This article originally appeared in the September 2013 issue of The PCB Design Magazine.