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Next-Generation High-Speed Materials: An Updated List
September 18, 2013 |Estimated reading time: 1 minute
The evolution of high-speed PCB materials moves just as quickly as the circuit that passes through them. It is no surprise that sometimes a very busy product developer might be confused by, or simply be unaware of, the newest advancements in cutting-edge substrates. Because of this, I would like to reach out to the product development community to help educate them and make them aware of the latest in PCB materials.
Designers must develop products with more functionality, at faster speeds, in smaller packages. This has been going on for generations, but there has been a major push by chip manufacturers. These chip packages (BGAs and now microBGAs) allow tremendous functionality with pin counts in excess of 7,000 points on 0.25 mm pitch microBGAs, while demanding extreme circuit speeds in excess of 50 gigahertz and tolerances throughout the PCB.
This seems like an impossible task. But forward-thinking PCB and material manufacturers continue to reinvest in advanced equipment for critical process consistency and advanced capabilities. We can now support today and tomorrow’s next-generation high-speed requirements. This leaves a product designer or engineer with two critical decisions: Choosing the right PCB vendor, and selecting the product material that optimizes both performance and cost.Read the full article here.Editor's Note: This column originally appeared in the June 2013 issue of The PCB Design Magazine.