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Thermal-Electrical and Mechanical Simulation of Packages
December 21, 2011 |Estimated reading time: Less than a minute
Kirsten Weide-Zaage offers a look at some new phenomena surrounding thermal-electrical and mechanical simulation of PoP, microBGA and TSV packages. Her department at the University of Hannover works with industry partners on a variety of projects related to advanced packaging.
To watch this interview, click here.