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Methods of Modeling Differential Vias
March 30, 2011 |Estimated reading time: Less than a minute
Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high-bandwidth, scalable first approximation circuit model using simple transmission lines of long vias typically used in thick backplane designs.
Written by Bert Simonovich of Lamsim Enterprises, Dr. Eric Bogatin of Bogatin Enterprises, and Dr. Yazi Cao, postdoctorate fellow at Carleton University.
Click here to read.