NPL/SMART Group Conformal Coating & Cleaning Experience


Reading time ( words)

By far the best-attended seminar-workshop event at an excellent National Electronics Week (NEW) show was the NPL/SMART Group Conformal Coating and Cleaning Experience, seamlessly organised, coordinated, and managed by SMART Group Technical Director and showman extraordinaire Bob Willis.

Day One

Willis combined the exhibition and demonstration area with the seminar theatre to offer an integrated learning experience dedicated to cleaning and coating. The area was a bustle of activity for the three days of the show, several visitors having travelled from mainland Europe and Eastern Europe with attendance at this NPL/SMART event as their primary objective, and several UK assemblers I spoke to were looking to gain a clear understanding of the technology and available options before embarking upon in-house conformal coating.

An hourly series of short, punchy presentations from industry experts, interspersed with opportunities to ask questions and to see equipment and materials in real-time action, maintained a consistent momentum. In Willis' words: “It’s about getting them interested to start with!”

Getting people interested in design considerations was a task expertly undertaken by David Greenman from Humiseal. Appropriate and adequate conformal coating drawings were rarely provided, and conformal coatings were commonly specified for historical reasons rather than properly selected to suit the anticipated operating environment. It was important to check the compatibility of a coating with the components of the assembly, and particularly to determine the wettability of the solder mask to ensure good adhesion. “No clean is no option” was his comment about surface cleanliness prior to coating and he recommended SIR testing as a means of qualifying the complete assembly process.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.