Reading time ( words)
This month, I am once again weighing in with tips on qualifying a fabricator. In previous columns, I mentioned three things everyone should expect from their fabricators:
- Quick quote responses;
- Outstanding quality; and
- Consistent on-time delivery.
I would like to add that, based on today’s board complexities, a review should be done prior to quote to make sure no manufacturing issues occur. This is critical when it comes to things like minimum pre-preg interfaces on high-copper coil boards or jobs with unique reference planes for various impedance scenarios. A potential customer would much rather be told up front that a given design is not producible than to wait three days for a quote, only to have the part go on hold after release to manufacturing because a good review was not done prior to release.
Quote Me on This
So, let’s start with the quote process. Whether the part is a simple double-sided part or a complex multilayer with numerous needs, you really would like to see a quote response back in a few hours, not a few days. Additionally you want accurate quotes that have taken into consideration all aspects of the board, such as drill time based on hole quantity, additional time for AS-9102 or Class 3 6012, first article reports, and any additional time if outside services are needed.
A three-day quote should be just that, regardless of your location and any outsources you may require. It is never good when a three-day is quoted but due to outside services or time zones still results in delays. Make sure any questions you have are asked up front to avoid these delays. Also, make sure there is a contact available for expedites.
Read the full column here.
Editor's Note: This column originally appeared in the November 2013 issue of The PCB Design Magazine.
Kris Moyer, IPC
In today’s ever-shrinking world of electronics designs, the use of BGA parts with very fine pitch features is becoming more prevalent. As these fine-pitch BGAs continue to increase in complexity and user I/O (number of balls), the difficulty of finding escape routes and fan-out patterns increases. Additionally, with the shrinking of silicon geometry leading to both smaller channel length and increased signal integrity issues, some of the traditional BGA escape routing techniques will require a revisit and/or adjustment to allow for not only successful fan-out, but also successful functioning of the circuitry of the BGA design.
Nolan Johnson, I-Connect007
Nolan Johnson recently met with Alun Morgan, technology ambassador at Ventec, and Ventec COO Mark Goodwin to discusses the industry’s determination to cling to outdated processes and standards, and some potential consequences. To maintain efficiency and keep pace with the market’s newest entries in Asia, Alun and Mark believe that legacy companies in the West must be open to challenging conversations that will require questioning old practices and revising those practices toward sustainability.
Patrick Crawford, IPC
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.