-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Physics-Based Via and Trace Models for SI/PI Co-Analysis
March 24, 2010 |Estimated reading time: Less than a minute
Physics-based models for vias and traces including new component models are applied to simulate multilayer interconnects on PCBs. In this DesignCon 2010 paper, a variety of interconnect structures, including via arrays and differential links between package via fields, are studied with model-to-hardware correlation. These models also enable efficient signal integrity and power integrity co-analysis with focus on modeling simultaneous switching noise coupled into high-speed signal nets as well as understanding the effects of decoupling capacitor placement.
This paper was authored by Xiaoxiong Gu, Young H. Kwark, Mark B. Ritter, Matteo Cocchini and Bruce Archambeault of IBM; Renato Rimolo-Donadio and Christian Schuster of Technische Universität Hamburg-Harburg; Zhenwei Yu, Albert Ruehli and Jun Fan of the Missouri Institute of Science and Technology; and Francesco de Paulis of the University of L'Aquila.
Click here to read.