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Multi-Level Signaling in High-Density, High-Speed Electrical Links
January 28, 2009 |Estimated reading time: Less than a minute
This paper provides an analysis comparing multi-level signaling to standard NRZ signaling for module-to-module on-board electrical interconnects. A variety of high-density, high-speed on-board module-to-module electrical links were analyzed, and specific interconnect channels were validated experimentally with programmable equalization transceiver chips communicating through a set of fabricated test structures. Simulation results show that NRZ signaling with FFE and DFE equalization offers the best electrical performance.
The paper was written by Dong G. Kam, Troy J. Beukema, Young H. Kwark, Lei Shan, Xiaoxiong Gu, Petar K. Pepeljugoski and Mark B. Ritter of IBM's T. J. Watson Research Center and presented at DesignCon 2008.
Click here to read.