-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
High-Speed Serial Interconnect Imbalance
December 3, 2008 |Estimated reading time: Less than a minute
Many signal integrity experts and standards organizations focus on skew to improve signaling margins and reduce electromagnetic emissions in differential signaling applications. While skew analysis is an accepted metric of imbalance, it is also an incomplete one.
This technical paper, written by senior engineers Shafiq Rahman and Barry Olawsky of Hewlett-Packard, presents more comprehensive methods of characterizing interconnect imbalance and demonstrates where skew analysis yields misleading results.
Click here to read this paper, presented at DesignCon 2008.