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Occam Process Developer Joe Fjelstad to Keynote MEPTEC Symposium
January 17, 2008 |Estimated reading time: 2 minutes
MEPTEC, the MicroElectronics Packaging and Test Engineering Council, is pleased to announce the addition of Joseph Fjelstad, President, Verdant Electronics as keynote speaker for its 4th Annual Thermal Management symposium titled "The Heat Is On: Thermal Technology Solutions for Advanced Products." This one-day technical event will be held on February 28, 2008 at the Wyndham Hotel, San Jose.Bringing more than 35 years of international experience in electronic interconnection and packaging technology, Mr. Fjelstad will briefly trace the history of thermal management across the various stages of electronics and at different hierarchical levels, reviewing some of the innovative ways that thermal management engineers have responded to the challenges over time in his presentation, "Beating the Heat - Dealing with the Thermal Challenge: Past, Present and Future". The presentation will conclude with alook at some of the new and prospective materials and methods that the thermal challenge might be addressed in the future.In addition to his duties at Verdant Electronics, Mr. Fjelstad is a well known author and magazine columnist writing on the subject of electronic interconnection technologies. Prior to founding Verdant, Mr. Fjelstad co-founded SiliconPipe a leader in the development of high speed interconnection technologies. He was also formerly with Tessera Technologies, a global leader in chip-scale packaging, where he was appointed to the first corporate fellowship for his innovations.In addition to the keynote presentation, the program has been segmented into the following focus areas:
Thermal Solutions for Tomorrows ICs - Session Leader: Phil Marcoux, Business Development, TPL Group
This session will focus on single- and multi-processor designs and the thermal challenges associated with overall product concept and implementation.
LEDs, Displays & Solid State Lighting - Session Leader: Dr. Roger Emigh, Director, WW Package Characterization STATS ChipPac
This session discusses the design and packaging of LED's for high-power applications. The LED/DISPLAY session will review the tools and know-how needed to implement these products in a variety of applications.Telecommunications - Session Leader: Tom Clifford, Industry Consultant (formerly Lockheed-Martin)
This session provides insights into thermal management for telecommunications devices and structures from the component, packaging and system point of view.
Green Technology - Session Leader: Ken Honer, Director of R&D, Advanced Packaging and Interconnect, Tessera Technologies, Inc.Going green has never been more fashionable, or more important. The threat of global warming demands that we find clean reliable ways to produce, distribute and efficiently use energy. Reliability and efficiency often go up as cooling solutions bring temperatures down. More significantly, the thermal power density of some alternative technologies exceeds that of current microprocessors.This session examines the issues involved in managing heat ingreen technologies.
To register for or learn more about the symposium, please contact Bette Cooper at 650-714-1570 or bcooper@meptec.org or visit MEPTEC at www.meptec.org.
About MEPTEC MEPTEC (Microelectronics Packaging and Test Engineering Council) is the trade association of semiconductor suppliers and manufacturers, committed to enhancing the competitiveness of the back-end portion of the semiconductor business. MEPTEC is concerned exclusively with assembly and testing and is dedicated to the advancement of the industry. Since its inception over 25 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test and handling. Through their membership of subcontractors, semiconductor manufacturers and vendors to the back-end, and an advisory board consisting of individuals from different segments of the back-end semiconductor industry, they continuously strive to improve and elevate the roles of assembly and test professionals in the industry. More information about MEPTEC can be found at www.meptec.org .