March 2023 Issue of Design007 Magazine Available Now

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Tribal knowledge is present in every organization, no matter what size. It isn’t always a bad thing, but there’s a lot of inaccurate tribal knowledge floating around out there. How do we distinguish between documented and undocumented facts?

In the March issue of Design007 Magazine, our expert contributors will provide readers with the tools and methodologies needed to identify tribal knowledge, as well as when to question such information, and how to document and transform it into a process.

Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.


Suggested Items

Shrinking Geometries: Back to Fundamentals to Fight EMI

02/23/2023 | Andy Shaughnessy, Design007 Magazine
Dan Beeker is technical director at NXP Semiconductors, a veteran design engineer, and an instructor who has spent years helping students and customers battle EMI through building a better understanding of electromagnetic fields and field theory. In this interview, Dan explains what happens when silicon shrinks, how feature size controls signal speed, and why this marks the perfect time to return to the fundamentals of physics and field theory.

Everyone Wants Change: Who Wants to Lead the Way?

01/25/2023 | Nolan Johnson, I-Connect007
Nolan Johnson recently met with Alun Morgan, technology ambassador at Ventec, and Ventec COO Mark Goodwin to discusses the industry’s determination to cling to outdated processes and standards, and some potential consequences. To maintain efficiency and keep pace with the market’s newest entries in Asia, Alun and Mark believe that legacy companies in the West must be open to challenging conversations that will require questioning old practices and revising those practices toward sustainability.

Happy Holden on Gerry Partida’s ‘Significant’ Microvia Reliabilty Paper

12/30/2022 | Happy Holden, I-Connect007
Gerry Partida, vice president of technology at Summit Interconnect, authored a technical paper, “Next Progression in Microvia Reliability Validation—Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the PCB Design Process,” at IPC APEX EXPO 2022, and it’s worth revisiting. This significant paper on microvia reliability validation provides a summary of what’s been happening in the microvia fabrication arena, especially regarding the issue of latent defects in stacked microvias.

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