Three Industry Rising Stars Recognized at IPC APEX EXPO 2023

Reading time ( words)

In recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges, three of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2023. Award recipients were Sarah Czaplewski-Campbell, Paige Fiet, and Christina Trussell.

Sarah Czaplewski-Campbell is a senior PCB reliability engineer and master inventor at IBM. An active participant in IPC standards committees, she received a Distinguished Committee Service Award for her contributions to the development of IPC-9121-A, Troubleshooting for Printed Board Fabrication Processes. Czaplewski-Campbell completed the IPC Emerging Engineers program in 2022 and currently serves on the IPC APEX EXPO technical program committee, reviewing technical content and chairing technical sessions. A contributor to the technical conference, she was awarded Best Paper in 2021.

Paige Fiet, TTM Technologies, was IPC’s first Student Director on the IPC Board of Directors. She currently serves as vice-chair of the 5-33B Solder Mask Performance Task Group and co-chair of the 7-24A Printed Board Process Effects Handbook Task Group, a member of the IPC APEX EXPO Technical Conference Program Committee and serves on an additional six standards development committees. She completed the IPC Emerging Engineer Program this year.

Christina Trussell, Blue Origin, joined the IPC/WHMA-A-620 committee in 2018. She currently serves as vice chair of the 7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group, responsible for the IPC/WHMA-A-620 Space Addendum. Trussell also participated as a judge for the 2021 IPCEF Scholarships and served on a career panel for high school and college students at the 2021 APEX EXPO virtual event. She completed the IPC Emerging Engineer Program this year.                                                                                     

“We are thrilled to recognize the accomplishments of our Rising Stars and to take this opportunity to thank them for their contributions,” said John W. Mitchell, IPC president and CEO. “We are privileged that Sarah, Paige, and Christina have chosen to share their knowledge and expertise with us and with the entire global electronics manufacturing industry.”


Suggested Items

ICT Seminar 2023 Review: Energy, Thermals, and Assistive Technology

03/16/2023 | Pete Starkey, I-Connect007
Widely believed to be the traditional Centre of England, Meriden was a popular venue for a gathering of the UK printed circuit community this month. They braved the forecast of heavy snow for the Institute of Circuit Technology’s annual general meeting to learn about current developments and challenges in a thought-provoking technical seminar and to network with industry peers and contemporaries. Thankfully, the forecasted heavy snowfall did not reach Meriden until after the event; we only had a few flurries, although the weather caused considerable disruption elsewhere in the country.

Paige Fiet: Forging a New Path

03/15/2023 | Patty Goldman, I-Connect007
As a young industry professional, Paige Fiet, a process engineer at TTM Logan, sees mentorship as a formative component of her success in IPC. Alongside the support and guidance of her mentors, Paige has distinguished herself as an emerging leader who brings a fresh perspective to the many topics currently of interest to the industry.

IPC APEX EXPO 2023 Special Session: Advanced Packaging

03/13/2023 | Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.