EMC 800GbE Ethernet Solutions with New Material Offering at Designcon 2023

Reading time ( words)

At DesignCon 2023, drop by EMC/ Arlon booth #955 and learn from the experts with the results from a wide range of performance testing that some of our key OEM customers have completed. The company will highlight how their extreme low-loss solutions EM-892K and EM-892K2 materials continue to rise as the best in class for its loss group. 

They are formulated with a ruggedized resin foundation that enables continued solid performance through various thermal excursions. They have withstood up to 7 lamination cycles for high density interconnect. The number of Tier 1 OEMs opting for this EMC’s 800G laminate solution for their next generation needs, has continued to grow.

EMC has also added another high-speed/low loss solution for Automotive Sector laminate needs. We have introduced the EM-A56 for next generation ADAS needs designed with 3.2 Dk/0.004 Df along with its enhanced very low Z axis CTE of 1.8%, sampling currently is available for testing. 

Another segment of Industry support by EMC taking shape is the IC Substrate sector. With our EM-S530 and EM-S570 substrate materials, we are breaking grounds to be the first Taiwan based substrate material provider outside of the traditional Japanese brand dominance.

For dedicated mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in and automatic test equipment; Arlon’s introduced 86HP as the revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical and mechanical performance not found with any other polyimide resin system, also meets IPC-4101 slash sheets 40 and 41. 

86HP is designed for dense circuit configurations due to the Anti-CAF performance of over 1,000 hours at 85% RH/85⁰C/ 100V DC, low-Z-axis expansion of less than 1% between 50⁰C to 260⁰C for high layer count MLB’s, very high decomposition temperatures of 430⁰C, high thermal conductivity of 0.6 W/mK, low moisture uptake of 0.12% for sensitive climate applications and is ideal for sequential lamination designs using up to seven additional lamination steps. 86HP applications include mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in and automatic test equipment. 86HP meets IPC-4101 slash sheets 40, 41, and 43.

For more information about Elite Materials please visit the EMC website at www.emctw.com.

For more information on ARLON EMD please visit www.arlonemd.com.


Suggested Items

Runner-up Discusses IPC Design Competition

03/16/2023 | I-Connect007 Editorial Team
PCB designer Adam Thorvaldson of Innovex was a finalist in this year’s IPC Design Competition at IPC APEX EXPO. He came in second place in this final heat, which is quite a feat, considering that the contest started last fall with 49 contestants from around the globe. We asked Adam to share his thoughts on the competition, what it means to be one of the winners, and any ideas about improving the contest for 2024 in Anaheim.

Shrinking Silicon, Growing Signal Integrity Challenges

03/09/2023 | I-Connect007 Editorial Team
What happens when die sizes shrink? As IPC design instructor Kris Moyer explains, quite a bit. Shrinking silicon can mean rising signal speed and rise times, and traditional PCB designers may find themselves dealing with problems formerly only seen by RF engineers. We asked Kris to discuss the pros and cons of silicon shrinkage and some of the techniques and trade-offs that PCB designers and design engineers need to understand as they find themselves entering the RF arena.

Meet Henry Crandall: New IPC Student Board Member

03/05/2023 | Barry Matties, I-Connect007
Barry Matties sits down with Henry Crandall, the newly minted Student Board Member on the IPC Board of Directors, to talk about how Henry became the first PhD student in electrical engineering in his family, as well as how his role on the IPC Board will allow him to represent the voices of students and young professionals interested in shaping the future of both IPC and the industry.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.