Reading time ( words)
Seeking ways to prolong Moore's Law, semiconductor companies are turning to new advanced component packaging techniques and in-package substrates. These mix-and-match approaches, requiring PCB-like connections via interposers, are blurring the boundaries between printed circuit fabrication and semiconductor fabrication. Are there strategic opportunities–new directions in which to shift your business–in this new space? In this issue of PCB007 Magazine, we open the discussion about how advanced packaging will change the structure of our industry.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
Nolan Johnson, I-Connect007
At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.
Andy Shaughnessy, I-Connect007
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.
Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) continues to provide an efficient platform for following and pursuing new developments. Its Technical Snapshot webinar has become established as a must-attend monthly event, and consistently delivers essential information of the highest calibre and relevance. The 16th in the series on March 23 focused on market requirements and technology trends at the high end of the PCB and semiconductor packaging industries, with two eminent speakers.