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The Five Most-read Design007 News of 2022
December 28, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Each December, we like to look back at the most popular news of the past 12 months. You never know which news item is going to blow up like a Harry Styles album.
So, grab some leftover ham and hang out with us for a while. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 news of 2022.
IPC Training Course on PCB Design for Printed and Wearable Devices
It’s not surprising that the No. 1 design news item of 2022 is related to IPC’s design curriculum. Now is the time to be a PCB design instructor, because designers are constantly retiring or slipping that mortal coil, and we’re losing subject matter experts all the time. Chances are that if you are a design instructor, you’re around retirement age, but we’re going to need you to keep on teaching. As the manager said in “Office Space,” “Yeahhh, that would be great.”
Insulectro Hires PWB Commodity Specialist Laura Martin as Director of Technology
We don’t usually see news about new hires in the Top Five for any given year, but a couple of thousand people read about Laura Martin’s new gig at Insulectro. She’s a fabrication guru, but we’re including this news piece because Laura teaches classes for PCB designers who have never darkened the door of their neighborhood board shop. Does that sound like any designers you know?
Altium, MacroFab Launch Industry-First Integrated PCB 'Design With Manufacturing' Application
There’s been a lot of talk about various ways to help PCB designers communicate with manufacturers, and Altium shot up into the No. 3 spot for 2022 with this news item about their partnership with MacroFab. Slowly but surely, more and more designers are beginning to communicate with their fabrication and assembly providers.
Samtec’s Richard Mellitz Named Engineer of the Year at DesignCon 2022
Richard Mellitz has been in the design world for decades, and we were glad to see him take home “Engineer of the Year” at DesignCon this year. Among other things, Richard helped create the first TDR (time domain reflectometry) standard for IPC. It’s nice to see him get recognized.
IPC Training Course on PCB Design for Embedded Components
Embedded components have been taking off over the past few years, and IPC’s embedded component design curriculum seems to have taken off as well. You can expect to see a lot more news about embedded components and advanced packaging in 2023. It’s only getting more complex!
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.