IPC, European Parliament Work to Bolster European Chips Act

Reading time ( words)

The Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging. 

That’s good news for the electronics industry given the important role that MEP Maydell plays in the European Parliament’s ongoing deliberations on the Chips Act. She is the EPP Group Rapporteur on the Chips Act and the Rapporteur on the Chips Joint Undertaking.

In her remarks to IPC members, she noted that Europe commands only 5% of packaging capability globally, a percentage that will need to increase given the criticality of advanced packaging for performance as well as lower energy consumption. Always a champion for innovation, she also offered to continue to work with IPC and the European electronics industry in the lead-up to her draft report on the Chips Joint Regulation.

IPC has been in touch with MEP Maydell and with many of her colleagues to bolster the Chips Act by providing: 

  • A definition for advanced packaging that includes assembly and test, IC substrate fabrication, and embedded components 
  • Greater affirmative support for investments in advanced packaging R&D and industrial capacity
  • Greater articulation that the Chips Act is the 1st step in a process of strengthening Europe’s electronics manufacturing ecosystem. 

IPC is working with our members and industry peers to secure greater support within the European Parliament.


Suggested Items

Electronica 2022: Happy to Be Back in Munich

11/21/2022 | Pete Starkey, I-Connect007
As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.

Electronica: Picking Up Where We Left Off

11/18/2022 | Nolan Johnson, I-Connect007
The productronica/electronica pairing of trade shows is an experience unlike any other; anyone who has ever attended is likely to back me up on that claim. This year’s iteration of electronica, taking place in Messe Munich, Nov. 15-18, is no exception. I-Connect007 was onsite to gather the news and share our impressions of the show. First, the show’s attendance was rumored to be in the 60,000+ range. This number sure seemed to be reasonable given the crowd sizes we witnessed.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/23/2022 | Andy Shaughnessy, Design007 Magazine
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.

Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.