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Ambiq Apollo510 Delivers 30x Power Efficiency Improvement to Unleash Endpoint AI

03/27/2024 | Ambiq
Ambiq, a technology leader in exceptionally energy-efficient semiconductors for IoT devices, is introducing the new Apollo510, the first member of the Apollo5 SoC family, which is uniquely positioned to kickstart the age of truly ubiquitous, practical, and meaningful AI.

Commercial Demand Continues to Be the Main Driver of Personal Computing Device Shipments into the GCC Region

03/26/2024 | IDC
The Gulf Cooperation Council (GCC) personal computing device (PCD) market, which is made up of desktops, notebooks, and workstations, declined 4.0% year on year in 2023, with high inventory levels and reduced consumer spending the primary causes.

Asia/Pacific PC Market Dropped 16.1% in 2023

03/18/2024 | IDC
The traditional PC market (Desktops, Notebooks, and Workstations) in Asia/Pacific (including Japan and China) posted a 16.1% decline in 2023 to 97.4 million units, according to the International Data Corporation (IDC) Quarterly Personal Computing Devices Tracker, Q4 2023. Shipments are not expected to rebound significantly in 2024 due to weak demand and a slow economic recovery.

Indium Corporation Celebrates 90 Years of Materials Science Innovation

03/13/2024 | Indium Corporation
Indium Corporation will commemorate its 90th anniversary on March 13. Indium Corporation’s innovative products, especially its advanced soldering solutions, are found in many common consumer electronics and high-reliability technologies such as electric vehicles, mobile devices, life-saving medical devices, and emerging 5G technology to name just a few.

TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms

03/12/2024 | JCN Newswire
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSE™ low-temperature fired paste for gold-to-gold bonding.
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