DFM 101: Final Finishes—ENIG and ENIPIG

Reading time ( words)

Introduction
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability. 

Purposes of Final Finishes
Final finishes provide a surface for the component assembler to either solder, wire bond, or conductively attach a component pad or lead to a pad, hole, or area of a PCB. The other use for a final finish is to provide a known contact resistance and life cycle for connectors, keys, or switches. The primary purpose of a final finish is to create electrical and thermal continuity with a surface of the PCB.

There are several final finishes in use in the industry today, including:

• ENIG (electroless nickel, immersion gold)
• ENIPIG (electroless nickel, immersion palladium, immersion gold)
• ENEPIG (electroless nickel, electroless palladium, immersion gold)
• ImmAg (immersion silver)
• ImmSn (immersion tin)
• Sulfamate Nickel/Hard or Soft Gold (electrolytic nickel/gold)
• HASL (hot air solder leveling)
• SnPb (63/37 tin/lead)
• LF (lead free)
• OSP (organic solderability preservative)

To read this entire article, which appeared in the July issue of Design007 Magazine, click here.

03/13/2023 | Patrick Hope, Siemens Digital Industry Software, Sponsored Content

Stackup decisions are critical to every PCB and electronic product, but they don’t always get the attention they deserve. With better stackup planning focusing on six key parameters, designers can select the best materials early in the design process and minimize the risk of under- and overdesigning their PCB.

02/14/2023 | Anaya Vardya, American Standard Circuits

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer's perspective) and the design decisions that will impact product reliability.

01/30/2023 | Anaya Vardya, American Standard Circuits

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.