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After years of trying to get the funding for the CHIPS Act passed via several different vehicles, the U.S. Congress acted quickly last week to approve a slimmed-down version of the competitiveness package formerly known as “USICA” and “America COMPETES” before the August recess. In the end, Congress passed the CHIPS and Science Act, the research and development legislation also referred to as “CHIPS Plus”, which includes more than $52 billion for U.S. companies that manufacture semiconductors as well as billions in tax credits to encourage investment in chip manufacturing. It also provides tens of billions of dollars to fund scientific research, innovation, and development of other U.S. technologies. This legislation is expected to be signed by President Biden within the next few days.
IPC advocated strongly for the passage of legislation that would fund the CHIPS Act and urged Congress to include $2.5 billion in the first fiscal year for the National Advanced Packaging Manufacturing Program. IPC applauds both the Senate and the House for reaching an agreement and sending the bill to the President’s desk.
Given the importance of advanced packaging to our industry’s future, IPC is hosting an Advanced Packaging Symposium on October 11-12 at the Kimpton Monaco Hotel in Washington, D.C. Confirmed speakers include senior executives from leading electronics companies, including Intel, AMKOR, Skywater, Schweizer, TTM, Calumet, Northrop Grumman and SEMCO. The participation of senior government officials from the United States and Europe is also in the process of being confirmed. Register today!
I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
Andy Shaughnessy, Design007 Magazine
It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.