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IPC issued the following statement from President and CEO John Mitchell on today’s passage of the “CHIPS+” legislation in the U.S. House of Representatives, which follows Senate approval and paves the way to U.S. President Joe Biden’s signature:
“IPC, which is committed to building electronics better, welcomes the final passage of the bipartisan “CHIPS+” legislation, which will help America rebuild a critical part of the U.S. electronics supply chain.
“This much-needed legislation is great news for electronics manufacturers. Our members will have opportunities to secure funding for research and development (R&D), new and improved facilities, and critical workforce training through the programs authorized by the bill. In today’s high-tech world, America depends on advanced electronics; this bill strengthens the industry.
“We are particularly pleased that the bill includes investments in building U.S. advanced packaging capabilities, including at least $2.5 billion for a new National Advanced Packaging Manufacturing Program. Bolstering advanced packaging in the United States is critical to securing a reliable and innovative semiconductor supply chain. Without it, U.S.-made chips will still need to be sent offshore for packaging and assembly.
“We are pleased that both chambers of Congress were able to come together and pass this bill with bipartisan consensus. We hope policymakers from both parties agree and will work on helping rebuild the entire U.S. electronics manufacturing ecosystem.”
Nolan Johnson, I-Connect007
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
Shavi Spinzi, Nano Dimension
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space. There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance. In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.
Pete Starkey, I-Connect007
As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.