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IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days.
The Senate voted yesterday to proceed to debate on the bill, which includes more than $52 billion funding to implement the CHIPS Act and at least $2.5 billion for a new National Advanced Packaging Manufacturing Program. The motion passed 64-34, indicating strong bipartisan support. The bill may face additional changes as it is considered by the Senate.
A sense of urgency is driving action on the bill. Senate and House leaders want to send the bill to the President before the August district work period, which begins on July 27. Failure to enact the bill this summer would likely postpone final passage until after the November elections.
“IPC strongly supports passage of this bill,” said IPC President and CEO John Mitchell. “Companies engaged in standing up packaging and IC substrate facilities will have opportunities to tap into funding for R&D, new facilities, and workforce training through the programs authorized by the CHIPS Act. IPC is urging federal officials to structure these initiatives to deliver benefits across the electronics manufacturing industry.”
“However, the CHIPS Act is not a panacea,” he added. “Instead, it is a meaningful first step in helping to rebuild the U.S. electronics manufacturing industry. The Executive Branch and Congress must continue to support – through long-term policy and funding – the larger ecosystem that sustains innovative, resilient, and secure electronics manufacturing.”
I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
Andy Shaughnessy, Design007 Magazine
It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.