-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
IPC Urges U.S. Senate and House to Complete R&D Legislation Before August Recess
July 20, 2022 | IPCEstimated reading time: 1 minute
IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days.
The Senate voted yesterday to proceed to debate on the bill, which includes more than $52 billion funding to implement the CHIPS Act and at least $2.5 billion for a new National Advanced Packaging Manufacturing Program. The motion passed 64-34, indicating strong bipartisan support. The bill may face additional changes as it is considered by the Senate.
A sense of urgency is driving action on the bill. Senate and House leaders want to send the bill to the President before the August district work period, which begins on July 27. Failure to enact the bill this summer would likely postpone final passage until after the November elections.
“IPC strongly supports passage of this bill,” said IPC President and CEO John Mitchell. “Companies engaged in standing up packaging and IC substrate facilities will have opportunities to tap into funding for R&D, new facilities, and workforce training through the programs authorized by the CHIPS Act. IPC is urging federal officials to structure these initiatives to deliver benefits across the electronics manufacturing industry.”
“However, the CHIPS Act is not a panacea,” he added. “Instead, it is a meaningful first step in helping to rebuild the U.S. electronics manufacturing industry. The Executive Branch and Congress must continue to support – through long-term policy and funding – the larger ecosystem that sustains innovative, resilient, and secure electronics manufacturing.”
Suggested Items
IMI Taps New Opportunities to Sustain Grit in China
03/28/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI), Joey S. Bantatua, IMI China’s head of operations and general manager was recently interviewed by Asia Electronics Industry (AEI) magazine where he talked about the prospects of the country both as a market and a production hub.
Kimball Electronics Publishes Annual Sustainability Disclosures with its 2023 Guiding Principles Report
03/28/2024 | BUSINESS WIREKimball Electronics, Inc. published its annual sustainability disclosures in its 2023 Guiding Principles Report, themed “How We Are Winning Together The Kimball Way.”
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.