Zuken's eCADSTAR Release 2022 Enables Efficient Creation of IoT Enabled PCB Designs


Reading time ( words)

With Release 2022 of eCADSTAR, Zuken continues to advance the concept of a user-friendly, internet-connected PCB design system for the small and medium business segment.

Leveraging eCADSTAR’s internet connected platform and unified user interface for all applications (schematic, constraint, library and layout editors), the eCADSTAR development team’s focus for the new major release was the delivery of advanced functionality as a reaction to requests from the growing user base. Focus for the new major release was the delivery of advanced capabilities for organization and reuse of designs, fine-tuning of high-speed circuitry, and layout and modification of densely populated PCB layouts through semi-automatic functionality.

“With an emphasis on organization and reuse of full and partial designs, advanced fine-tuning of high-speed circuitry, and automation-assisted layout and modification of densely populated PCB layouts, eCADSTAR release 2022 continues to be a strong contender for demanding users in the growing market of IoT enabled boards,” says Jeroen Leinders, eCADSTAR Business Manager Europe.

Share




Suggested Items

Polar Instruments: Simulating PCB Potentialities

12/08/2022 | Nolan Johnson, I-Connect007
Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.

HyperLynx: There’s an App for That

08/05/2022 | I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.

Webinar Review: Thermal Integrity of High-Performance PCB Design

08/01/2022 | Andy Shaughnessy, Design007 Magazine
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools. But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.