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PCB fabrication is back in the news this week and posting high readership numbers as well. Among the most-read news, we see industry leaders changing roles, capital equipment shipment milestones, operational cost efficiencies, and, last but not least, cybersecurity.
Mike Carano Joins the Averatek Team as Vice President of Quality
Published June 3
As a former VI at RBP Chemical Technology, and Global R&D director at OM Group, as well as an influential advisor for IPC, I-Connect007 columnist Mike Carano brings a deep skillset to this new role with Averatek. Read the details here.
The Double-edged Sword of CMMC 2.0
Published June 6
MX2 Technology’s Divyash Patel updates readers on CMMC (Cybersecurity Maturity Model Certification) overall, and the upcoming version 2.0 criteria specifically. Given the likelihood that CMMC will touch most of us in the industry eventually, readers clearly wanted to know more.
Atotech Sells 1,000th Horizontal Electrolytic Copper Plater
Published June 8
Atotech announced the sale of its 1,000th installation of the Uniplate horizontal plating line to a Taiwan-based PCB manufacturer. The article also includes a timeline of milestones in the Uniplate line.
If you’re visiting the 2022 IEEE International Microwave Symposium in Denver, Colorado, June 21-23, Isola will be present, discussing hybrid design and fabrication and dielectric constants in materials. Readership was high for this article; find the details inside.
Candor Nails the ROI With InduBond
Published June 7
Sunny Patel is engineering manager at Candor Industries. We follow up on Sunny Patel’s initial interview about the economics of this new InduBond X-Press 360 lamination press. It sounds like Sunny has hit the “easy” button with the installation of this machine.