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The April issue of Design007 Magazine focuses on how readers can get started designing additive and semi-additive PCBs, and how the design process for additive technology differs from that of traditional subtractive processes. Additive technology might be a great ace up your sleeve.
Find out more in the April issue of Design007 Magazine. Download your copy today on the virtual newsstand or subscribe here for delivery in your email inbox.
To read Andy Shaughnessy's April column, with details about this issue of the magazine click here.
Didier Mauve and Robert Art, Ventec
Regarding basic principles of thermal dissipation there are three ways of dissipating energy: Conduction, convection, and radiation. The integrated metal substrate (IMS) printed circuit boards rely predominantly on heat conduction all the way through the different layers of the substrates from a hot point (the base of the component) to a cold point (the furthest surface of the metal base) and, usually, thereafter, through a dissipator.
Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability. Final finishes provide a surface for the component assembler to either solder, wire bond, or conductively attach a component pad or lead to a pad, hole, or area of a PCB.
Andy Shaughnessy, Design007 Magazine
We’re still not officially into summer yet, but Atlanta is bringing the heat, baby! It’s hit 97 degrees a few times this week, and I now have a fan aimed right at my face. At least it’s nice and humid too. I’m glad I don’t wear make-up. And it’s been a hot week in the circuit board community. This week, Eltek reported a fire at a board shop in Israel, and Flex committed to building a 145,000-square-foor facility in Jalisco, Mexico to serve the electric and autonomous vehicle segment.