DFM 101: Plating Methods


Reading time ( words)

Introduction
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

PCB Plating Methods
There are two methods of plating copper on PCBs—pattern plating and panel plating. The panel plating method eliminates most of the copper plating distribution issues, but because it adds copper thickness to the base layer, it makes maintaining fine line definition and consistency difficult. Base copper is measured in ounces of copper per square foot of surface area.

Pattern Plate
This standard process has major advantages in that only the base copper is required to be etched. This process yields finer, better-defined lines (traces). One possible disadvantage is the variations in trace height due to surface density.

Panel Plate
This plating fabrication method eliminates most of the copper plating distribution issues but now the excess surface copper (after the circuit pattern is defined) must be etched along with the base foil. This makes maintaining fine line definition and consistency difficult.

To read this entire article, which appeared in the February 2022 Design007 Magazine, click here.

Share




Suggested Items

My Experience With Maxwell

11/23/2022 | Happy Holden, I-Connect007
I was first introduced to James Maxwell in 1967 as a college student. I had to decide whether I would take the Maxwell fields course or the switching and coding course. Being a chemical engineering major with a co-major in control theory, I had heard about the trials and tribulations of the infamous Maxwell fields course.

Sunstone’s Matt Stevenson Shares Insights From New PCB Design Book

10/27/2022 | Nolan Johnson, I-Connect007
There’s designing the “perfect” circuit board and then there’s designing a board that is “perfect for manufacturing.” While seasoned designers and design engineers understand many of the nuances, PCB fabricator Sunstone Circuits has just published a new book specifically for new designers who have the knowledge of design but are still learning what it means to get the board manufactured. Sunstone’s Matt Stevenson takes the reader through a series of situations that should help clarify what’s happening in the fabrication process and how to adjust a board design to be better suited for manufacturing.

HDI, A-SAP and mSAP: A Designer’s Point of View

10/26/2022 | Cherie Litson, CID+, Litson1 Consulting
HDI—high-density interconnect—designs require some different thinking on the part of the designer. One of the first things to consider is whether you need HDI, and if so, how much. The HDI option comes into play as soon as you purchase any components with 0.5 mm pin pitch. The number of these components and other specifications of your design will determine the amount of HDI you will need. Here’s a quick list of HDI options.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.