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During IPC APEX EXPO in San Diego, additive and semi-additive processes were a hot topic. But we heard far more questions than answers. Is additive a disruptive PCB technology? Will it displace tried-but-true subtractive etch technology, or is it merely another tool to have in our toolbox? What does a PCB designer have to do differently? Do EDA tools support it?
How much is it going to cost to get into additive processing? Do the numbers really add up? What sort of ROI are we talking about? What equipment am I going to have to acquire in order to begin additive or semi-additive processing? Where’s all of the R&D?
For the February 2022 issue of PCB007 Magazine, we asked a variety of contributors to address some of these questions and share their insights about additive and semi-additive technology.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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03/13/2023 |
Pete Starkey, I-Connect007
The IPC APEX EXPO Special Session on Advanced Packaging this year attracted enormous interest, with Conference Room 2 at capacity long before the session began. Even with lots of extra seats squeezed around the edges, the session was standing room only for the just-in-time arrivals. IPC Chief Technology Officer Matt Kelly opened proceedings by introducing a distinguished panel of experts: Jan Vardaman, president and founder of TechSearch International; Sam Salama, CEO of Hyperion Technology; Matt Neely, director of process engineering at TTM Technologies; and Jim Fuller, VP of engineering technology at Sanmina.
02/27/2023 |
Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.
02/15/2023 |
Real Time with...IPC APEX EXPO
Brendan Hogan from MivaTek Global describes recent developments in direct imaging technology, particularly the capability to achieve on-the-fly scaling and feature-size control with digital adaptive rasterization technology (DART).
