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The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design is the latest addition to I-Connect007’s comprehensive, educational library.
In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Signal integrity expert and professor Eric Bogatin says, “I’ve been in involved in aspects of PCB manufacturing and design for almost 40 years, and even I picked up a few useful nuggets of knowledge from this book.”
Nokia Principal Engineer Joe Smetana agrees: “This is an excellent primer for people who are doing high-speed PCB design. It connects the dots between signal integrity and manufacturing.”
Hundreds of eager readers have already downloaded this book. Get your free copy today at I-007ebooks.com. We hope you enjoy The Printed Circuit Designer’s Guide to Stackups: The Design within the Design.
For more information, contact:
I-Connect007 Editorial Team
I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.
Andy Shaughnessy, Design007 Magazine
Electrical and mechanical engineers may be working on the same product development teams, but they speak different languages, and they have completely different objectives. As a result, these folks almost never use the same software tools.
But Cadence’s new Celsius Thermal Solver is an exception to the rule. In a new CadenceTECHTALK webinar, “How Static and Dynamic IR Drop Analysis Can Help PCB Designs and Challenges,” product manager Melika Roshandell and SerDes SI/PI engineer Karthik Mahesh Rao explain how the EE and ME can both use the Celsius Thermal Solver to achieve their disparate objectives.
Zachariah Peterson, NWES
Today’s PCB design engineers have more layout and analysis tools at their disposal than ever before. Over the years we’ve seen layout tools become more automated, rules-driven, and more integrated. Now we even have integration between design tools from different vendors and ranging across domains, starting with basic circuit design, and spanning up to PLM and ERP integration. It really is a great time to be a designer.