Qorvo Selects Cadence Design Systems for US Government SHIP-RF Program


Reading time ( words)

Cadence Design Systems, Inc. announced participation in Qorvo’s State-of-the-Art Heterogeneous Integrated Packaging (SHIP-RF) Design Center. The SHIP-RF program is a Department of Defense (DoD)-sponsored initiative aimed at advancing leading-edge microelectronics design and manufacturing capabilities in the United States. As part of the program, Cadence is providing services, tools and Assembly Design Kits (ADKs) to enable Qorvo and their customers to achieve first-pass design and manufacturing success for next-generation RF and mixed-signal systems that are delivered as both packages and modules.

As part of Qorvo’s Design Center team, Cadence will develop methodologies and flows to implement seamless design and simulation capabilities for 2.5D and 3D heterogeneous integration. These include advanced technologies that have been internally developed in alignment with the Cadence® Intelligent System Design™ strategy, including Allegro® Pulse™, Clarity™ 3D Solver, Celsius™ Thermal Solver, and Allegro X Design Platform. Incorporating Cadence ADK solutions with Qorvo’s foundry PDKs and their SHIP-RF Assembly and Test Center (ATC) manufacturing rules enables complete modeling and product simulation for mission-critical aerospace and defense applications.

“Cadence is the only EDA company accredited by the DoD as a Trusted Supplier. We will provide Qorvo and our customers with capabilities to rapidly and accurately design sophisticated packages and modules that will be fabricated and tested in the Qorvo manufacturing facility, resulting in reduced development time, iterations and cost,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group, Cadence. “With our continued focus on developing the most advanced computational software solutions, Cadence is well-positioned to deliver an optimized flow for RF and mixed-signal systems to be designed, verified and assembled in the most advanced packages and modules.”

“Cadence’s participation in the SHIP-RF program benefits Qorvo and our customers as they will be able to access Cadence flows when utilizing Qorvo’s advanced, industry-leading heterogenous RF packaging, assembly and testing solutions,” said Roger Hall, general manager of Qorvo’s High Power Solutions (HPS) business. “Cadence’s offerings can increase design productivity to meet the size, weight, power and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.”

The Cadence Aerospace and Defense solutions support the company’s broader Intelligent System Design strategy, enabling system innovation.

Share




Suggested Items

Additive Manufacturing Requires Additive Design Techniques

05/09/2022 | Luca Gautero, SUSS MicroTec
Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.

AltiumLive 2022: MacroFab Unites Design and Manufacturing in One Domain

03/31/2022 | Andy Shaughnessy, Design007 Magazine
I recently spoke with Joey Rodriguez, director of product management for MacroFab, which just announced a major partnership with Altium that brings supply chain information to Altium users much earlier in the design cycle. Joey and I discussed his AltiumLive presentation, now available online, which provides details about MacroFab’s efforts to “left-shift” supply chain information, and the need for designers to think holistically about the supply chain as early as possible in the design cycle.

Real Time with… IPC APEX EXPO: Siemens’ Supply Chain Solutions

01/17/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges. If you can’t make it to IPC APEX EXPO, don’t worry. We’ll be bringing you interviews with the engineers, managers and technologists who are making a difference in our industry.



Copyright © 2022 I-Connect007. All rights reserved.