Qorvo Selects Cadence Design Systems for US Government SHIP-RF Program

Reading time ( words)

Cadence Design Systems, Inc. announced participation in Qorvo’s State-of-the-Art Heterogeneous Integrated Packaging (SHIP-RF) Design Center. The SHIP-RF program is a Department of Defense (DoD)-sponsored initiative aimed at advancing leading-edge microelectronics design and manufacturing capabilities in the United States. As part of the program, Cadence is providing services, tools and Assembly Design Kits (ADKs) to enable Qorvo and their customers to achieve first-pass design and manufacturing success for next-generation RF and mixed-signal systems that are delivered as both packages and modules.

As part of Qorvo’s Design Center team, Cadence will develop methodologies and flows to implement seamless design and simulation capabilities for 2.5D and 3D heterogeneous integration. These include advanced technologies that have been internally developed in alignment with the Cadence® Intelligent System Design™ strategy, including Allegro® Pulse™, Clarity™ 3D Solver, Celsius™ Thermal Solver, and Allegro X Design Platform. Incorporating Cadence ADK solutions with Qorvo’s foundry PDKs and their SHIP-RF Assembly and Test Center (ATC) manufacturing rules enables complete modeling and product simulation for mission-critical aerospace and defense applications.

“Cadence is the only EDA company accredited by the DoD as a Trusted Supplier. We will provide Qorvo and our customers with capabilities to rapidly and accurately design sophisticated packages and modules that will be fabricated and tested in the Qorvo manufacturing facility, resulting in reduced development time, iterations and cost,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group, Cadence. “With our continued focus on developing the most advanced computational software solutions, Cadence is well-positioned to deliver an optimized flow for RF and mixed-signal systems to be designed, verified and assembled in the most advanced packages and modules.”

“Cadence’s participation in the SHIP-RF program benefits Qorvo and our customers as they will be able to access Cadence flows when utilizing Qorvo’s advanced, industry-leading heterogenous RF packaging, assembly and testing solutions,” said Roger Hall, general manager of Qorvo’s High Power Solutions (HPS) business. “Cadence’s offerings can increase design productivity to meet the size, weight, power and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.”

The Cadence Aerospace and Defense solutions support the company’s broader Intelligent System Design strategy, enabling system innovation.

10/27/2022 | Nolan Johnson, I-Connect007

There’s designing the “perfect” circuit board and then there’s designing a board that is “perfect for manufacturing.” While seasoned designers and design engineers understand many of the nuances, PCB fabricator Sunstone Circuits has just published a new book specifically for new designers who have the knowledge of design but are still learning what it means to get the board manufactured. Sunstone’s Matt Stevenson takes the reader through a series of situations that should help clarify what’s happening in the fabrication process and how to adjust a board design to be better suited for manufacturing.

07/05/2022 | I-Connect007 Editorial Team

What is design with manufacturing and what does true DWM look like in operation? In this interview, I-Connect007 columnist Dana Korf explains what it will take to achieve total communication among all the stakeholders in the PCB development cycle. He also stresses the need for everyone involved in PCB design and manufacturing to stop making assumptions, even at the risk of being labeled as “that guy” who asks too many questions.

06/30/2022 | Kyle Burk, KBJ Engineering

As mentioned in the May issue of Design007 Magazine, design is performed, at times, in a vacuum. But it doesn’t have to be that way. Whenever circumstances allow, design should be performed by communicating with all stakeholders throughout the design process, hence the emphasis on the word with in DWM. Communication can occur through personal correspondence such as email and voice conversations or through more formal design meetings—in person or through videoconferencing. No matter which means of communication you prefer, it’s important to communicate early and often with stakeholders involved in the downstream processes as you bring your project to realization.