-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Qorvo Selects Cadence Design Systems for US Government SHIP-RF Program
February 16, 2022 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced participation in Qorvo’s State-of-the-Art Heterogeneous Integrated Packaging (SHIP-RF) Design Center. The SHIP-RF program is a Department of Defense (DoD)-sponsored initiative aimed at advancing leading-edge microelectronics design and manufacturing capabilities in the United States. As part of the program, Cadence is providing services, tools and Assembly Design Kits (ADKs) to enable Qorvo and their customers to achieve first-pass design and manufacturing success for next-generation RF and mixed-signal systems that are delivered as both packages and modules.
As part of Qorvo’s Design Center team, Cadence will develop methodologies and flows to implement seamless design and simulation capabilities for 2.5D and 3D heterogeneous integration. These include advanced technologies that have been internally developed in alignment with the Cadence® Intelligent System Design™ strategy, including Allegro® Pulse™, Clarity™ 3D Solver, Celsius™ Thermal Solver, and Allegro X Design Platform. Incorporating Cadence ADK solutions with Qorvo’s foundry PDKs and their SHIP-RF Assembly and Test Center (ATC) manufacturing rules enables complete modeling and product simulation for mission-critical aerospace and defense applications.
“Cadence is the only EDA company accredited by the DoD as a Trusted Supplier. We will provide Qorvo and our customers with capabilities to rapidly and accurately design sophisticated packages and modules that will be fabricated and tested in the Qorvo manufacturing facility, resulting in reduced development time, iterations and cost,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group, Cadence. “With our continued focus on developing the most advanced computational software solutions, Cadence is well-positioned to deliver an optimized flow for RF and mixed-signal systems to be designed, verified and assembled in the most advanced packages and modules.”
“Cadence’s participation in the SHIP-RF program benefits Qorvo and our customers as they will be able to access Cadence flows when utilizing Qorvo’s advanced, industry-leading heterogenous RF packaging, assembly and testing solutions,” said Roger Hall, general manager of Qorvo’s High Power Solutions (HPS) business. “Cadence’s offerings can increase design productivity to meet the size, weight, power and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.”
The Cadence Aerospace and Defense solutions support the company’s broader Intelligent System Design strategy, enabling system innovation.
Suggested Items
TTM Celebrates the Grand Opening of Its First Manufacturing Facility in Penang
04/25/2024 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD200 million (approximately RM958 million).
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Fujitsu, METRON Collaborate to Drive ESG Success
04/24/2024 | JCN NewswireFujitsu Limited and METRON SAS, a French cleantech company specializing in energy management solutions for industrial decarbonization, today announced a strategic initiative to contribute to the realization of carbon neutrality in the manufacturing industry.
Real Time with... IPC APEX EXPO 2024: Final Finishes and IC Substrate Manufacturing
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont and Richard DePoto, Uyemura's Business Development Manager, engage in a comprehensive discussion about the positive aspects of the show, the benefits of RAIG in final finishes, and the hurdles faced when upgrading your surface finish. Also discussed are the role of Uyemura's MEC pretreatment agents in IC substrate manufacturing and the importance of collaboration and knowledge sharing.
Women MAKE Awards Recognizes GlobalFoundries’ Jennifer Robbins and Katelyn Harrison for Manufacturing Excellence
04/24/2024 | GlobalFoundriesThe Manufacturing Institute (MI)—the workforce development and education affiliate of the National Association of Manufacturers—honored two outstanding women from GlobalFoundries (GF) at their annual Women MAKE Awards. Jennifer (Jenny) Robbins, Senior Director, Central Facilities, was recognized as a 2024 Women MAKE Awards Honoree, while Katelyn Harrison, Senior Integration Engineer, was honored as an Emerging Leader.