IPC: Electronics Industry Commends U.S. House Action on America COMPETES Act


Reading time ( words)

The electronics manufacturing industry is applauding a bill being voted on this week in the U.S. House of Representatives, which would, if enacted, launch a new era of federal government partnership with the industry.

IPC supports H.R. 4521, the America COMPETES Act and its objective of strengthening the United States’ technology capabilities.

Like its Senate counterpart, the U.S. Innovation and Competitiveness Act (USICA), the America COMPETES Act contains $52 billion to strengthen the U.S. semiconductor industry and implement the CHIPS for America Act. Also like the Senate bill, the House bill would boost federal investment in research and development (R&D) in a variety of technologies.

Notably, the House bill would appropriate at least $2.5 billion in fiscal 2023 for advanced packaging R&D, aimed at helping U.S.-based companies adopt new techniques to electronically connect multiple chips in a single package through integrated circuit substrates. In a post-Moore’s Law world, with the pace of improvements in chips slowing down, advanced packaging offers an alternative way to achieve more computing power and economic efficiency.

A report last week from the U.S. Commerce Department called for urgent action on semiconductors. But chips do not function on their own. Recent IPC studies have urged Congress to combine its investments in semiconductor manufacturing with additional support for advanced packaging, printed circuit boards (PCBs), and related technologies. Without such action, U.S.-made chips would still need to be sent offshore to be manufactured into finished products, leaving the U.S. vulnerable to supply chain shocks.

“We’re pleased to see Congress making progress on the bipartisan goal of re-establishing U.S. leadership in advanced electronics, which power everything from automobiles to medical devices, aircraft, smartphones, and beyond,” said IPC President and CEO John W. Mitchell. “This bill has the potential to begin rebuilding the U.S. electronics manufacturing ecosystem.”

Adds Chris Mitchell, IPC vice president of global government relations, “While the U.S. has allowed its domestic electronics industries to atrophy, America’s competitors have invested heavily in theirs. This legislation is an opportunity to put America on pace to rebuild this crucial industry, which is so vital to our future security and prosperity.”

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/27/2022 | Nolan Johnson, I-Connect007
I know I’m not alone in this behavior: Car advertisements during television commercial breaks are as good as invisible to me, until I’m thinking about getting a new car. Only then do I notice them. Rather, I see each one with all my attention and being. If that extends into our industry, then everybody must be itching to pick up some new equipment. This week’s must-reads includes a smattering of new product announcements, along with the news of the IPC European subsidiary.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.



Copyright © 2022 I-Connect007. All rights reserved.