Reading time ( words)
Your stackup is basically the heart of your design. Now, there's a great new eBook that answers all of your questions about designing the perfect stackup: "The Printed Circuit Designer's Guide to... Stackup Design," written by Bill Hargin of Z-zero.
In this IPC APEX EXPO interview, Happy Holden speaks with Bill about the importance of this topic and what readers can learn in his new book. Look for it in the I-007eBooks library.
Watch this interview below, or click here to view on our show page. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events, from ribbon cutting to teardown. Check out all of our interviews at Real Time With... IPC APEX EXPO.
I-Connect007 Editorial Team
In this interview, Saline Lectronics (an Emerald EMS company) President Jason Sciberras talks about PCB designers offering packaging options in the bill of materials. As Jason explains, mil/aero manufacturers like Saline can’t make many changes to a design without getting recertified, so including approved packaging options in the BOM from the start is a great way to go. Are you offering options in your BOM?
Andy Shaughnessy, Design007
Design engineer Sathishkumar Vijayakumar (aka Sathish Kumar V.) with Tessolve Semiconductor, India, took home top honors in this year’s IPC Design Competition, besting the other four finalists in a rigid-flex design showdown during IPC APEX EXPO. Unlike last year, no one finished the design completely, so judges graded competitors on what they did finish, as well as criteria such as design decisions they made, and whether they followed electrical and DFM rules.
Zachariah Peterson, NWES
As I look back on 2022, I’m realizing that my company plays multiple roles in client projects beyond just designing circuits and PCBs. Sure, we’re primarily a PCB design company, but we also help with things that happen outside the PCB. This includes tasks like enclosure design, defining mechanical constraints, simulating electrical behavior, mating boards into larger assemblies, selecting cabling, and defining test requirements, all of which slowly creep into the standard scope of work for design projects.