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The newer industry-standard SerDes protocols such as PCIe Gen6, USB4, and the 100G per-lane Ethernet and OIF/CEI standards offer an increasing challenge for PCB designers on multiple fronts. On the one hand, the speeds are approximately doubling for each generation. At the same time, the circuit board material used is often the same as the previous generations in order to keep costs down. To compensate for the increased loss at higher data rates, complex equalization techniques are employed.
From an IC design perspective, deciding what types of equalization circuits need to be incorporated in the transceivers design, has cost, power, and silicon area implications. From an EDA perspective, the large variety of compliance methods and ways to define equalization types along with their associated transfer functions and constraints leads to increased complexity of the analysis tools.
This Siemens paper will highlight some important aspects of the most popular interconnect specifications, with a focus on the reference equalizers.
To download this free white paper, click here.
Andy Shaughnessy, Design007 Magazine
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff. This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.
I-Connect007 Editorial Team
Altium keeps its eyes on the designers of the future. The company has been working with colleges and universities for years, providing free seats of Altium Designer for the next generation of PCB designers and design engineers. At IPC APEX EXPO 2023, Altium will be providing software for the finalists in the IPC Design Competition just as it did last year. They offer a variety of other educational programs as well, including Upverter classes and a design competition that aims to address environmental change. Here, Rea Callender, Altium’s VP of education, discusses its educational programs and plans for the week of the show.
Patrick Crawford, IPC
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.